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JP2007173785A Equipment and method for slurry cleaning etching chamber 有权
标题翻译：浆液清洗室的设备和方法
公开(公告)号：JP2007173785A
公开(公告)日：2007-07-05
申请号：JP2006307392
申请日：2006-11-14
申请人： Boc Group Inc:The , ザ・ビーオーシー・グループ・インコーポレーテッドThe Boc Group Incorporated
发明人： DAVIS IAN MARTIN , LAUBE DAVID P
IPC分类号： H01L21/304
CPC分类号： B24C5/04 , B24C3/325 , B24C7/0038 , B24C11/005 , H01L21/67051
摘要： PROBLEM TO BE SOLVED: To provide cleaning equipment and a method for removing debrisments effectively from a surface of semiconductor etching chamber.
SOLUTION: The equipment has an atomization head 22 which includes an entrance port 4 of atomized flow object, an entrance port 6 of abrasive slurry, and an exit port 8 of atomized abrasive slurry. However, in an aspect 200, an internal flow-passage includes a convergence-emission nozzles 24, 28 and a throat portion 26 profiled in more streamline. The throat portion 26 in this aspect includes an inlet hole or opening 16 for the abrasive slurry. The abrasive slurry is introduced in the throat portion 26 by a negative pressure generated by a flow of flowing fluid. The abrasive slurry can be pulled out from one or more abrasive slurry containers 20, and the head 22 can be equipped with one or more fluid connections to one or more flowing fluid supply sources 18.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供从半导体蚀刻室的表面有效地去除碎屑的清洁设备和方法。解决方案：设备具有雾化头22，雾化头22包括雾化流动物体的入口4，磨料浆料的入口6和雾化磨料浆料的出口8。然而，在一方面200中，内部流动通道包括会聚发射喷嘴24,28和更流线形成的喉部26。在该方面，喉部26包括用于磨料浆料的入口孔或开口16。研磨浆料由流动的流体流产生的负压引入到喉部26中。研磨浆料可以从一个或多个磨料浆料容器20中拉出，并且头部22可配备有一个或多个流体连接到一个或多个流动的流体供应源18.版权所有（C）2007，JPO＆INPIT

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