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1. 发明授权

US06905964B2 Method of fabricating self-aligned metal barriers by atomic layer deposition on the copper layer 有权
标题翻译：通过原子层沉积在铜层上制造自对准金属屏障的方法
公开(公告)号：US06905964B2
公开(公告)日：2005-06-14
申请号：US10339185
申请日：2003-01-09
申请人： Boon Kiat Lim , Alex See
发明人： Boon Kiat Lim , Alex See
IPC分类号： H01L21/285 , H01L21/44 , H01L21/4763 , H01L21/768
CPC分类号： H01L21/76849 , H01L21/28562
摘要： An improved and new process for fabricating self-aligned metal barriers by atomic layer deposition, ALD, capable of producing extremely thin, uniform, and conformal metal barrier films, selectively depositing on copper, not on silicon dioxide interlevel dielectric, in multi-layer dual damascene trench/via processing. Silicon nitride is presently used as a insulating copper barrier. However, silicon nitride has a relatively high dielectric constraint, which deteriorates ICs with increased RC delay. Copper metal barriers of niobium and tantalum have been deposited by atomic layer deposition on copper. With high deposition selectivity, the barrier metal is only deposited over copper, not on silicon dioxide, which eliminates the need of an insulating barrier of silicon nitride.
摘要翻译：一种通过原子层沉积制造自对准金属屏障的改进和新工艺，ALD能够生产极薄，均匀和保形的金属阻挡膜，选择性地沉积在铜上，而不是在二氧化硅层间电介质上沉积在多层双层大马士革沟/通孔加工。氮化硅目前被用作绝缘铜屏障。然而，氮化硅具有相对较高的介电约束，其使具有增加的RC延迟的IC劣化。铌和钽的铜金属屏障已经通过原子层沉积沉积在铜上。具有高的沉积选择性，阻挡金属仅沉积在铜上，而不是在二氧化硅上沉积，这消除了氮化硅的绝缘势垒的需要。

2. 发明授权

US08496511B2 Cathodically-protected pad conditioner and method of use 有权
标题翻译：阴极保护垫调节剂和使用方法
公开(公告)号：US08496511B2
公开(公告)日：2013-07-30
申请号：US12837055
申请日：2010-07-15
申请人： Vincent J. Laraia , Boon Kiat Lim
发明人： Vincent J. Laraia , Boon Kiat Lim
IPC分类号： B24B1/00 , B24B53/00
CPC分类号： B24B53/001 , B24B53/017
摘要： A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.
摘要翻译：用于化学机械平面化的阴极保护垫调节器包括：研磨构件，包括金属基底，支撑载体和固定到支撑载体周边的阳极。阴极保护电路被配置为如果与电解质溶液接触则提供阴极保护电流从阳极到磨料构件。还公开了使用阴极保护垫调节剂的方法。

3. 发明授权

US09321254B2 Article and method of making and using the same 有权
标题翻译：制作和使用的条款和方法
公开(公告)号：US09321254B2
公开(公告)日：2016-04-26
申请号：US13880820
申请日：2011-12-02
申请人： Arokiaraj Jesudoss , Ranjith Divigalpitiya , Gary A. Korba , Boon Kiat Lim , Melvin T. Zin
发明人： Arokiaraj Jesudoss , Ranjith Divigalpitiya , Gary A. Korba , Boon Kiat Lim , Melvin T. Zin
IPC分类号： C23C26/00 , B41C1/00 , B41J2/005 , B82Y40/00 , C01B31/04 , B82Y30/00
CPC分类号： B41J2/0057 , B41C1/00 , B41J2/005 , B82Y30/00 , B82Y40/00 , C01B32/194 , Y10T428/24802
摘要： Article having a first single, discrete atomic, dry layer of a first weakly bonded crystalline material on at least a surface of a substrate. Embodiments of the articles are useful, for example, in automotive under-the-hood parts exposed to chemicals and extreme temperatures.
摘要翻译：第一种在基底的至少一个表面上具有第一弱结合结晶材料的第一单独离散原子干层。制品的实施例例如在暴露于化学品和极端温度的汽车底漆部件中是有用的。

4. 发明申请

US20120015589A1 CATHODICALLY-PROTECTED PAD CONDITIONER AND METHOD OF USE 有权
标题翻译：阴极保护垫片调节器及其使用方法
公开(公告)号：US20120015589A1
公开(公告)日：2012-01-19
申请号：US12837055
申请日：2010-07-15
申请人： Vincent J. Laraia , Boon Kiat Lim
发明人： Vincent J. Laraia , Boon Kiat Lim
IPC分类号： B24B53/02
CPC分类号： B24B53/001 , B24B53/017
摘要： A cathodically-protected pad conditioner for chemical mechanical planarization includes: an abrasive member including a metallic substrate, a support carrier, and an anode affixed to the peripheral edge of the support carrier. A cathodic protection circuit is configured to provide a cathodic protection current from the anode to the abrasive member if contacted with an electrolyte solution. A method of using the cathodically-protected pad conditioner is also disclosed.
摘要翻译：用于化学机械平面化的阴极保护垫调节器包括：研磨构件，包括金属基底，支撑载体和固定到支撑载体周边的阳极。阴极保护电路被配置为如果与电解质溶液接触则提供阴极保护电流从阳极到磨料构件。还公开了使用阴极保护垫调节剂的方法。

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