专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080194048A1 METHOD FOR MANUFACTURING A LIGHT-EMITTING DIODE HAVING HIGH HEAT-DISSIPATING EFFICIENCY 有权
标题翻译：制造具有高热耗效率的发光二极管的方法
公开(公告)号：US20080194048A1
公开(公告)日：2008-08-14
申请号：US11757355
申请日：2007-06-02
申请人： Bily WANG , Jonnie CHUANG , Miko HUANG
发明人： Bily WANG , Jonnie CHUANG , Miko HUANG
IPC分类号： H01L33/00
CPC分类号： H01L33/64 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.
摘要翻译：一种具有高散热效率的发光二极管的制造方法，将增厚的金属形成为多个支撑体。支撑体上具有第一电极和第二电极。第一电极形成有槽。发射可见光或不可见光的芯片粘附在槽中。然后，将两根引线焊接在芯片上。两个引线中的每一个的一端分别焊接到第一和第二电极。各种胶水点缀在芯片，粘合剂，引线和支架上。最后，胶水通过热压成型工艺形成具有封装芯片，粘合剂，引线和支撑体的座和透镜。

2. 发明申请

US20080191235A1 LIGHT EMITTING DIODE STRUCTURE WITH HIGH HEAT DISSIPATION 审中-公开
标题翻译：具有高热消散功能的发光二极管结构
公开(公告)号：US20080191235A1
公开(公告)日：2008-08-14
申请号：US11757356
申请日：2007-06-02
申请人： Bily WANG , Jonnie Chuang , Miko Huang
发明人： Bily WANG , Jonnie Chuang , Miko Huang
IPC分类号： H01L33/00 , H01L23/495
CPC分类号： H01L33/64 , H01L33/62 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.
摘要翻译：具有高散热效果的发光二极管结构包括引线框架，芯片，两根引线，内部壳体和外部壳体。引线框架具有第一电极和第二电极，并且第一电极形成用于将可见光或不可见光芯片安装在空腔中的空腔，并且芯片电耦合到两个引线，并且两个引线的一端电连接并分别耦合到第一和第二电极，并且芯片具有内部壳体，并且引线框架的两个引线和内部壳体的表面被具有基部和透镜的外部壳体包裹。

3. 发明申请

US20120205297A1 PACKAGED CHIP DETECTION AND CLASSIFICATION DEVICE 有权
标题翻译：包装芯片检测和分类设备
公开(公告)号：US20120205297A1
公开(公告)日：2012-08-16
申请号：US13170705
申请日：2011-06-28
申请人： Bily WANG , Kuei-Pao CHEN , Hsin-Cheng CHEN
发明人： Bily WANG , Kuei-Pao CHEN , Hsin-Cheng CHEN
IPC分类号： B07C5/00 , B07C5/344
CPC分类号： B07C5/00 , B07C5/344 , G01R31/01 , G01R31/2893
摘要： A packaged chip detection and classification device includes a rotation unit for transporting a plurality of packaged chips, a packaged chip detection unit, and a packaged chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust openings respectively formed in the receiving portions. Each receiving portion is used to selectively receive at least one of the packaged chips. The packaged chip detection unit includes a packaged chip detection module adjacent to the rotation unit for detecting each packaged chip. The packaged chip classification unit includes a packaged chip classification module adjacent to the rotation unit for classifying the packaged chips. Therefore, the packaged chip detection and classification device can be used to detect and classify no-lead packaged chips by matching the rotation unit, the packaged chip detection unit, and the packaged chip classification unit.
摘要翻译：封装芯片检测和分类装置包括用于传输多个封装芯片的转动单元，封装芯片检测单元和封装芯片分类单元。旋转单元包括旋转转盘，形成在旋转转盘上的多个接收部分和分别形成在接收部分中的多个抽吸排气口。每个接收部分用于选择性地接收至少一个封装的芯片。封装芯片检测单元包括与用于检测每个封装芯片的旋转单元相邻的封装芯片检测模块。封装芯片分类单元包括与旋转单元相邻的封装芯片分类模块，用于对封装芯片进行分类。因此，封装芯片检测和分类装置可以通过匹配旋转单元，封装芯片检测单元和封装芯片分类单元来检测和分类无铅封装芯片。

4. 发明申请

US20100079975A1 ILLUMINATION DEVICE WITH A FIRE-FIGHTING FUNCTION 有权
标题翻译：具有消防功能的照明装置
公开(公告)号：US20100079975A1
公开(公告)日：2010-04-01
申请号：US12243215
申请日：2008-10-01
申请人： Bily WANG
发明人： Bily WANG
IPC分类号： F21V33/00
CPC分类号： F21V33/0064 , A62C31/00 , A62C35/02 , F21S9/022 , F21V23/0442 , F21Y2115/10 , G02B6/0081
摘要： An illumination device with a fire-fighting function includes a transparent hollow casing, fire-fighting water, a light-emitting unit, and a light-guiding unit. The transparent hollow casing has a receiving space. The fire-fighting water is filled into the receiving space of the transparent hollow casing. The light-emitting unit has a plurality of light-emitting elements disposed beside one or more lateral sides of the transparent hollow casing. The light-guiding unit is disposed over the transparent hollow casing. Hence, when fire accident happens, the transparent hollow casing will melt and crack due to the developed over-heat, and the fire-fighting water is sprayed out from the receiving spaces in order to extinguish one part of flames. Therefore, the present invention can be used as a lighting device or can be used as a fire-fighting device when fire accident happens.
摘要翻译：具有消防功能的照明装置包括透明中空壳体，消防水，发光单元和导光单元。透明中空壳体具有容纳空间。消防水被填充到透明中空壳体的接收空间中。发光单元具有设置在透明中空壳体的一个或多个侧面旁边的多个发光元件。导光单元设置在透明中空壳体的上方。因此，当发生火灾事故时，透明中空套管由于发热过热而熔化和裂开，消防水从接收空间喷出以熄灭一部分火焰。因此，本发明可以用作照明装置，也可以在火灾事故发生时用作消防装置。

5. 发明申请

US20100264797A1 REFLECTION-TYPE LIGHT-EMITTING MODULE WITH HIGH HEAT-DISSIPATING AND HIGH LIGHT-GENERATING EFFICIENCY 有权
标题翻译：具有高散热和高发光效率的反射型发光模块
公开(公告)号：US20100264797A1
公开(公告)日：2010-10-21
申请号：US12426621
申请日：2009-04-20
申请人： Bily WANG , Ping-Chou Yang , Yu-Jen Cheng
发明人： Bily WANG , Ping-Chou Yang , Yu-Jen Cheng
IPC分类号： H01J61/52
CPC分类号： F21V29/51 , F21K9/233 , F21V7/0008 , F21V7/041 , F21V7/048 , F21V7/09 , F21V29/507 , F21V29/717 , F21V29/773 , F21Y2115/10
摘要： A reflection-type light-emitting module with high heat-dissipating and high light-generating efficiency includes a reflection-type lampshade unit, a heat pipe unit and a light-emitting unit. The reflection-type lampshade unit has an open casing, a receiving space formed in the open casing, and a first reflective structure is disposed in the receiving space and on an inner surface of the open casing. The heat pipe unit is received in the receiving space and is disposed on the open casing. The light-emitting unit is disposed on the heat pipe unit, and the light-emitting unit has a light-emitting face facing the inner surface of the open casing.
摘要翻译：具有散热高，发光效率高的反射型发光模块包括反射式灯罩单元，热管单元和发光单元。反射型灯罩单元具有敞开的壳体，形成在开放式壳体中的容纳空间，并且第一反射结构设置在容纳空间中和开口壳体的内表面上。热管单元被容纳在接收空间中并且设置在开放的壳体上。发光单元设置在热管单元上，并且发光单元具有面向开口壳体的内表面的发光面。

6. 发明申请

US20090278159A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE WITHOUT SUBSTRATES FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：半导体芯片封装结构，没有使用线形焊接工艺实现正面电气连接的基板及其制造方法
公开(公告)号：US20090278159A1
公开(公告)日：2009-11-12
申请号：US12243214
申请日：2008-10-01
申请人： Bily WANG , Sung-Yi HSIAO , Yun-Hao CHANG , Jack CHEN
发明人： Bily WANG , Sung-Yi HSIAO , Yun-Hao CHANG , Jack CHEN
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/01078 , H01L2924/00014
摘要： A semiconductor chip package structure without substrates for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove for receiving the semiconductor chip. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.
摘要翻译：在不使用引线键合工艺的情况下，没有用于实现面朝上电连接的基板的半导体芯片封装结构包括封装单元，半导体芯片，第一绝缘单元，第一导电单元，第二导电单元和第二绝缘单元。封装单元具有用于接收半导体芯片的中央接收槽。半导体芯片具有多个导电焊盘。第一绝缘单元具有形成在导电焊盘之间的第一绝缘层。第一导电单元具有多个第一导电层。第二导电单元具有形成在第一导电层上的多个第二导电层。第二绝缘单元形成在第一导电层之间和第二导电层之间。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式