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1. 发明授权

US07534652B2 Microelectronic elements with compliant terminal mountings and methods for making the same 有权
标题翻译：具有兼容端子座的微电子元件及其制造方法
公开(公告)号：US07534652B2
公开(公告)日：2009-05-19
申请号：US11318846
申请日：2005-12-27
申请人： Belgacem Haba , Ilyas Mohammed , Craig S. Mitchell , Michael Warner , Jesse Burl Thompson
发明人： Belgacem Haba , Ilyas Mohammed , Craig S. Mitchell , Michael Warner , Jesse Burl Thompson
IPC分类号： H01L21/44
CPC分类号： H01L21/6835 , H01L22/34 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/056 , H01L2224/11003 , H01L2224/1134 , H01L2224/131 , H01L2224/13582 , H01L2224/136 , H01L2224/1601 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2224/13099 , H01L2924/00 , H01L2224/05099
摘要： A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.
摘要翻译：通过模制工艺形成电介质结构，使得电介质结构的第一表面通过与模具接触而成形。电介质结构的相对的第二表面被施加到晶片元件的前表面上。电介质层可以包括突出的凸起，并且可以在凸块上形成端子。凸块可能具有精确的高度。端子位于晶片元件的前表面上方的精确控制的高度。端子可以包括在周围的焊接掩模层上方延伸的突出柱，以便于与测试夹具的接合。当结构结合到电路板上时，将柱浸入焊点中。

2. 发明授权

US07176043B2 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US07176043B2
公开(公告)日：2007-02-13
申请号：US11014439
申请日：2004-12-16
申请人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
发明人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
IPC分类号： H01L21/66
CPC分类号： H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.
摘要翻译：微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件微电子元件上的柔性衬底。导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

3. 发明授权

US07554206B2 Microelectronic packages and methods therefor 有权
标题翻译：微电子封装及其方法
公开(公告)号：US07554206B2
公开(公告)日：2009-06-30
申请号：US11607372
申请日：2006-12-01
申请人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
发明人： Belgacem Haba , Masud Beroz , Ronald Green , Ilyas Mohammed , Stuart E. Wilson , Wael Zohni , Yoichi Kubota , Jesse Burl Thompson
IPC分类号： H01L23/52 , H01L23/48 , H01L23/40 , H01L23/485 , H01L23/498
CPC分类号： H01L23/49811 , G01R1/06744 , G01R1/0735 , H01L21/563 , H01L23/4985 , H01L24/12 , H01L24/16 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05599 , H01L2224/0603 , H01L2224/131 , H01L2224/13147 , H01L2224/13187 , H01L2224/13188 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/136 , H01L2224/1403 , H01L2224/16 , H01L2224/17 , H01L2224/1703 , H01L2224/48091 , H01L2224/73203 , H01L2224/73204 , H01L2224/73257 , H01L2224/73265 , H01L2224/83194 , H01L2224/85399 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.
摘要翻译：微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖所述微电子元件的第一面的柔性基板以及从所述柔性基板延伸并远离所述第一面突出的多个导电柱微电子元件，至少一些导电柱与微电子元件电互连。所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。至少一些导电柱从支撑元件偏移。组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

4. 发明授权

US09125333B2 Electrical barrier layers 有权
标题翻译：电阻层
公开(公告)号：US09125333B2
公开(公告)日：2015-09-01
申请号：US13183870
申请日：2011-07-15
申请人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
发明人： Cyprian Uzoh , Vage Oganesian , Ilyas Mohammed , Belgacem Haba , Piyush Savalia , Craig Mitchell
IPC分类号： H05K1/03 , H05K1/09 , H05K3/40
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/05083 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/056 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01074 , H01L2924/013 , H05K1/09 , H05K3/4007 , H05K2201/032 , H05K2201/0326 , H05K2201/0338
摘要： Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.
摘要翻译：用于电气应用的阻隔层。在一些实施例中，阻挡层是层压阻挡层。在一些实施例中，阻挡层包括梯度阻挡层。

5. 发明授权

US08988895B2 Interconnection elements with encased interconnects 有权
标题翻译：具有封装互连的互连元件
公开(公告)号：US08988895B2
公开(公告)日：2015-03-24
申请号：US13215725
申请日：2011-08-23
申请人： Ilyas Mohammed , Belgacem Haba
发明人： Ilyas Mohammed , Belgacem Haba
IPC分类号： H05K7/04 , H01B7/00 , H01R43/00 , H01L21/50 , H05K3/46 , H01L23/498 , H01L21/48 , H01R12/52
CPC分类号： H05K3/4602 , H01L21/486 , H01L23/49827 , H01L23/49838 , H01L2224/16225 , H01L2924/15311 , H01R12/523 , H05K2201/10378 , H05K2203/0235 , Y10T29/49176
摘要： An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
摘要翻译：公开了一种互连元件，其包括多个拉制的金属导体，电介质层和在其上具有多个可湿接触点的相对表面。导体可以包括具有沿导体的第一和第二端之间的方向定向的长度的晶粒。用于绝缘导体的电介质层可以具有第一和第二相对表面，并且在第一和第二表面之间可以具有小于1毫米的厚度。一个或多个导体可以被配置为将信号传送到微电子元件或从微电子元件传送信号。可以使用第一和第二可湿触点将互连元件接合到微电子元件和电路板中的至少一个。可湿性触点可以匹配微电子元件的表面处的元件触点的空间分布或暴露在微电子元件以外的部件的表面处的电路触点。

6. 发明授权

US08937361B2 BSI image sensor package with variable-height silicon for even reception of different wavelengths 有权
标题翻译： BSI图像传感器封装，具有可变高度的硅，用于均匀接收不同的波长
公开(公告)号：US08937361B2
公开(公告)日：2015-01-20
申请号：US13114243
申请日：2011-05-24
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
IPC分类号： H01L31/0232 , H01L27/146
CPC分类号： H01L27/14625 , H01L27/1461 , H01L27/14629 , H01L27/14632 , H01L27/1464 , H01L27/14645 , H01L27/14687
摘要： A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.
摘要翻译：提供了一种用于背面照明的微电子图像传感器组件及其制造方法。该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。电介质区域可以包括至少一个光导。

7. 发明授权

US08916781B2 Cavities containing multi-wiring structures and devices 有权
标题翻译：包含多层结构和设备的腔
公开(公告)号：US08916781B2
公开(公告)日：2014-12-23
申请号：US13296785
申请日：2011-11-15
申请人： Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
发明人： Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
IPC分类号： H05K1/11 , H05K1/03 , H05K1/09 , H05K1/00 , H01L23/498 , H01R12/71 , H05K3/42
CPC分类号： H05K1/0271 , H01L23/49827 , H01L2924/0002 , H01R12/714 , H05K1/114 , H05K1/115 , H05K3/42 , H05K2201/09645 , H05K2201/10378 , H05K2203/0242 , H05K2203/025 , Y10T29/49165 , H01L2924/00
摘要： An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.
摘要翻译：互连部件包括具有开口的元件，延伸穿过开口彼此电绝缘的多个导体以及彼此电绝缘的多个第二触点。该元件由热膨胀系数小于10ppm /℃的材料构成。至少一些导体沿开口的至少一个内表面延伸。导体在第一表面限定多个可润湿的第一接触。第一触点在厚度方向上与开口至少部分地对齐，并且彼此电绝缘。

8. 发明授权

US08652935B2 Void-free wafer bonding using channels 有权
标题翻译：使用通道的无空隙晶片接合
公开(公告)号：US08652935B2
公开(公告)日：2014-02-18
申请号：US12970529
申请日：2010-12-16
申请人： Ilyas Mohammed , Piyush Savalia , Craig Mitchell , Vage Oganesian , Belgacem Haba
发明人： Ilyas Mohammed , Piyush Savalia , Craig Mitchell , Vage Oganesian , Belgacem Haba
IPC分类号： H01L21/30
CPC分类号： H01L23/562 , B81C1/00269 , B81C1/00357 , H01L21/2007 , H01L21/561 , H01L21/563 , H01L21/568 , H01L23/13 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/29186 , H01L2224/2919 , H01L2224/32057 , H01L2224/32145 , H01L2224/32225 , H01L2224/83051 , H01L2224/83191 , H01L2224/83345 , H01L2224/83385 , H01L2224/83855 , H01L2224/83856 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06555 , H01L2225/06575 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/014 , H01L2924/0665 , H01L2924/10158 , H01L2924/10253 , H01L2924/1027 , H01L2924/1032 , H01L2924/1037 , H01L2924/14 , H01L2924/1461 , H01L2924/3511 , H01L2224/83 , H01L2924/00
摘要： A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.
摘要翻译：接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

9. 发明授权

US08610259B2 Multi-function and shielded 3D interconnects 有权
标题翻译：多功能和屏蔽3D互连
公开(公告)号：US08610259B2
公开(公告)日：2013-12-17
申请号：US12884695
申请日：2010-09-17
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Piyush Savalia
IPC分类号： H01L23/48
CPC分类号： H01L23/49827 , H01L21/6835 , H01L23/481 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/06 , H01L2221/68327 , H01L2221/6834 , H01L2223/6622 , H01L2224/05009 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/0557 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element.
摘要翻译：微电子单元包括基本上由半导体材料组成的半导体元件，其具有前表面，后表面，与前表面相邻的多个有源半导体器件，在前表面暴露的多个导电焊盘，以及延伸穿过半导体元件。至少一个导电焊盘可以至少部分地覆盖开口并且可以与至少一个有源半导体器件电连接。微电子单元还可以包括暴露在后表面处以与外部部件连接的第一导电元件，第一导电元件延伸穿过开口并与至少一个导电焊盘电连接，第二导电元件延伸穿过开口并与第一导电元件绝缘。至少一个导电焊盘可以覆盖在第二导电元件的周边边缘上。

10. 发明授权

US08512491B2 Dual wafer spin coating 有权
标题翻译：双晶圆片旋涂
公开(公告)号：US08512491B2
公开(公告)日：2013-08-20
申请号：US12974611
申请日：2010-12-21
申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
发明人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
IPC分类号： B32B41/00
CPC分类号： H01L22/12 , H01L21/67092
摘要： A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.
摘要翻译：接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度，使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。

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