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1. 发明授权

US6115262A Enhanced mounting pads for printed circuit boards 失效
公开(公告)号：US6115262A
公开(公告)日：2000-09-05
申请号：US93025
申请日：1998-06-08
申请人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： H05K1/11 , H05K3/34 , H05K1/18 , H05K7/06
CPC分类号： H05K3/3442 , H05K1/111 , H05K2201/09381 , H05K2201/0939 , H05K2201/10636 , H05K2203/0465 , H05K3/3484 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

2. 发明授权

US06405920B1 Enhanced mounting pads for printed circuit boards 失效
标题翻译：增强印刷电路板安装垫
公开(公告)号：US06405920B1
公开(公告)日：2002-06-18
申请号：US09614830
申请日：2000-07-12
申请人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
发明人： Bjoern Erik Brunner , Vivek Amir Jairazbhoy , Richard Keith McMillan
IPC分类号： B23K3102
CPC分类号： H05K3/3442 , H05K1/111 , H05K3/3484 , H05K2201/09381 , H05K2201/0939 , H05K2201/10636 , H05K2203/0465 , Y02P70/611 , Y02P70/613
摘要： There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.
摘要翻译：这里公开了一种印刷电路板（PCB），其具有用于套印锡膏和修补焊点的增强安装垫。 PCB包括：电介质基板10，其上具有至少一个安装垫20，其中每个安装垫以与电子部件30的相应端子32相配的关系布置。每个安装垫20包括主体部分24和一个或更多的手指状的延伸部分26从主体部分向外延伸并且远离电子部件的投影足迹34。

3. 发明授权

US08158924B2 Optical encoder assembly with a flexible beam 有权
标题翻译：具有柔性梁的光学编码器组件
公开(公告)号：US08158924B2
公开(公告)日：2012-04-17
申请号：US12248538
申请日：2008-10-09
申请人： Bjoern Erik Brunner , David D. Martenson
发明人： Bjoern Erik Brunner , David D. Martenson
IPC分类号： G01D5/34
CPC分类号： G01D5/24423
摘要： An optical encoder assembly has an encoder sensor, a code strip, and a base having a first portion and a second portion, wherein the encoder sensor is mounted on one of either the first portion or the second portion and the code strip is mounted on the other portion. An optical encoder assembly has a base having an upper base and a lower base, the upper base joined to the lower base with at least one flexible beam, an encoder sensor mounted to one of the upper base or the lower base, and a code strip mounted to the other of the upper base or the lower base. A method includes mounting an encoder sensor to a first mating surface on the first side of a base, mounting a code strip to a second mating surface on the second side of the base with the first and second sides of the base connected by at least one flexible beam, and attaching the base to an object to be measured such that deflections between the first and second mating surfaces can be measured using the encoder sensor.
摘要翻译：光学编码器组件具有编码器传感器，编码条和具有第一部分和第二部分的基座，其中编码器传感器安装在第一部分或第二部分中的一个上，并且编码条安装在其他部分。光学编码器组件具有底座，其具有上基座和下基座，所述上基座具有至少一个柔性梁连接到下基座，编码器传感器安装到上基座或下基座之一，以及编码条安装到上基座或下基座中的另一个。一种方法包括将编码器传感器安装到基座的第一侧上的第一配合表面上，将码带安装到基座的第二侧上的第二配合表面，基座的第一和第二侧通过至少一个柔性梁，并将基座附接到待测量的物体，使得可以使用编码器传感器测量第一和第二配合表面之间的偏转。

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