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    • 2. 发明授权
    • Circuit for driving LED display
    • LED显示屏驱动电路
    • US07138995B2
    • 2006-11-21
    • US10795310
    • 2004-03-09
    • Bily WangJohn Lin
    • Bily WangJohn Lin
    • G09G5/00G09G3/10
    • G09G3/32G09G2300/06G09G2310/0205G09G2310/0272
    • A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.
    • 用于驱动发光二极管(LED)显示器的电路具有多种驱动模式。 电路具有用于输出模式切换信号的控制单元,与用于提供扫描信号的控制单元连接的扫描驱动芯片,与控制单元连接的数据驱动芯片和用于提供数据信号的扫描驱动芯片, 与行线连接的行控制接口,控制单元,扫描驱动芯片和数据驱动芯片,以接收用于切换行控制接口的输入端的模式切换信号,以及与列线连接的列控制接口 ,控制单元,扫描驱动芯片和数据驱动芯片,以接收用于切换列控制接口的输入端的模式切换信号。
    • 5. 发明申请
    • Photoelectric chip array package structure
    • 光电芯片阵列封装结构
    • US20060251355A1
    • 2006-11-09
    • US11416163
    • 2006-05-03
    • Bily WangJohn Lin
    • Bily WangJohn Lin
    • G02B6/12
    • G09F9/33F21K9/00H01L2224/97
    • A photoelectric chip array package structure is convenient for chip installation and prevents external light interference. The photoelectric chip array package structure of the present invention has a substrate, multiple photoelectric chips, a package structure, and multiple contacts. It can be applied for advertising signs and improve the defect-free ratio and packaging quality. When applied for packaging light-emitting diodes (LEDs) or optical sensors, it easily meets the packaging requirements of electronic chips. The present invention disposes contacts at one side or multiple predetermined sides of the substrate to improve airtightness and convenience for installation. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference. Thus, the package structure of the present invention is superior to conventional package structures, and is cheap.
    • 光电芯片阵列封装结构方便芯片安装,防止外部光干扰。 本发明的光电芯片阵列封装结构具有基板,多个光电芯片,封装结构和多个触点。 可广泛应用于广告招牌,提高无缺陷率和包装质量。 当应用于包装发光二极管(LED)或光学传感器时,它很容易满足电子芯片的包装要求。 本发明在基板的一侧或多个预定侧配置触点,以提高气密性和便于安装。 此外,本发明还配置外部框架或光栅以防止外部光干扰。 因此,本发明的封装结构优于常规的封装结构,并且便宜。
    • 6. 发明申请
    • Drive circuit of LCD and method for the same
    • LCD驱动电路及方法相同
    • US20060250343A1
    • 2006-11-09
    • US11416162
    • 2006-05-03
    • Bily WangJohn Lin
    • Bily WangJohn Lin
    • G09G3/36
    • G09G3/3659G09G3/3648G09G3/3677G09G2300/0842
    • A drive circuit of display and method for the same are described. Each drive circuit in an LCD panel is sequentially controlled by scanning signals so as to store temporarily a frame of image data in each storage capacitor. Then, a synchronization drive element in each drive circuit receives a synchronization control signal, so that a frame of each storage capacitor may be meanwhile sent to light-emitting units for achievement of the synchronization display on the LCD panel. Besides, a discharge transistor may be added and is controlled by a discharge signal before the synchronization drive element turns ON, which may effectively eliminate a pre-frame on the LCD panel.
    • 描述了显示器的驱动电路及其方法。 LCD面板中的每个驱动电路由扫描信号依次控制,从而临时存储每个存储电容器中的一帧图像数据。 然后,每个驱动电路中的同步驱动元件接收同步控制信号,从而可以将每个存储电容器的帧同时发送到用于实现LCD面板上的同步显示的发光单元。 此外,可以在同步驱动元件导通之前添加放电晶体管并由放电信号控制,这可以有效地消除LCD面板上的预帧。
    • 7. 发明申请
    • Method for manufacturing photoelectric package having control chip
    • 具有控制芯片的光电封装制造方法
    • US20060252173A1
    • 2006-11-09
    • US11416161
    • 2006-05-03
    • Bily WangJohn LinShih-Yu Wu
    • Bily WangJohn LinShih-Yu Wu
    • H01L21/00
    • H01L25/167H01L2224/48091H01L2224/48227H01L2224/49175H01L2924/01322H01L2924/00014H01L2924/00
    • A manufacturing method for a photoelectric package structure having a control chip is proposed. The photoelectric package structure concentrates light emitted therefrom, prevents external light interference and can be applied for advertising signs and backlight modules. Using the present invention increases the defect-free ratio and production quality. Applying the present invention for packaging light-emitting diode (LED) or optical sensor chips allows the necessary light-emitting requirements of electronic chips to be easily met. The package structure of the present invention is superior to conventional ones and the installation of the control chip doesn't reduce the light-emitting intensity. The major innovation of the present invention is disposing a photoelectric chip (or multiple photoelectric chips) on a control chip and then installing the control chip upon a substrate. Thus, installation-of the components is more convenient. Furthermore, an external frame or optical gratings can also be included to prevent external light interference.
    • 提出了一种具有控制芯片的光电封装结构的制造方法。 光电封装结构集中从其发出的光,防止外部光线干扰,并可应用于广告标牌和背光模块。 使用本发明增加了无缺陷比和生产质量。 应用本发明用于封装发光二极管(LED)或光学传感器芯片允许容易地满足电子芯片的必要的发光要求。 本发明的封装结构优于常规封装结构,并且控制芯片的安装不会降低发光强度。 本发明的主要创新是在控制芯片上设置光电芯片(或多个光电芯片),然后将控制芯片安装在基板上。 因此,组件的安装更方便。 此外,还可以包括外部框架或光栅以防止外部光线干扰。
    • 8. 发明申请
    • Circuit for driving LED display
    • LED显示屏驱动电路
    • US20050200577A1
    • 2005-09-15
    • US10795310
    • 2004-03-09
    • Bily WangJohn Lin
    • Bily WangJohn Lin
    • G09G3/32
    • G09G3/32G09G2300/06G09G2310/0205G09G2310/0272
    • A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.
    • 用于驱动发光二极管(LED)显示器的电路具有多种驱动模式。 电路具有用于输出模式切换信号的控制单元,与用于提供扫描信号的控制单元连接的扫描驱动芯片,与控制单元连接的数据驱动芯片和用于提供数据信号的扫描驱动芯片, 与行线连接的行控制接口,控制单元,扫描驱动芯片和数据驱动芯片,以接收用于切换行控制接口的输入端的模式切换信号,以及与列线连接的列控制接口 ,控制单元,扫描驱动芯片和数据驱动芯片,以接收用于切换列控制接口的输入端的模式切换信号。
    • 9. 发明申请
    • Manufacturing method for photoelectric package structure having two-layered substrate and control chip
    • 具有双层基板和控制芯片的光电封装结构的制造方法
    • US20060249656A1
    • 2006-11-09
    • US11416156
    • 2006-05-03
    • Bily WangJohn LinShih-Yu Wu
    • Bily WangJohn LinShih-Yu Wu
    • H01L27/00
    • H01L31/0203H01L25/167H01L2224/48227H01L2924/01322H01L2224/48091H01L2924/00014H01L2924/00
    • A manufacturing method for a photoelectric package structure having a two-layered substrate and a control chip is proposed. The photoelectric package structure provided in the present invention is easy for installing chips and concentrates light emitted therefrom and prevents external light interference. The package structure of the present invention is superior to the conventional ones and the installation of the control chip doesn t degrade the light-emitting intensity. The major innovation of the present invention is disposing a control chip and a photoelectric chip (or multiple photoelectric chips) on the front surfaces of two semi-finished substrates respectively and then combining with the rear surfaces of the semi-finished substrates to form a substrate. Thus, the present invention is more convenient for installing the chips. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference.
    • 提出了具有双层基板和控制芯片的光电封装结构的制造方法。 本发明提供的光电封装结构容易安装芯片并集中从其发射的光并防止外部光干扰。 本发明的封装结构优于传统的封装结构,并且控制芯片的安装不会降低发光强度。 本发明的主要创新之处在于分别在两个半成品基板的前表面上配置控制芯片和光电芯片(或多个光电芯片),然后与半成品基板的后表面组合形成基板 。 因此,本发明对于安装芯片更为方便。 此外,本发明还配置外部框架或光栅以防止外部光干扰。