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1. 发明申请

US20100227436A1 METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING 有权
标题翻译：一种具有模具开锁的半导体封装的方法
公开(公告)号：US20100227436A1
公开(公告)日：2010-09-09
申请号：US12779367
申请日：2010-05-13
申请人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
发明人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
IPC分类号： H01L21/56 , H01L21/60
CPC分类号： H01L23/49548 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.
摘要翻译：一种半导体封装的制造方法。在一个实施例中，该方法包括在引线框架的第一主表面的一部分周围形成模腔，包括在第一主表面和第二主表面之间延伸穿过引线框架的模具锁定开口。插入间隔件以填充模具锁定开口的至少一部分。模腔填充有包封材料，包括填充未被间隔件占据的模具锁定开口的一部分。

2. 发明授权

US08466009B2 Method of fabricating a semiconductor package with mold lock opening 有权
标题翻译：制造具有模具锁定开口的半导体封装的方法
公开(公告)号：US08466009B2
公开(公告)日：2013-06-18
申请号：US12779367
申请日：2010-05-13
申请人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
发明人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
IPC分类号： H01L23/28 , H01L23/495
CPC分类号： H01L23/49548 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method of fabricating a semiconductor package. In one embodiment the method includes forming a mold cavity about a portion of a first major surface of a leadframe, including about a mold lock opening extending through the leadframe between the first major surface and a second major surface. A spacer is inserted to fill at least a portion of the mold lock opening. The mold cavity is filled with an encapsulating material including filling a portion of the mold lock opening not occupied by the spacer.
摘要翻译：一种半导体封装的制造方法。在一个实施例中，该方法包括在引线框架的第一主表面的一部分周围形成模腔，包括在第一主表面和第二主表面之间延伸穿过引线框架的模具锁定开口。插入间隔件以填充模具锁定开口的至少一部分。模腔填充有包封材料，包括填充未被间隔件占据的模具锁定开口的一部分。

3. 发明授权

US07732937B2 Semiconductor package with mold lock vent 有权
标题翻译：半导体封装带模具锁孔
公开(公告)号：US07732937B2
公开(公告)日：2010-06-08
申请号：US12041757
申请日：2008-03-04
申请人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
发明人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
IPC分类号： H01L23/495 , H01L23/28 , H01L29/40
CPC分类号： H01L23/49548 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.
摘要翻译：一种半导体封装，包括具有第一和第二主表面的引线框和在第一和第二主表面之间延伸的模具锁定开口。半导体封装包括耦合到第一主表面的半导体管芯和围绕半导体芯片形成的封装材料和引线框架的第一主表面的一部分，并且填充模具锁定开口的除了一部分之外的所有部分，所述模具锁定开口形成从所述第二主表面延伸到所述第一主表面的通气口，所述排气口提供用于空气从所述第二主表面与所述第二主表面所要附接到的表面之间逸出的通路。

4. 发明申请

US20090224382A1 SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT 有权
标题翻译：半导体封装与模具锁定通风
公开(公告)号：US20090224382A1
公开(公告)日：2009-09-10
申请号：US12041757
申请日：2008-03-04
申请人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
发明人： Bernd Goller , Markus Dinkel , Wae Chet Yong , Teck Sim Lee , Boon Kian Lim
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49548 , H01L21/565 , H01L24/48 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package including a leadframe having first and second major surfaces and a mold lock opening extending between the first and second major surfaces. The semiconductor package includes a semiconductor die coupled to the first major surface, and an encapsulating material formed about the semiconductor chip and a portion of the first major surface of the leadframe and filling all but a portion of the mold lock opening, the unfilled portion of the mold lock opening forming a vent extending from the second major surface to the first major surface, the vent providing a pathway for air to escape from between the second major surface and a surface to which the second major surface is to be attached.
摘要翻译：一种半导体封装，包括具有第一和第二主表面的引线框和在第一和第二主表面之间延伸的模具锁定开口。半导体封装包括耦合到第一主表面的半导体管芯和围绕半导体芯片形成的封装材料和引线框架的第一主表面的一部分，并且填充模具锁定开口的除了一部分之外的所有部分，所述模具锁定开口形成从所述第二主表面延伸到所述第一主表面的通气口，所述排气口提供用于空气从所述第二主表面与所述第二主表面所要附接到的表面之间逸出的通路。

5. 发明授权

US08682636B2 Non-client-specific testing of applications 有权
标题翻译：非客户端特定的应用程序测试
公开(公告)号：US08682636B2
公开(公告)日：2014-03-25
申请号：US10233072
申请日：2002-08-30
申请人： Jorg Bischof , Christian Cohrs , Christian Denkel , Markus Dinkel , Martin Kolb
发明人： Jorg Bischof , Christian Cohrs , Christian Denkel , Markus Dinkel , Martin Kolb
IPC分类号： G06F9/44 , G06F9/445 , G06F13/10
CPC分类号： G06F9/45512 , G06F11/3664 , G06F11/3688
摘要： Computer-implemented methods, systems, computer programs and data files implement and use techniques for recording and recreating user interactions with an application program. User actions performed in interacting with an application program in a first user interface environment are detected, and an abstract representation of the user actions is recorded. The user actions access one or more components of the first user interface environment, which implement user interface elements of the application program. The abstract representation describes the user actions in a format independent of the components of the first user interface environment. The abstract representation is usable in a second user interface environment to recreate results of the user actions in the application program. The abstract representations can be used to test application programs in different user interface environments.
摘要翻译：计算机实现的方法，系统，计算机程序和数据文件实现和使用用于记录和重新创建与应用程序的用户交互的技术。检测在与第一用户界面环境中的应用程序交互中执行的用户动作，并且记录用户动作的抽象表示。用户操作访问第一用户界面环境的一个或多个组件，其实现应用程序的用户界面元素。抽象表示以与第一用户界面环境的组件无关的格式描述用户动作。抽象表示可用于第二用户界面环境中以重新创建应用程序中的用户动作的结果。抽象表示可用于在不同的用户界面环境中测试应用程序。

6. 发明授权

US07099893B2 Recording application user actions for application testing 有权
标题翻译：记录应用程序用户操作以进行应用程序测试
公开(公告)号：US07099893B2
公开(公告)日：2006-08-29
申请号：US10186460
申请日：2002-06-28
申请人： Jörg Bischof , Christian Cohrs , Christian Denkel , Markus Dinkel , Martin Kolb
发明人： Jörg Bischof , Christian Cohrs , Christian Denkel , Markus Dinkel , Martin Kolb
IPC分类号： G06F17/30
CPC分类号： G06F11/3688 , Y10S707/959 , Y10S707/961 , Y10S707/99945
摘要： Methods and apparatus, including computer program products, for recording user actions includes receiving information representing a sequence of individual software application input actions taken by a user with respect to a software application, and recording the sequence as a higher level entry.
摘要翻译：用于记录用户动作的方法和装置，包括用于记录用户动作的计算机程序产品包括接收表示用户针对软件应用程序采取的各个软件应用程序输入动作的顺序的信息，并将该序列记录为较高级别的条目。

7. 发明授权

US08120161B2 Semiconductor module including semiconductor chips coupled to external contact elements 有权
标题翻译：半导体模块包括耦合到外部接触元件的半导体芯片
公开(公告)号：US08120161B2
公开(公告)日：2012-02-21
申请号：US11733658
申请日：2007-04-10
申请人： Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Tien Lai Tan , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
发明人： Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Tien Lai Tan , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
IPC分类号： H01L27/88
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/0603 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2224/83851 , H01L2224/85 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0781 , H01L2924/12032 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00014 , H01L2924/0105 , H01L2924/01049 , H01L2924/00 , H01L2924/00012 , H01L2924/0665
摘要： A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.
摘要翻译：组件包括附接到第一载体的第一半导体芯片和附接到第二载体的第二半导体芯片。第一载体具有第一延伸部，其形成第一外部接触元件。第二载体具有第二延伸部，其形成第二外部接触元件。第一和第二载体以不同方向的第一和第二延伸点的方式布置。

8. 发明申请

US20080251859A1 Semiconductor Module 有权
标题翻译：半导体模块
公开(公告)号：US20080251859A1
公开(公告)日：2008-10-16
申请号：US11733658
申请日：2007-04-10
申请人： Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Charlie Tan Tien Lai , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
发明人： Ralf Otremba , Lutz Goergens , Gerhard Noebauer , Charlie Tan Tien Lai , Erwin Huber , Marco Puerschel , Gilles Delarozee , Markus Dinkel
IPC分类号： H01L27/088 , H01L21/58 , H01L23/48
CPC分类号： H01L23/49562 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/0603 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/49111 , H01L2224/49171 , H01L2224/83801 , H01L2224/8381 , H01L2224/83825 , H01L2224/83851 , H01L2224/85 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/0781 , H01L2924/12032 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/00014 , H01L2924/0105 , H01L2924/01049 , H01L2924/00 , H01L2924/00012 , H01L2924/0665
摘要： A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.
摘要翻译：组件包括附接到第一载体的第一半导体芯片和附接到第二载体的第二半导体芯片。第一载体具有第一延伸部，其形成第一外部接触元件。第二托架具有第二延伸部，其形成第二外部接触元件。第一和第二载体以不同方向的第一和第二延伸点的方式布置。

9. 发明申请

US20070168075A1 Method and installation for processing waste paper 审中-公开
标题翻译：处理废纸的方法和安装
公开(公告)号：US20070168075A1
公开(公告)日：2007-07-19
申请号：US11568294
申请日：2005-04-18
申请人： Markus Dinkel , Volkmar Mickal , Thomas Runkler , Albrecht Sieber , Klaus Villforth
发明人： Markus Dinkel , Volkmar Mickal , Thomas Runkler , Albrecht Sieber , Klaus Villforth
IPC分类号： D21H23/78 , G06F7/66 , D21C9/00 , D21C5/02
CPC分类号： D21C5/02 , Y02W30/648
摘要： A method for the treatment of waste paper to produce a finished product in several process stages, comprises the steps of for at least one quality parameter, prescribing a set value for the finished product, wherein ahead of and/or following at least two of the process stages a value is determined by measurements of the at least one quality parameter, establishing the efficiency of a process stage with regard to the improvement of the at least one quality parameter in this process stage, and dynamically balancing in a process management system the individual process stages taking into account the overall efficiency of the process.
摘要翻译：一种用于处理废纸以在几个工艺阶段中生产成品的方法包括以下步骤：为至少一个质量参数，规定最终产品的设定值，其中提前和/或之后的至少两个过程阶段通过至少一个质量参数的测量来确定值，确定关于在该过程阶段中改善至少一个质量参数的过程阶段的效率，以及在过程管理系统中动态地平衡个体过程阶段考虑到整个过程的整体效率。

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