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1. 发明申请

US20130335484A1 LASER WELDED BONDING PADS FOR PIEZOELECTRIC PRINT HEADS 有权
标题翻译：用于压电印刷头的激光焊接接头
公开(公告)号：US20130335484A1
公开(公告)日：2013-12-19
申请号：US13524791
申请日：2012-06-15
申请人： Bradley James GERNER , Peter J. NYSTROM , Bryan R. DOLAN
发明人： Bradley James GERNER , Peter J. NYSTROM , Bryan R. DOLAN
IPC分类号： B23K26/20 , B23K26/42 , B41J2/045
CPC分类号： B23K26/22 , B41J2/14233 , B41J2/14274 , B41J2/1607 , B41J2/161 , B41J2/1621 , B41J2/1623 , B41J2/1634 , H05K3/103 , Y10T29/42
摘要： An ink jet print head can be formed using a laser to melt a plating layer interposed between a piezoelectric actuator and a circuit layer bump. The plating layer can be formed on the circuit layer bump, the piezoelectric actuator, or both, and a laser beam output by the laser is used to melt the plating layer to provide a laser weld. In another embodiment, the circuit layer bump or the trace itself functions as the plating layer, which is melted using a laser to provide the laser weld.
摘要翻译：可以使用激光来形成喷墨打印头，以熔化介于压电致动器和电路层凸起之间的镀层。可以在电路层凸块，压电致动器或两者上形成镀层，并且使用由激光器输出的激光束来熔化镀层以提供激光焊接。在另一个实施例中，电路层凸起或迹线本身用作镀层，其使用激光熔化以提供激光焊接。

2. 发明申请

US20110175219A1 METHOD FOR MODULAR ARRANGEMENT OF A SILICON BASED ARRAY AND MODULAR SILICON BASED ARRAY 有权
标题翻译：基于硅的阵列和基于模块硅的阵列的模块化布置方法
公开(公告)号：US20110175219A1
公开(公告)日：2011-07-21
申请号：US12689910
申请日：2010-01-19
申请人： Mark A. CELLURA , Peter J. NYSTROM , Scott J. PHILLIPS , John P. MEYERS , Lyle G. DINGMAN , Bryan R. DOLAN
发明人： Mark A. CELLURA , Peter J. NYSTROM , Scott J. PHILLIPS , John P. MEYERS , Lyle G. DINGMAN , Bryan R. DOLAN
IPC分类号： H01L25/16 , H01L21/50
CPC分类号： H01L25/16 , H01L22/20 , H01L25/0655 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A silicon based module, including: a substrate; a first chip assembly fixed to the substrate, the first chip assembly including a first silicon chip and a first driver die having electrical circuitry; and a second chip assembly fixed to the substrate, the second chip assembly including a second silicon chip and a second driver die having electrical circuitry. Portions of the first and second chip assemblies are aligned in a longitudinal direction for the substrate; and portions of the first and second silicon chips are aligned in a width direction orthogonal to the longitudinal direction. Method for forming a silicon based module.
摘要翻译：一种硅基模块，包括：基板; 第一芯片组件，其固定到所述基板，所述第一芯片组件包括第一硅芯片和具有电路的第一驱动器芯片; 以及固定到所述基板的第二芯片组件，所述第二芯片组件包括第二硅芯片和具有电路的第二驱动器芯片。第一和第二芯片组件的部分在基板的纵向方向上排列; 并且所述第一和第二硅芯片的部分在与所述纵向正交的宽度方向上排列。硅基模块的形成方法。

3. 发明申请

US20110254897A1 SILICON INTERPOSER FOR MEMS SCALABLE PRINTING MODULES 有权
标题翻译：用于MEMS可扩展打印模块的硅插件
公开(公告)号：US20110254897A1
公开(公告)日：2011-10-20
申请号：US12763423
申请日：2010-04-20
申请人： Peter J. NYSTROM , Donald J. DRAKE
发明人： Peter J. NYSTROM , Donald J. DRAKE
IPC分类号： B41J2/135 , B41J2/16
CPC分类号： B41J2/14233 , B41J2/155 , B41J2202/19 , B41J2202/20
摘要： A print module and a method of forming the same, the print module including a substrate, an ink jet die, and an interposer between the substrate and the ink jet die. The substrate includes an ink channel and an air vent, and the die includes a plurality of ink apertures. The interposer includes etched openings therein of a truncated pyramid shape; the openings of the interposer reconfiguring the ink channel and air vent passages between the substrate and die to allow for greater tolerance in alignment and manufacture of the print head module.
摘要翻译：打印模块及其形成方法，所述打印模块包括基板，喷墨模头和所述基板与所述喷墨模具之间的插入件。基板包括油墨通道和通气口，并且模具包括多个油墨孔。插入器包括其中具有截头棱锥形状的蚀刻开口; 插入器的开口重新配置墨水通道和在基板和模具之间的排气通道，以允许在打印头模块的对准和制造中具有更大的公差。

4. 发明申请

US20140022320A1 MULTIPLE LAYER FILTER 有权
标题翻译：多层过滤器
公开(公告)号：US20140022320A1
公开(公告)日：2014-01-23
申请号：US13554676
申请日：2012-07-20
申请人： Andrew W. HAYS , Jun MA , Peter J. NYSTROM , Bradley J. GERNER
发明人： Andrew W. HAYS , Jun MA , Peter J. NYSTROM , Bradley J. GERNER
IPC分类号： B41J2/175 , B23P11/00 , B21D53/76 , B01D29/50
CPC分类号： B41J2/17563
摘要： A structure and method including a filter assembly, wherein the structure can be an ink jet printhead including the filter assembly. The filter assembly can include a first filter layer having a plurality of pores therein, wherein the pores have a first pitch, and a second filter layer having a plurality of pores therein, wherein the pores in the second filter layer have a second pitch which is different than the first pitch. The structure can include a fluid path through the filter assembly. An area of overlap of the pores in the first filter layer with the pores in the second filter layer, in a vertical direction perpendicular to a plane of the filter assembly, can include a periodicity.
摘要翻译：一种包括过滤器组件的结构和方法，其中该结构可以是包括过滤器组件的喷墨打印头。过滤器组件可以包括其中具有多个孔的第一过滤层，其中孔具有第一间距，以及在其中具有多个孔的第二过滤层，其中第二过滤层中的孔具有第二沥青，不同于第一音调。该结构可以包括通过过滤器组件的流体路径。第一过滤层中的孔与第二过滤层中的孔在垂直于过滤器组件的平面的垂直方向上的重叠区域可以包括周期性。

5. 发明申请

US20090289994A1 MAINTAINABLE COPLANAR FRONT FACE FOR SILICON DIE ARRAY PRINTHEAD 有权
标题翻译：可维护的面板用于硅胶片阵列
公开(公告)号：US20090289994A1
公开(公告)日：2009-11-26
申请号：US12536196
申请日：2009-08-05
申请人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
发明人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J2/165 , B41J2/155
CPC分类号： B41J2/155 , B41J2202/19 , B41J2202/20 , Y10T29/49346 , Y10T29/49885 , Y10T156/1089
摘要： A full width array printhead is provided having a continuous maintainable printhead surface and method of forming the same. The printhead includes a substrate and an array of die modules mounted thereon with a front face of each die module exposed. A hardened fill material surrounds the array of die modules to define a continuous surface coplanar with the front face of the array of die modules.
摘要翻译：提供了具有连续可维护的打印头表面的全宽度阵列打印头及其形成方法。打印头包括基板和安装在其上的模具模块阵列，每个模块模块的正面暴露。硬化的填充材料围绕模具模块阵列以限定与模具阵列阵列的前表面共面的连续表面。

6. 发明申请

US20090014413A1 SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT 失效
标题翻译：自对准的精确定位系统用于阵列放置
公开(公告)号：US20090014413A1
公开(公告)日：2009-01-15
申请号：US11777475
申请日：2007-07-13
申请人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
发明人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
IPC分类号： G11B5/127 , B41J2/145
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.
摘要翻译：本文描述了一种用于在包括更大的部分宽度阵列和全页宽度阵列的成像阵列中精确地定位管芯模块阵列的方法和所得到的装置。该方法包括直接在单个硅模块上形成物理参考数据，并将各个模具模块定位在临时固定器上。临时保持器包括对准工具，并且通过将物理基准原件抵靠对准工具而将单个模具放置在临时保持器上。真空暂时固定定位在临时保持器上的模具，然后将永久基板附接到临时保持器的模具。临时保持器被释放，有利于其上具有精确对准的模具模块的永久基板。

7. 发明申请

US20100238227A1 PRINTHEAD DE-PRIME SYSTEM AND METHOD FOR SOLID INK SYSTEMS 失效
公开(公告)号：US20100238227A1
公开(公告)日：2010-09-23
申请号：US12405404
申请日：2009-03-17
申请人： Peter J. NYSTROM , Andrew W. HAYS , Scott J. PHILLIPS
发明人： Peter J. NYSTROM , Andrew W. HAYS , Scott J. PHILLIPS
IPC分类号： B41J29/393
CPC分类号： B41J2/17593 , B41J2/16526 , B41J2/1721 , B41J2/17596 , B41J2/185
摘要： A system and method to provide pressure to de-prime a printhead. An image forming device comprises an ink reservoir that contains ink and provides the ink to a printhead. When a fault condition is detected that indicates a likelihood of a solidifying of the ink, the printhead is de-primed by applying pressure to the printhead to purge the ink from the printhead. The fault condition comprises any of a loss of power, a power-down process, or a printhead temperature being less than or equal to a threshold temperature.
摘要翻译：一种提供压力以去除打印头的系统和方法。图像形成装置包括含有油墨并将油墨提供给打印头的储墨器。当检测到指示墨水凝固的可能性的故障状况时，通过向打印头施加压力以从打印头清除墨水来打印头去除墨粉。故障状况包括功率损失，断电过程或打印头温度小于或等于阈值温度的任何一种。

8. 发明申请

US20090201328A1 SELF-ALIGNED PRECISION DATUMS FOR ARRAY DIE PLACEMENT 失效
公开(公告)号：US20090201328A1
公开(公告)日：2009-08-13
申请号：US12422532
申请日：2009-04-13
申请人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
发明人： Peter J. NYSTROM , Peter M. Gulvin , John P. Meyers
IPC分类号： B41J29/38
CPC分类号： B41J2/16 , B41J2/1623 , B41J2/1626 , B41J2/1631 , B41J2/1632 , B41J2202/20
摘要： A method and resulting device for accurately positioning an array of die modules in an imaging array, including larger partial width arrays and full page width arrays, is described herein. The method includes forming physical reference datum directly on an individual silicon die module, and positioning the individual die modules on a temporary holder. The temporary holder includes an alignment tool and singulated die are placed onto the temporary holder by abutting the physical reference datum against the alignment tool. A vacuum temporarily secures the die positioned on the temporary holder, and a permanent substrate is then attached to the die of the temporary holder. The temporary holder is released in favor of the permanent substrate having the accurately aligned die modules thereon.

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