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1. 发明授权

US08247263B2 Method for producing an optical, radiation-emitting component and optical, radiation-emitting component 有权
标题翻译：用于制造光学，辐射发射部件和光学辐射发射部件的方法
公开(公告)号：US08247263B2
公开(公告)日：2012-08-21
申请号：US11885374
申请日：2006-02-28
申请人： Bert Braune , Herbert Brunner , Harald Jäger , Jörg Sorg
发明人： Bert Braune , Herbert Brunner , Harald Jäger , Jörg Sorg
IPC分类号： H01L51/40
CPC分类号： C08G59/4215 , B29C45/0001 , B29C45/02 , B29K2083/00 , B29K2105/0005 , B29L2011/00 , C08G59/3245 , C08G77/06 , C08G77/42 , C08G77/455 , C08L63/00 , C08L83/00 , C08L83/04 , H01L33/54 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/12044 , C08L2666/14 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.
摘要翻译：本发明涉及一种通过模制方法制造光学和辐射发射部件的方法，以及具有明确界定的粘度的光学和辐射发射部件的方法。

2. 发明申请

US20090212316A1 Surface-mounted optoelectronic semiconductor component and method for the production thereof 审中-公开
标题翻译：表面安装光电半导体元件及其制造方法
公开(公告)号：US20090212316A1
公开(公告)日：2009-08-27
申请号：US11991230
申请日：2006-08-24
申请人： Bert Braune , Herbert Brunner , Thomas Höfer , Harald Jäger , Raimund Schwarz
发明人： Bert Braune , Herbert Brunner , Thomas Höfer , Harald Jäger , Raimund Schwarz
IPC分类号： H01L33/00 , H01L31/0203 , H01L21/56
CPC分类号： H01L33/486 , H01L24/97 , H01L25/167 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/8592 , H01L2924/01055 , H01L2924/01065 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12043 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.
摘要翻译：一种表面安装部件，包括光电子半导体芯片，一体地模制在半导体芯片上的模制体，至少在模制体的表面的至少一部分形成的安装区域，该部件的至少一个连接位置和侧面区域是通过分割生成的。

3. 发明授权

US09281453B2 Method for producing an optoelectronic component, and optoelectronic component 有权
标题翻译：光电子元件的制造方法和光电元件
公开(公告)号：US09281453B2
公开(公告)日：2016-03-08
申请号：US13995847
申请日：2011-12-07
申请人： Markus Pindl , Harald Jäger , Stephan Preuβ , Herbert Brunner
发明人： Markus Pindl , Harald Jäger , Stephan Preuβ , Herbert Brunner
IPC分类号： H01L21/00 , H01L33/50 , H01L33/54
CPC分类号： H01L33/50 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/8592 , H01L2933/0041 , H01L2924/00014
摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.
摘要翻译：制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

4. 发明授权

US07666715B2 Radiation-emitting and/or radiation-receiving semiconductor component and method for the production thereof 有权
标题翻译：辐射发射和/或辐射接收半导体元件及其制造方法
公开(公告)号：US07666715B2
公开(公告)日：2010-02-23
申请号：US10578854
申请日：2004-12-14
申请人： Herbert Brunner , Harald Jäger , Jörg Erich Sorg
发明人： Herbert Brunner , Harald Jäger , Jörg Erich Sorg
IPC分类号： H01L23/31
CPC分类号： H01L33/56 , H01L31/0203 , H01L33/486 , H01L33/501 , H01L33/62 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/01004 , H01L2924/01068 , H01L2924/01078 , H01L2924/12041 , H01L2924/00 , H01L2924/00014
摘要： A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.
摘要翻译：包含辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体部件，对半导体部件要发射和/或接收的电磁辐射透明的模制塑料部件半导体芯片至少部分地包覆成型，以及电连接到半导体芯片的电接触区域的外部电引线。模制塑料部件由反应固化硅树脂模塑料制成。还规定了制造这种半导体部件的方法。

5. 发明授权

US07436002B2 Surface-mountable radiation-emitting component 有权
标题翻译：表面贴装辐射发射元件
公开(公告)号：US07436002B2
公开(公告)日：2008-10-14
申请号：US10747703
申请日：2003-12-29
申请人： Herbert Brunner , Klaus Höhn , Harald Jäger , Josef Schmid
发明人： Herbert Brunner , Klaus Höhn , Harald Jäger , Josef Schmid
IPC分类号： H01L33/00 , H05K3/34
CPC分类号： H01L33/486 , H01L24/32 , H01L24/48 , H01L24/73 , H01L33/54 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/73265 , H01L2924/00014 , H01L2924/0102 , H01L2924/01021 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H05K3/3426 , Y02P70/613 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.
摘要翻译：辐射发射表面可安装部件具有安装在引线框架上的发光二极管芯片。成型材料封装引线框和发光二极管芯片。

6. 发明授权

US07319245B2 Radiation emitting semiconductor component with luminescent conversion element 有权
标题翻译：具有发光转换元件的辐射发射半导体元件
公开(公告)号：US07319245B2
公开(公告)日：2008-01-15
申请号：US11487742
申请日：2006-07-17
申请人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
发明人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/8592 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2224/4554
摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.
摘要翻译：一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

7. 发明申请

US20130334558A1 METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT, AND OPTOELECTRONIC COMPONENT 有权
标题翻译：生产光电元件的方法和光电元件
公开(公告)号：US20130334558A1
公开(公告)日：2013-12-19
申请号：US13995847
申请日：2011-12-07
申请人： Markus Pindl , Harald Jäger , Stephan Preuss , Herbert Brunner
发明人： Markus Pindl , Harald Jäger , Stephan Preuss , Herbert Brunner
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L33/508 , H01L33/54 , H01L2224/48091 , H01L2224/8592 , H01L2933/0041 , H01L2924/00014
摘要： A method of producing an optoelectronic component includes providing a cavity; introducing a liquid matrix material with phosphor particles distributed therein into the cavity; introducing a semiconductor chip into the matrix material; sedimenting the phosphor particles in the matrix material; and curing the matrix material, wherein a conversion layer including phosphor particles is produced, said conversion layer being arranged on the semiconductor chip.
摘要翻译：制造光电子部件的方法包括提供空腔; 将其中分布有荧光体颗粒的液体基质材料引入所述空腔中; 将半导体芯片引入基体材料中; 沉淀基体材料中的荧光体颗粒; 并固化所述基体材料，其中产生包含荧光体颗粒的转换层，所述转换层布置在所述半导体芯片上。

8. 发明授权

US07078253B2 Radiation emitting semiconductor component with luminescent conversion element 有权
标题翻译：具有发光转换元件的辐射发射半导体元件
公开(公告)号：US07078253B2
公开(公告)日：2006-07-18
申请号：US10918100
申请日：2004-08-13
申请人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
发明人： Herbert Brunner , Alexandra Debray , Harald Jäger , Günther Waitl
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2224/8592 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2933/0041 , H01L2924/00012 , H01L2224/4554
摘要： The invention describes a radiation-emmitting semiconductor component with luminescence conversion element (7), in the case of which the semiconductor body (3) is arranged in a recess in the basic body (1). Within the recess, there is shaped around the semiconductor body a bowl-like region which contains the luminescence conversion element (7) and envelopes the semiconductor body (3). The bowl-like region is formed as a depression within the recess or as an annular enclosure (6) on the base of the recess.
摘要翻译：本发明描述了一种具有发光转换元件（7）的辐射发射半导体部件，其中半导体本体（3）布置在基体（1）的凹部中。在凹部内，围绕半导体本体形成包含发光转换元件（7）并包封半导体本体（3）的碗状区域。碗状区域形成为在凹部内的凹陷或者形成为在凹部的基部上的环形外壳（6）。

9. 发明授权

US07223620B2 Process for the production of light-emitting diode light sources with a luminescence conversion element 有权
标题翻译：具有发光转换元件的发光二极管光源的制造方法
公开(公告)号：US07223620B2
公开(公告)日：2007-05-29
申请号：US10735507
申请日：2003-12-11
申请人： Harald Jäger , Herbert Brunner
发明人： Harald Jäger , Herbert Brunner
IPC分类号： H01L21/027
CPC分类号： B29C45/14639 , B29L2011/00 , H01L33/52 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/00014
摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.
摘要翻译：同时产生同一种类的多个发光二极管光源。每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。晶片设置有沟槽，然后插入模具的空腔中。包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。然后去除模具，并且发光二极管光源与层复合物分离。在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

10. 发明申请

US20130240935A1 METHOD FOR PRODUCING A SURFACE-MOUNTABLE SEMICONDUCTOR COMPONENT 有权
标题翻译：生产表面安装半导体元件的方法
公开(公告)号：US20130240935A1
公开(公告)日：2013-09-19
申请号：US13807342
申请日：2011-06-27
申请人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
发明人： Harald Jäger , Michael Zitzlsperger , Markus Pindl
IPC分类号： H01L33/60 , H01L31/0232 , H01L31/18
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
摘要： A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding.
摘要翻译：一种制造可表面安装的半导体部件的方法，包括提供由塑料材料制成的辅助载体; 将至少一个插入件和至少一个光电子部件施加到辅助载体的安装表面; 将光电子部件和插入件封装在共同的模制件中，其中模制件至少在光电部件和插入件彼此不直接接触的位置处适配地覆盖光电子部件和插入件，并且光电子部件和插入件通过模制机械连接在一起; 移除辅助工具; 并通过切割模制件来生产单个的可表面安装的半导体部件。

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