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    • 9. 发明申请
    • MODULAR SOLID-STATE MILLIMETER WAVE (MMW) RF POWER SOURCE
    • 模块化固态毫米波(MMW)射频电源
    • WO2010019355A1
    • 2010-02-18
    • PCT/US2009/051292
    • 2009-07-21
    • RAYTHEON COMPANYLOWELL, Reid, F.BROWN, KennethGRITTERS, Darin, M.BROWN, Andrew, K.SOTELO, Michael, J.DOLASH, William, E.FEENSTRA, Travis, B.
    • LOWELL, Reid, F.BROWN, KennethGRITTERS, Darin, M.BROWN, Andrew, K.SOTELO, Michael, J.DOLASH, William, E.FEENSTRA, Travis, B.
    • H01Q3/46H01P5/12
    • H01Q3/46H01P5/12H01Q21/0025H01Q21/0075H01Q21/064H03F3/602H03F2200/321
    • A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1 :N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1 :N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips.
    • 基于透镜阵列放大器的拓扑结构的模块化固态MMW电源提供了扩展输出功率和有效热管理的灵活性。 模块化电源包括单个子模块,其使用一个或多个功率分配器和一个或多个固态放大级来将RF输入信号分频和放大为R个放大的RF信号。 子模块安装在散热器的表面上(适当地在X-Y平面中),适当地耦合到冷底板以去除热量。 R 1:N低损耗功率分配器将放大的RF信号路由到R * N个辐射元件。 1:N功率分配器中的每一个适当地驻留在X-Z平面中并且在Y方向上堆叠以提供Y-Z平面中的R * N个辐射元件的平面输出。 放大器芯片在单个子模块上的放置将放大器芯片的数量(因此输出功率)与辐射元件的数量进行去耦。 放大器芯片远离辐射面的放置提供了一个短路径,通过散热器到背板具有大的热横截面以去除热量。 拓扑结构可以产生高输出功率和高天线增益,从而产生以前只能用Gyrotron实现的大功率孔径产品。 随着放大器芯片变得越来越强大,拓扑可以适应于使用较少的芯片。