会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Thermal management apparatus and method for printed circuit boards
    • 印刷电路板的热管理装置和方法
    • US07450381B2
    • 2008-11-11
    • US11566277
    • 2006-12-04
    • Don A. GillilandCary M. HuettnerDennis J. Wurth
    • Don A. GillilandCary M. HuettnerDennis J. Wurth
    • H05K7/20
    • H05K7/20154
    • An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators. The contour controller adjusts the relative positions of the extensible ends in accordance with thermal conditions proximate to the PCB.
    • 一种用于管理印刷电路板(PCB)外壳内的冷却的设备,系统和方法。 该系统包括具有其上安装电子部件的第一表面的PCB。 多个轮廓控制致动器固定地设置在与PCB的第一表面相对的z轴上的基本上平面的阵列中。 每个轮廓控制致动器具有可延伸的端部,该可伸长端部与机械可延伸地平行于与PCB的第一表面垂直的z轴。 在轮廓控制致动器的可延伸端和PCB的第一表面之间设置基本上柔性的片状构件。 可伸展的端部接触柔性片构件,使得柔性片构件的z轴轮廓由可延伸端的z轴位置决定。 轮廓控制器通过调整一个或多个轮廓控制致动器的可延伸端的相对位置来调节柔性片材的z轴轮廓。 轮廓控制器根据靠近PCB的热条件调节可扩展端的相对位置。
    • 3. 发明申请
    • THERMAL MANAGEMENT APPARATUS AND METHOD FOR PRINTED CIRCUIT BOARDS
    • 印刷电路板的热管理装置和方法
    • US20080130225A1
    • 2008-06-05
    • US11566277
    • 2006-12-04
    • Don A. GillilandCary M. HuettnerDennis J. Wurth
    • Don A. GillilandCary M. HuettnerDennis J. Wurth
    • H05K7/20
    • H05K7/20154
    • An apparatus, system, and method for managing cooling within a printed circuit board (PCB) enclosure. The system includes a PCB having a first surface on which electronic components are mounted. Multiple contour control actuators are fixedly disposed in a substantially planar array in z-axis opposition to the first surface of the PCB. Each of the contour control actuators has an extensible end that is electromechanically extendable in parallel with the z-axis normal to the first surface of the PCB. A substantially flexible sheet member is disposed between the extensible ends of the contour control actuators and the first surface of the PCB. The extensible ends contact the flexible sheet member such that the z-axis contour of the flexible sheet member is determined by the z-axis positions of the extensible ends. A contour controller adjusts the z-axis contour of the flexible sheet member by adjusting the relative positions of the extensible ends of one or more of the contour control actuators. The contour controller adjusts the relative positions of the extensible ends in accordance with thermal conditions proximate to the PCB.
    • 一种用于管理印刷电路板(PCB)外壳内的冷却的设备,系统和方法。 该系统包括具有其上安装电子部件的第一表面的PCB。 多个轮廓控制致动器固定地设置在与PCB的第一表面相对的z轴上的基本上平面的阵列中。 每个轮廓控制致动器具有可延伸的端部,该可伸长端部与机械可延伸地平行于与PCB的第一表面垂直的z轴。 在轮廓控制致动器的可延伸端和PCB的第一表面之间设置基本上柔性的片状构件。 可伸展的端部接触柔性片构件,使得柔性片构件的z轴轮廓由可延伸端的z轴位置决定。 轮廓控制器通过调整一个或多个轮廓控制致动器的可延伸端的相对位置来调节柔性片材的z轴轮廓。 轮廓控制器根据靠近PCB的热条件调节可扩展端的相对位置。
    • 4. 发明申请
    • TEMPERATURE CONTROL SYSTEM FOR AN ELECTRONIC DEVICE CABINET
    • 电子装置柜温度控制系统
    • US20100226090A1
    • 2010-09-09
    • US12397105
    • 2009-03-03
    • Don A. GillilandCary M. HuettnerMax J. C. Koschmeder
    • Don A. GillilandCary M. HuettnerMax J. C. Koschmeder
    • H05K7/20
    • H05K7/20836H05K7/20736
    • An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.
    • 电子设备柜包括第一温度控制系统,其定位成将经调节的气流引导到机柜的第一电子设备存储区域中;以及第二温度控制系统,其定位成将经调节的气流引导到机柜的第二电子设备存储区域中。 第一温度控制系统包括具有压缩空气入口的第一多个涡流管和将冷却空气引导到第一设备存储区的第一冷却空气出口。 第二温度控制系统包括具有压缩空气入口的第二多个涡流管和将冷却空气引导到第二装置存储区的第二冷却空气出口。 控制器在感测到对第一和第二电子设备存储区域中的冷却需求时,选择性地将压缩空气输送到第一和第二温度控制系统中的相应温度控制系统。
    • 5. 发明授权
    • Temperature control system for an electronic device cabinet
    • 电子机柜温度控制系统
    • US08186174B2
    • 2012-05-29
    • US12397105
    • 2009-03-03
    • Don A. GillilandCary M. HuettnerMax J. C. Koschmeder
    • Don A. GillilandCary M. HuettnerMax J. C. Koschmeder
    • F25D23/12F25B27/00F25B9/02F28D15/00H05K7/20
    • H05K7/20836H05K7/20736
    • An electronic device cabinet includes a first temperature control system positioned to direct a conditioned airflow into a first electronic device storage zone of the cabinet and a second temperature control system positioned to direct a conditioned airflow into a second electronic device storage zone of the cabinet. The first temperature control system includes a first plurality of vortex tubes having a compressed air inlet and a first cooling air outlet that guides cooling air into the first device storage zone. The second temperature control system includes a second plurality of vortex tubes having a compressed air inlet and a second cooling air outlet that guides cooling air into the second device storage zone. A controller selectively delivers compressed air to respective ones of the first and second temperature control systems upon sensing a demand for cooling in corresponding ones of the first and second electronic device storage zones.
    • 电子设备柜包括第一温度控制系统,其定位成将经调节的气流引导到机柜的第一电子设备存储区域中;以及第二温度控制系统,其定位成将经调节的气流引导到机柜的第二电子设备存储区域中。 第一温度控制系统包括具有压缩空气入口的第一多个涡流管和将冷却空气引导到第一设备存储区的第一冷却空气出口。 第二温度控制系统包括具有压缩空气入口的第二多个涡流管和将冷却空气引导到第二装置存储区的第二冷却空气出口。 控制器在感测到对第一和第二电子设备存储区域中的冷却需求时,选择性地将压缩空气输送到第一和第二温度控制系统中的相应温度控制系统。
    • 8. 发明申请
    • Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack
    • 用于从计算机机架散热热负荷的热传递系统
    • US20070291452A1
    • 2007-12-20
    • US11424045
    • 2006-06-14
    • Don A. GillilandCary M. Huettner
    • Don A. GillilandCary M. Huettner
    • H05K7/20
    • H05K7/20781
    • Heat transfer systems for dissipating thermal loads from a computer rack are disclosed that include: an expandable heat transfer bus extending along the rack, the expandable heat transfer bus capable of passing a thermal transport; one or more heat sinks connected to the expandable heat transfer bus, each heat sink capable of receiving the thermal transport from the bus and returning the thermal transport to the bus, and each heat sink capable of transferring into the thermal transport a thermal load from an electronic component inside a rack module mounted to the rack; and a heat exchanger connected to the expandable heat transfer bus capable of dissipating the thermal load of the thermal transport.
    • 公开了用于从计算机机架散发热负荷的热传递系统,其包括:沿着机架延伸的可扩展热传递总线,能够通过热传输的可扩展热传输总线; 连接到可扩展传热总线的一个或多个散热器,每个散热器能够接收来自总线的热传输并将热传输返回到总线,并且每个散热器能够将热传递到热传输 安装在机架上的机架模块内的电子部件; 以及连接到可扩展传热总线的热交换器,其能够消散热传输的热负荷。
    • 10. 发明申请
    • HEAT SINKS FOR DISSIPATING A THERMAL LOAD
    • 用于消除热负荷的散热器
    • US20080029244A1
    • 2008-02-07
    • US11461921
    • 2006-08-02
    • Don A. GillilandCary M. Huettner
    • Don A. GillilandCary M. Huettner
    • H05K7/20
    • H01L23/473H01L2924/0002H01L2924/00
    • Heat sinks for dissipating a thermal load are disclosed that include a heat sink base having a thermal base channel inside the heat sink base, the heat sink base capable of receiving a thermal load from a thermal source, heat-dissipating fins mounted on the heat sink base, each heat-dissipating fin having a thermal fin channel inside the heat-dissipating fin, and a thermal transport within the thermal base channel and the thermal fin channel, the thermal transport capable of transferring the thermal load from the heat sink base to the heat-dissipating fins. Methods for parallel dissipation of a thermal load are disclosed that include receiving, in a heat sink base, a thermal load from a thermal source, transferring the thermal load to heat-dissipating fins mounted on the heat sink base through a conductive heat path, and transferring the thermal load to the heat-dissipating fins through a convective heat path.
    • 公开了用于耗散热负载的散热器,其包括散热器基座,该散热器基座具有散热器基座内部的热基底通道,散热器基座能够接收来自热源的热负荷,散热片安装在散热片 每个散热翅片在散热片内部具有散热鳍片通道,热基底通道和散热鳍片通道内的热传输,能够将热负荷从散热器底座传递到 散热片 公开了用于并联耗散热负荷的方法,其包括在散热器基座中接收来自热源的热负荷,通过导热热路将热负载传送到安装在散热器基座上的散热片,以及 通过对流热路将热负荷转移到散热片。