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    • 9. 发明申请
    • CO-DEPOSITION OF CONDUCTIVE MATERIAL AT THE DIFFUSION MEDIA/PLATE INTERFACE
    • 导电材料在扩散介质/平板界面上的沉积
    • US20110189580A1
    • 2011-08-04
    • US12699968
    • 2010-02-04
    • Paul D. NicoteraChunxin JiThomas A. Trabold
    • Paul D. NicoteraChunxin JiThomas A. Trabold
    • H01M8/10H01M4/88
    • H01M4/88H01M8/10Y02E60/521
    • A method of depositing a conductive material is described. The method includes: providing a plate selected from anode plates, cathode plates, bipolar plates, or combinations thereof, wherein the plate includes gas flow channels; providing a diffusion media in contact with the gas flow channel side of the plate to form an assembly; introducing a gaseous precursor of the conductive material into the assembly using a chemical vapor infiltration process; infiltrating the gaseous precursor into the diffusion media and gas flow channels of the plates; and depositing a coating of the conductive material on the diffusion media, the gas flow channels of the plate, or both. An assembly having a CVI conductive coating and a fuel cell incorporating the diffusion media having the CVI conductive coating are also described.
    • 描述了一种沉积导电材料的方法。 该方法包括:提供从阳极板,阴极板,双极板或其组合中选择的板,其中板包括气体流动通道; 提供与板的气体流动通道侧接触的扩散介质以形成组件; 使用化学气相渗透方法将导电材料的气态前体引入组件; 将气态前体渗透到板的扩散介质和气体流动通道中; 以及将导电材料的涂层沉积在扩散介质,板的气体流动通道或两者上。 还描述了具有CVI导电涂层和掺入具有CVI导电涂层的扩散介质的燃料电池的组件。