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    • 1. 发明授权
    • Reinforced thermoplastic molding materials based on polyphenylene ether
    • 基于聚苯醚的增强热塑性成型材料
    • US4948832A
    • 1990-08-14
    • US281755
    • 1988-12-09
    • Bertram OstermayerEhrenfried BaumgartnerRainer BueschlHermann BrandtKlaus BoehlkeErhard SeilerGraham E. McKee
    • Bertram OstermayerEhrenfried BaumgartnerRainer BueschlHermann BrandtKlaus BoehlkeErhard SeilerGraham E. McKee
    • C08L51/04C08L71/12C08L77/00
    • C08L51/04C08L71/123C08L77/00
    • Reinforced thermoplastic molding materials containing, as essential components,(A) from 40 to 94 parts by weight of a polymer component of(a.sub.1) from 10 to 90% by weight of polyphenylene ether and(a.sub.2) from 10 to 90% by weight, based in each case on A, of a styrene polymer toughened with an acrylate rubber or with an unhydrogenated or hydrogenated polymer of a conjugated diene,(B) from 1 to 20 parts by weight of a copolymer of(b.sub.1) from 70 to 99.9% by weight of a monomer from the group consisting of styrene, .alpha.-methylstyrene and styrene alkylated in the nucleus or a mixture of these monomers,(b.sub.2) from 0.1 to 30% by weight of one or more compounds from the group consisting of tert-butyl acrylate and tert-butyl methacrylate, or one or more compounds from the group of compounds of the general formula I ##STR1## where R.sup.1 is hydrogen or methyl and R.sup.2, R.sup.3 and R.sup.4 are each an alkyl or alkoxy group of not more than 4 carbon atoms, or of the general formula II ##STR2## where n is an integer from 1 to 4 and R.sup.5, R.sup.6 and R.sup.7 are each one of the radicals stated for R.sup.2 or are each --O(CH.sub.2 --CH.sub.2 --O).sub.m R.sup.8, where R.sup.8 is C.sub.1 -C.sub.4 -alkyl and m is 1, 2, 3 or 4, and(b.sub.3) from 0 to 10% by weight, based on the copolymer, of a further ethylenically unsaturated monomer which is copolymerizable with b.sub.1 and b.sub.2, and(C) from 5 to 50 parts by weight of a reinforcing agent, the number of parts by weight being based on 100 parts by weight of the sum of A, B and C,are prepared and used for the production of moldings.
    • 作为必要成分的增强热塑性成型材料含有(A)40〜94重量份聚合物成分(a1),10〜90重量%聚苯醚和(a2)10〜90重量% 基于A的每种情况,使用丙烯酸酯橡胶或共轭二烯的未氢化或氢化的聚合物增韧的苯乙烯聚合物,(B)1至20重量份的(b1)70至99.9重量%的共聚物, 重量的来自于在核中烷基化的苯乙烯,α-甲基苯乙烯和苯乙烯的单体或这些单体的混合物,(b2)0.1-30%(重量)一种或多种下列化合物:叔 - 丙烯酸丁酯和甲基丙烯酸叔丁酯,或一种或多种通式Ⅰ化合物的化合物,其中R1是氢或甲基,R2,R3和R4分别是烷基或烷氧基不大于 4个碳原子,或通式II其中n是一个整数 1至4的取代基和R 5,R 6和R 7各自为R 2所示的基团之一或分别为-O(CH 2 -CH 2 -O)m R 8,其中R 8为C 1 -C 4 - 烷基且m为1,2,3 或(4)和(b3)0〜10重量%,基于共聚物,可与b1和b2共聚的另外的烯属不饱和单体和(C)5〜50重量份的增强剂, 制备基于100重量份的A,B和C之和的重量份数,并用于制造模制品。
    • 4. 发明授权
    • Thermoplastic molding materials based on polyphenylene ethers and
polyesters
    • 基于聚苯醚和聚酯的热塑性成型材料
    • US5180778A
    • 1993-01-19
    • US574073
    • 1990-08-29
    • Christof TaubitzErhard SeilerKlaus BoehlkeDietrich Lausberg
    • Christof TaubitzErhard SeilerKlaus BoehlkeDietrich Lausberg
    • C08L67/00C08L67/02C08L71/12
    • C08L67/02C08L71/123C08L67/00Y10S525/905
    • Thermoplastic molding materials containA) not less than 5% by weight of a polymer component consisting of from 50 to 100% by weight of polyphenylene ethers and from 0 to 50% by weight of a styrene polymer differing from component C),B) not less than 5% by weight of a polyester,C) not less than 0.1% by weight of a copolymer consisting ofC.sub.1) not less than 20% by weight of .alpha.-olefins of 2 to 8 carbon atoms, styrene or substituted styrenes of the general formula I ##STR1## where R and R.sup.1 is alkyl of 1 to 8 carbon atoms, hydrogen and/or halogen and n is 0, 1 or 2, or a mixture of these monomers,C.sub.2) not less than 0.5% by weight of a polymerizable monomer containing epoxide groups, and/orC.sub.3) not less than 0.05% by weight of a halobenzyl-containing polymerizable monomer having the structural unit (II) ##STR2## where X is halogen and R.sup.2 and R.sup.3 are each alkyl of 1 to 8 carbon atoms or hydrogen and n is 1, 2 or 3, and/orC.sub.4) not less than 0.05% by weight of a polymerizable monomer containing oxazoline groups, andC.sub.5) from 0 to 65% by weight of acrylonitrile, methacrylonitrile and further nonionic comonomers, andD) from 0 to 40% by weight of a rubber impact modifier.
    • 热塑性成型材料包含A)不小于5重量%的由50至100重量%的聚苯醚和0至50重量%的不同于组分C)的苯乙烯聚合物组成的聚合物组分,B)不 小于5重量%的聚酯,C)不小于0.1重量%的由C1组成的共聚物,不少于20重量%的碳原子数2〜8的α-烯烃,苯乙烯或苯乙烯的取代苯乙烯 通式I其中R和R 1是1至8个碳原子的烷基,氢和/或卤素,n是0,1或2,或这些单体的混合物,C2)不小于0.5% 重量的含有环氧基的可聚合单体和/或C3)不少于0.05重量%的具有结构单元(II)的卤代苄基的可聚合单体(II),其中X是卤素,R 2和R 3 各自为1至8个碳原子的烷基或氢,n为1,2或3,和/或C 4)不小于0.05重量%的可聚合单体 r为0〜65重量%的丙烯腈,甲基丙烯腈和其它非离子共聚单体,和D)0〜40重量%的橡胶抗冲改性剂。
    • 5. 发明授权
    • Thermoplastic molding materials based on polyphenylene ethers, nylons
and styrene copolymers
    • 基于聚苯醚,尼龙和苯乙烯共聚物的热塑性成型材料
    • US4959415A
    • 1990-09-25
    • US179991
    • 1988-04-11
    • Christof TaubitzErhard SeilerJuergen HambrechtKonrad MitullaKlaus Boehlke
    • Christof TaubitzErhard SeilerJuergen HambrechtKonrad MitullaKlaus Boehlke
    • C08L53/02C08L67/00C08L71/12C08L77/00
    • C08L53/02C08L71/123C08L77/00C08L67/00Y10S525/905
    • Thermoplastic molding materials containing(A) not less than 5% by weight of a polyphenylene ether and(B) not less than 5% by weight of a nylon furthermore contain(C) not less than 0.1% by weight of a copolymer composed of(C.sub.1) not less than 30% by weight of a styrene of the general formula I ##STR1## where R and R.sup.1 are alkyl of 1 to 8 carbon atoms, hydrogen and/or halogen and n is 0, 1, 2 or 3,(C.sub.2) not less than 0.5% by weight of an epoxide-containing polymerizable monomer and/or(C.sub.3) not less than 0.05% by weight of a halobenzyl-containing polymerizable monomer possessing a structural unit (II) ##STR2## where X is halogen, R.sup.2 and R.sup.3 are each alkyl of 1 to 8 carbon atoms or hydrogen and n is 1, 2 or 3, and/or(C.sub.4) not less than 0.05% by weight of a polymerizable monomer containing oxazoline groups and(C.sub.5) from 0 to 20% by weight of acrylonitrile, methacrylonitrile and/or other nonionic comonomers, and(D) from 0 to 35% by weight of a toughened rubber, and possess particularly good impact strength.
    • 含有(A)不小于5重量%的聚苯醚的热塑性成型材料和(B)不小于5重量%的尼龙,还含有(C)不小于0.1重量%的由( C1)不小于30重量%的通式I(I)的苯乙烯,其中R和R 1是1至8个碳原子的烷基,氢和/或卤素,n是0,1,2或 3,(C2)不小于0.5重量%的含环氧化物的可聚合单体和/或(C3)不少于0.05重量%的具有结构单元(II)的卤代苄基的可聚合单体(IMAGE) II)其中X是卤素,R2和R3各自为1-8个碳原子的烷基或氢,n为1,2或3,和/或(C4)不小于0.05重量%的含有恶唑啉基团的可聚合单体 和(C5)0至20重量%的丙烯腈,甲基丙烯腈和/或其它非离子共聚单体,和(D)0至35重量%的增韧橡胶,并且具有特定的 良好的冲击强度。
    • 7. 发明授权
    • Thermoplastics molding materials based on polyphenylene ethers and
polyesters
    • 基于聚苯醚和聚酯的热塑性塑料成型材料
    • US4962157A
    • 1990-10-09
    • US209210
    • 1988-06-20
    • Christof TaubitzErhard SeilerKlaus BoehlkeDietrich Lausberg
    • Christof TaubitzErhard SeilerKlaus BoehlkeDietrich Lausberg
    • C08L67/00C08L67/02C08L71/12
    • C08L67/02C08L71/123C08L67/00Y10S525/905
    • Thermoplastic molding materials contain(A) not less than 5% by weight of a polymer component consisting of from 50 to 10 % by weight by polyphenylene ethers and from 0 to 50% by weight of a styrene polymer differing from component (C),(B) not less than 5% by weight of a polyester,(C) not less than 0.1% by weight of a copolymer consisting of(C.sub.1) not less than 20% by weight of .alpha.-olefins of 2 to 8 carbon atoms, styrene or substituted styrenes of the general formula I ##STR1## where R and R.sup.1 is alkyl of 1 to 8 carbon atoms, hydrogen and/or halogen and n is 0, 1 or 2, or a mixture of these monomers,(C.sub.2) not less than 0.5% by weight of a polymerizable monomer containing epoxide groups,and/or(C.sub.3) not less than 0.05% by weight of a halobenzyl-containing polymerizable monomer having the structural unit (II) ##STR2## where X is halogen and R.sup.2 and R.sup.3 are each alkyl of 1 to 8 carbon atoms or hydrogen and n is 1, 2 or 3,and/or(C.sub.4) not less than 0.05% by weight of a polymerizable monomer containing oxazoline groups,and(C.sub.5) from 0 to 65% by weight of acrylonitrile, methacrylonitrile and further nonionic comonomers, and(D) from 0 to 40% by weight of a rubber impact modifier.
    • 热塑性成型材料含有(A)不少于5重量%的由聚苯醚组成的聚合物组分50至10重量%和0至50重量%不同于组分(C)的苯乙烯聚合物,(C) B)不小于5重量%的聚酯,(C)不小于0.1重量%的由(C1)不低于20重量%的2-8个碳原子的α-烯烃组成的共聚物,苯乙烯 或通式I的取代苯乙烯(I)其中R和R 1是1至8个碳原子的烷基,氢和/或卤素和n是0,1或2,或这些单体的混合物(C2 )不小于0.5重量%的含有环氧基的可聚合单体,和/或(C3)不小于0.05重量%的具有结构单元(II)的卤代苄基的可聚合单体(II)其中 X是卤素,R 2和R 3各自是1至8个碳原子的烷基或氢,n是1,2或3,和/或(C 4)不小于0.05重量%的聚合物 包含恶唑啉基的单体,和(C5)0至65重量%的丙烯腈,甲基丙烯腈和其它非离子共聚单体,和(D)0至40重量%的橡胶抗冲改性剂。
    • 9. 发明授权
    • Thermoplastic molding materials
    • 热塑性成型材料
    • US4957965A
    • 1990-09-18
    • US228720
    • 1988-08-05
    • Christof TaubitzKlaus MuehlbachHermann BrandtKlaus Boehlke
    • Christof TaubitzKlaus MuehlbachHermann BrandtKlaus Boehlke
    • C08L21/00C08L25/02C08L51/08C08L71/00C08L71/12C08L77/00
    • C08L77/00C08L71/126Y10S525/905
    • Thermoplastic molding materials contain, as essential components,(A) 5-95% by weight of a polyamide;(B) 5-95% by weight of a modified polyphenylene ether, prepared from(b.sub.1) 4.95-99.9% by weight of a polyphenylene ether,(b.sub.2) 0-90% by weight of a vinylaromatic polymer,(b.sub.3) 0.05-10% by weight of one or more compounds from the group consisting of(b.sub.31) an .alpha.,.beta.-unsaturated dicarbonyl compound,(b.sub.32) a monomer containing amide groups and a polymerizable double bond and(b.sub.33) a monomer containing lactam groups and a polymerizable double bond,(b.sub.4) 0-80% by weight of further graft-active monomers and(b.sub.5) 0.01-0.09% by weight of a free radical initiator,(C) 0-90% by weight of an unmodified polyphenylene ether,(D) 0-45% by weight of a vinylaromatic polymer and(E) 0-40% by weight of a rubber impact modifier.
    • 热塑性成型材料作为必要成分含有(A)5-95重量%的聚酰胺; (B)5-95重量%的由(b1)4.95-99.9重量%的聚苯醚制备的改性聚苯醚,(b2)0-90重量%的乙烯基芳族聚合物,(b3)0.05- 10重量%的一种或多种选自(b31)α,β-不饱和二羰基化合物,(b32)含酰胺基和可聚合双键的单体的化合物和(b33)含有内酰胺基团的单体和 (b4)0-80重量%的另外的接枝活性单体和(b5)0.01-0.09重量%的自由基引发剂,(C)0-90重量%的未改性聚苯醚, (D)0-45重量%的乙烯基芳族聚合物和(E)0-40重量%的橡胶抗冲改性剂。