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    • 3. 发明申请
    • ELECTROCHEMICAL ETCHING PROCESS
    • 电化学蚀刻工艺
    • US20020137348A1
    • 2002-09-26
    • US09817729
    • 2001-03-26
    • Boston MicroSystems, Inc.
    • Richard Mlcak
    • H01L021/311
    • H01L21/3063
    • A method of electrochemically etching a device, including forming a semiconductor substrate having a p-type semiconductor region on an n-type semiconductor region. A discrete semiconductor region is formed on the p-type semiconductor region and is isolated from the n-type semiconductor region. The n-type semiconductor region is exposed to an electrolyte with an electrical bias applied between the n-type semiconductor region and the electrolyte. The n-type semiconductor region is also exposed to radiation having energy sufficient to excite electron-hole pairs. In addition, a p-n junction reverse bias is applied between the p-type semiconductor region and the n-type semiconductor region to prevent the p-type semiconductor region and the discrete semiconductor region from etching while portions of the n-type semiconductor region exposed to the electrolyte and the radiation are etched.
    • 一种电化学蚀刻器件的方法,包括在n型半导体区域上形成具有p型半导体区域的半导体衬底。 离散半导体区域形成在p型半导体区域上并与n型半导体区域隔离。 n型半导体区域暴露于在n型半导体区域和电解质之间施加电偏压的电解质。 n型半导体区域也暴露于具有足以激发电子 - 空穴对的能量的辐射。 此外,在p型半导体区域和n型半导体区域之间施加pn结反向偏压,以防止p型半导体区域和离散半导体区域被蚀刻,同时n型半导体区域的部分暴露于 电解质和辐射被蚀刻。