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1. 发明申请

US20070007977A1 Probe Card Assembly With An Interchangeable Probe Insert 有权
标题翻译：探头卡组件与可互换探头插入
公开(公告)号：US20070007977A1
公开(公告)日：2007-01-11
申请号：US11306270
申请日：2005-12-21
申请人： Benjamin Eldridge , Carl Reynolds , Nobuhiro Kawamata , Takao Saeki
发明人： Benjamin Eldridge , Carl Reynolds , Nobuhiro Kawamata , Takao Saeki
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/31905
摘要： A probe card assembly can include an insert holder configured to hold a probe insert, which can include probes disposed in a particular configuration for probing a device to be tested. The probe card assembly can provide an electrical interface to a tester that can control testing of the device, and while attached to the probe card assembly, the insert holder can hold the probe insert such that the probe insert is electrically connected to electrical paths within the probe card assembly that are part of the interface to the tester. The insert holder can be detached from the probe card assembly. The probe insert of the probe card assembly can be replaced by detaching the insert holder, replacing the probe insert with a new probe insert, and then reattaching the insert holder to the probe card assembly. The probe insert and holder can be integrally formed and comprise a single structure that can be detached from a probe card assembly and replaced with a different probe insert and holder.
摘要翻译：探针卡组件可以包括构造成保持探针插入件的插入物保持器，其可以包括设置在特定构造中的探针，用于探测要测试的装置。探针卡组件可以向测试器提供电接口，该接口可以控制设备的测试，并且在附接到探针卡组件时，插入物保持器可以保持探针插入件，使得探针插件电连接到内部的电路径探针卡组件是测试仪接口的一部分。插入架可以从探针卡组件拆下。探针卡组件的探针插入可以通过拆卸插入物夹持器，用新的探针插入物代替探针插入物，然后将插入物夹持器重新连接到探针卡组件来代替。探针插入物和保持器可以一体地形成并且包括可以从探针卡组件分离并且用不同的探针插入物和保持器代替的单个结构。

2. 发明申请

US20070139061A1 PROBING APPARATUS WITH GUARDED SIGNAL TRACES 失效
标题翻译：具有保护信号跟踪的探测设备
公开(公告)号：US20070139061A1
公开(公告)日：2007-06-21
申请号：US11566194
申请日：2006-12-01
申请人： Benjamin Eldridge , Carl Reynolds , Takao Saeki , Yoichi Urakawa
发明人： Benjamin Eldridge , Carl Reynolds , Takao Saeki , Yoichi Urakawa
IPC分类号： G01R31/02
CPC分类号： G01R1/18 , G01R1/07307 , G01R31/2889
摘要： A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.
摘要翻译：探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。衬底可以具有与第一表面相对的第一表面和第二表面，并且导电的第一信号迹线可以设置在第一衬底的第一表面上。探针可以附着到第一信号迹线上，并且电磁屏蔽结构可以围绕信号迹线设置。

3. 发明申请

US20060191136A1 Method Of Making Microelectronic Spring Contact Array 审中-公开
标题翻译：制作微电子弹簧接触阵列的方法
公开(公告)号：US20060191136A1
公开(公告)日：2006-08-31
申请号：US11382756
申请日：2006-05-11
申请人： Benjamin Eldridge , Gaetan Mathieu , Carl Reynolds
发明人： Benjamin Eldridge , Gaetan Mathieu , Carl Reynolds
IPC分类号： H01R43/00 , H05K3/10
CPC分类号： G01R1/06744 , G01R1/06733 , G01R3/00 , Y10T29/49139 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49222 , Y10T29/49224
摘要： A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.
摘要翻译：制造微电子弹簧接触阵列的方法包括在牺牲衬底上形成多个弹簧触点，然后从牺牲衬底释放弹簧触头。每个弹簧触点具有带有基端的细长梁。制造阵列的方法包括在它们已经从牺牲基板完全释放之后将其基端处的弹簧触点附接到基底基板，使得每个触点从基底延伸到其波束的远端。远端与预定阵列的尖端位置对准。在本发明的一个实施例中，通过在牺牲衬底上的牺牲层中图形地形成弹簧触点的轮廓来形成弹簧触点。牺牲层中的图案化凹槽的壁限定弹簧触点的侧面轮廓，并且导电材料沉积在凹部中以形成弹簧触点的细长梁。

4. 发明申请

US20060261827A1 Apparatus And Method For Limiting Over Travel In A Probe Card Assembly 有权
标题翻译：在探测卡组件中限制行驶的装置和方法
公开(公告)号：US20060261827A1
公开(公告)日：2006-11-23
申请号：US11461734
申请日：2006-08-01
申请人： Timothy Cooper , Benjamin Eldridge , Carl Reynolds , Ravindra Shenoy
发明人： Timothy Cooper , Benjamin Eldridge , Carl Reynolds , Ravindra Shenoy
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R3/00 , G01R31/2886
摘要： Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.
摘要翻译：公开了用于测试半导体器件的方法和装置。相对于探针卡组件的探针，超行程停止限制要测试的设备的行程。采用反馈控制技术来控制装置和探针卡组件的相对运动。探针卡组件包括用于吸收相对于探针卡组件的待测试装置的过度行进的柔性基座。

5. 发明申请

US20060057875A1 Probe card covering system and method 失效
公开(公告)号：US20060057875A1
公开(公告)日：2006-03-16
申请号：US11264948
申请日：2005-11-01
申请人： Benjamin Eldridge , Carl Reynolds
发明人： Benjamin Eldridge , Carl Reynolds
IPC分类号： H01R13/44
CPC分类号： G01R31/2851 , G01R31/2886
摘要： The present invention discloses a cover over electrical contacts of a probe card used in testing die on a wafer. A testing machine is disclosed as having the covered probe card therein. Various mechanisms for uncovering the electrical contacts while it is located in the tester machine are disclosed.

6. 发明申请

US20080042668A1 APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
标题翻译：用于管理探针卡组件的热诱导运动的装置和方法
公开(公告)号：US20080042668A1
公开(公告)日：2008-02-21
申请号：US11877466
申请日：2007-10-23
申请人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
发明人： Benjamin Eldridge , Gary Grube , Eric Hobbs , Gaetan Mathieu , Makarand Shinde , Alexander Slocum , A. Sporck , Thomas Watson
IPC分类号： G01R1/073
CPC分类号： G01R31/2874 , G01R31/2863 , G01R31/2889 , Y10T29/5313
摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.
摘要翻译：探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。探针头组件可以电连接到布线基板并且机械地附接到加强板。布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。布线基板可以在布线基板的中心位置处附接到加强板。可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

7. 发明申请

US20070287304A1 Electrical Contactor, Espcecially Wafer Level Contactor, Using Fluid Pressure 失效
标题翻译：电气接触器，异型晶圆级接触器，使用流体压力
公开(公告)号：US20070287304A1
公开(公告)日：2007-12-13
申请号：US11691369
申请日：2007-03-26
申请人： Benjamin Eldridge
发明人： Benjamin Eldridge
IPC分类号： H01R12/00
CPC分类号： G01R31/2887 , G01R1/0735 , G01R31/2886
摘要： An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is coupled to the flexible wiring layer. The fluid, when contained in the fluid containing structure, presses the flexible wiring layer towards a device under test to form electrical interconnections between the first contact elements and corresponding second contact elements on the device under test. In a further embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact terminals and a semiconductor substrate which includes a plurality of second contact terminals. A plurality of freestanding, resilient contact elements, in one embodiment, are mechanically coupled to one of the flexible wiring layers or the semiconductor substrate and make electrical contacts between corresponding ones of the first contact terminals and the second contact terminals. In another embodiment, a method of making electrical interconnections includes joining a flexible wiring layer and a substrate together in proximity and causing a pressure differential between a first side and a second side of the flexible wiring layer. The pressure differential deforms the flexible wiring layer and causes a plurality of first contact terminals on the flexible wiring layer to electrically connect with a corresponding plurality of second contact terminals on the substrate.
摘要翻译：电互连组件和用于制造电互连组件的方法。在一个实施例中，互连组件包括具有多个第一接触元件和耦合到柔性布线层的流体容纳结构的柔性布线层。当容纳在流体容纳结构中时，流体将柔性布线层压向被测器件，以在被测器件上的第一接触元件和对应的第二接触元件之间形成电互连。在另一实施例中，互连组件包括具有多个第一接触端子的柔性布线层和包括多个第二接触端子的半导体衬底。在一个实施例中，多个独立的弹性接触元件机械耦合到柔性布线层或半导体衬底中的一个，并且在对应的第一接触端子和第二接触端子之间形成电接触。在另一个实施例中，制造电互连的方法包括将柔性布线层和基板接合在一起并在柔性布线层的第一侧和第二侧之间形成压差。压差使柔性布线层变形，使柔性布线层上的多个第一接触端子与基板上的对应的多个第二接触端子电连接。

8. 发明申请

US20070269997A1 ELECTRONIC COMPONENTS WITH PLURALITY OF CONTOURED MICROELECTRONIC SPRING CONTACTS 失效
标题翻译：具有多层结构的微电子弹簧触头的电子元件
公开(公告)号：US20070269997A1
公开(公告)日：2007-11-22
申请号：US11779183
申请日：2007-07-17
申请人： Benjamin Eldridge , Stuart Wenzel
发明人： Benjamin Eldridge , Stuart Wenzel
IPC分类号： H01R12/10 , G01R31/26
CPC分类号： G01R1/06716 , G01R1/0483 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R1/06744 , G01R1/06761 , G01R1/07342 , G01R3/00 , H01L24/72 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01R12/52 , H01R12/714 , H01R13/2407 , H01R13/2442 , H01R2201/20 , H05K3/4092 , H05K7/1069 , H01L2924/00
摘要： An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material deposited over a contoured sacrificial substrate, and comprises a base mounted to the planar face of the component, a beam connected to the base at a first end of the beam, and a tip positioned at a free end of the beam opposite to the base. The beam has an unsupported span between its free end and its base. The microelectronic spring contacts are advantageously formed by depositing a resilient material over a molded, sacrificial substrate. The spring contacts may be provided with various innovative contoured shapes. In various embodiments of the invention, the electronic component comprises a semiconductor die, a semiconductor wafer, a LGA socket, an interposer, or a test head assembly.
摘要翻译：公开了一种电子部件，其具有安装到部件的平面上的多个微电子弹簧触头。微电子弹簧触点中的每一个都具有波纹形梁，其可以由沉积在轮廓牺牲基板上的弹性材料的整体层形成，并且包括安装到部件的平面上的基座，梁的第一端和位于梁的与基座相对的自由端的尖端。梁在其自由端和底座之间具有不受支撑的跨距。微电子弹簧触头有利地通过在模制的牺牲衬底上沉积弹性材料形成。弹簧触点可以具有各种创新的轮廓形状。在本发明的各种实施例中，电子部件包括半导体管芯，半导体晶片，LGA插座，插入件或测试头组件。

9. 发明申请

US20070210822A1 WIRELESS TEST SYSTEM 有权
标题翻译：无线测试系统
公开(公告)号：US20070210822A1
公开(公告)日：2007-09-13
申请号：US11749004
申请日：2007-05-15
申请人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
发明人： Igor Khandros , Benjamin Eldridge , A. Sporck , Charles Miller
IPC分类号： G01R31/26
CPC分类号： G01R31/3025 , G01R31/31907 , G01R31/31908
摘要： One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wireless communication may also include transmission of test results to a tester. Messages may also be wirelessly exchanged.
摘要翻译：一个或多个测试人员与一个或多个测试台无线通信。无线通信可以包括将测试命令和/或测试向量发送到测试站，导致测试台上的一个或多个电子设备的测试。无线通信还可以包括将测试结果传输给测试者。消息也可以被无线地交换。

10. 发明申请

US20070205780A1 Stacked Guard Structures 有权
标题翻译：堆叠式防护结构
公开(公告)号：US20070205780A1
公开(公告)日：2007-09-06
申请号：US11308094
申请日：2006-03-06
申请人： Benjamin Eldridge
发明人： Benjamin Eldridge
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R31/2889 , H05K1/0216 , H05K1/0298 , H05K2201/093 , H05K2201/09663 , H05K2201/09672
摘要： Systems and methods for providing a stack with a guard plane embedded in the stack are disclosed. An electrical apparatus can be made by forming a stack comprising an electrically conductive signal structure, an electrical guard structure, and an electrically insulating structure disposed between the signal structure and the guard structure. The signal structure, insulating structure, and guard structure can be aligned one with another in the stack.
摘要翻译：公开了一种用于提供具有嵌入堆叠中的保护平面的堆叠的系统和方法。可以通过形成包括导电信号结构，电保护结构和布置在信号结构和保护结构之间的电绝缘结构的堆叠来制造电气设备。信号结构，绝缘结构和防护结构可以在堆叠中彼此对准。

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