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    • 1. 发明授权
    • Apparatus for measuring the static parameters of integrated circuits
    • 用于测量集成电路静态参数的装置
    • US07256603B1
    • 2007-08-14
    • US11475147
    • 2006-06-27
    • Bily WangChung-Ho ChenKuei-Pao Chen
    • Bily WangChung-Ho ChenKuei-Pao Chen
    • G01R31/26
    • G01R1/36G01R31/3004G01R31/31924
    • An apparatus for measuring the static parameters of integrated circuit is disclosed. When the apparatus is operated, the output mode is determined automatically according to the load of the integrated circuit. When the apparatus is operated in voltage output mode, the apparatus automatically limits the current. When the apparatus is operated at current output mode, the apparatus automatically limits the voltage. Therefore, the operation voltage and the operation current are stabilized. When the tested integrated circuit fails, the apparatus of the present invention can protect itself according to the stable operation voltage and operation current, and doesn't damage the tested integrated circuit.
    • 公开了一种用于测量集成电路的静态参数的装置。 当设备运行时,根据集成电路的负载自动确定输出模式。 当设备在电压输出模式下工作时,设备自动限制电流。 当设备在当前输出模式下工作时,设备自动限制电压。 因此,工作电压和工作电流稳定。 当测试的集成电路出现故障时,本发明的装置可以根据稳定的工作电压和工作电流来保护自身,并且不会损坏被测集成电路。
    • 2. 发明授权
    • Light-guiding cover structure
    • 导光罩结构
    • US08873920B2
    • 2014-10-28
    • US13425829
    • 2012-03-21
    • Bily WangKuei-Pao ChenHsin-Cheng ChenCheng-Chin Chiu
    • Bily WangKuei-Pao ChenHsin-Cheng ChenCheng-Chin Chiu
    • G02B6/00
    • G02B6/4298G01J2001/4252G01R31/2635G02B6/3616G02B6/3644
    • A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a plurality of light-guiding groups, wherein each light-guiding group includes a plurality of optical fiber cables received in the corresponding receiving space, and each optical fiber cable has two opposite ends exposed from the bottom surface of the top cover unit and respectively facing at least one light-emitting device and at least one light-sensing device that have been disposed under the top cover unit. Therefore, the optical fiber cables received in the corresponding receiving space, thus when the light-guiding cover structure is applied to the LED package chip classification system, the aspect of the LED package chip classification system can be enhanced.
    • 导光罩结构包括顶盖单元和导光单元。 顶盖单元具有形成在其中的多个接收空间。 导光单元包括多个导光组,其中每个导光组包括容纳在相应接收空间中的多根光纤电缆,并且每根光纤电缆具有两个相对端从第 并且分别面向至少一个发光装置和已经设置在顶盖单元下的至少一个光感测装置。 因此,光纤电缆在相应的接收空间中被接收,因此当导光盖结构被应用于LED封装芯片分类系统时,可以提高LED封装芯片分类系统的方面。
    • 3. 发明授权
    • Packaged chip detection and classification device
    • 封装芯片检测和分类装置
    • US08686310B2
    • 2014-04-01
    • US13170705
    • 2011-06-28
    • Bily WangKuei-Pao ChenHsin-Cheng Chen
    • Bily WangKuei-Pao ChenHsin-Cheng Chen
    • B07C5/344
    • B07C5/00B07C5/344G01R31/01G01R31/2893
    • A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
    • 封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元,封装芯片检测单元和封装芯片分类单元。 旋转单元包括旋转转盘,形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。 每个接收部分用于选择性地接收至少一个封装的芯片。 封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。 封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块,用于对封装芯片进行分类。 因此,封装芯片检测和分类装置可以通过匹配旋转单元,封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。
    • 7. 发明授权
    • Testing system and testing method for inspecting electonic devices
    • 用于检查电子设备的测试系统和测试方法
    • US08031930B2
    • 2011-10-04
    • US12285184
    • 2008-09-30
    • Bily WangKuei-Pao ChenHsin-Cheng ChenMing-Hao Chou
    • Bily WangKuei-Pao ChenHsin-Cheng ChenMing-Hao Chou
    • G06K9/00
    • G01N21/95G01N21/8806
    • A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.
    • 用于检查电子设备的测试系统包括第一透明盘,设置在第一透明盘下方的第一图像捕获单元,邻近第一透明盘设置的第二盘,设置在透明盘与第二透明盘之间相邻区域上的引导单元 盘,以及设置在第二盘周围的多个第二图像捕获单元。 多个电子设备被连续地提供到第一透明盘上,并且第一图像捕获单元用于捕获电子设备的底面的图像。 然后,电子设备经由引导单元被引导到第二盘,并且第二图像捕获单元用于捕获电子设备的其他表面的图像。 进一步公开了一种电子设备的测试方法。
    • 9. 发明申请
    • Testing system and testing method for inspecting electonic devices
    • 用于检查电子设备的测试系统和测试方法
    • US20090251815A1
    • 2009-10-08
    • US12285184
    • 2008-09-30
    • Bily WangKuei-Pao ChenHsin-Cheng ChenMing-Hao Chou
    • Bily WangKuei-Pao ChenHsin-Cheng ChenMing-Hao Chou
    • G11B27/36
    • G01N21/95G01N21/8806
    • A testing system for inspecting electronic devices includes a first transparent disk, a first image capturing unit disposed under the first transparent disk, a second disk disposed next to the first transparent disk, a guiding unit disposed on adjacent area between the transparent disk and the second disk, and a plurality of second image capturing units disposed around the second disk. A plurality of electronic devices is continuingly supplied onto the first transparent disk and the first image capturing unit is used for capturing the images of the bottom surfaces of the electronic devices. Then, the electronic devices are guided to the second disk via the guiding unit and the second image capturing units are used for capturing the images of other surfaces of the electronic devices. A testing method for electronic devices is further disclosed.
    • 用于检查电子设备的测试系统包括第一透明盘,设置在第一透明盘下方的第一图像捕获单元,邻近第一透明盘设置的第二盘,设置在透明盘和第二透明盘之间的相邻区域上的引导单元 盘,以及设置在第二盘周围的多个第二图像捕获单元。 多个电子设备被连续地提供到第一透明盘上,并且第一图像捕获单元用于捕获电子设备的底面的图像。 然后,电子设备经由引导单元被引导到第二盘,并且第二图像捕获单元用于捕获电子设备的其他表面的图像。 进一步公开了一种电子设备的测试方法。