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1. 发明授权

US6068749A Subatmospheric, variable pressure sample delivery chamber for electrospray ionization/mass spectrometry and other applications 失效
标题翻译：低气压，可变压力样品输送室，用于电喷雾离子化/质谱和其他应用
公开(公告)号：US6068749A
公开(公告)日：2000-05-30
申请号：US784400
申请日：1997-01-17
申请人： Barry L. Karger , Frantisek Foret , Daniel P. Kirby
发明人： Barry L. Karger , Frantisek Foret , Daniel P. Kirby
IPC分类号： G01N27/447 , G01N30/28 , G01N30/72 , H01J49/04 , G01N27/26
CPC分类号： H01J49/045 , G01N27/44717 , H01J49/165 , G01N2030/285 , G01N30/7266
摘要： A subatmospheric, variable pressure sample delivery chamber, useful as an electrospray ionization device for introducing a sample into a mass spectrometer or as a sample delivery device for delivery of a sample to a collection device at subatmospheric pressures, is disclosed. The sample delivery chamber is configured to maintain an operating pressure between 1 and 750 Torr, preferably between 50 and 700 Torr. The chamber has an inlet port for introduction of a gas and an exit port capable of being coupled either to a sampling orifice for an analytical device, usually a mass spectrometer, or directly to a pump for removal of gas. A sample delivery device extends from outside the chamber into the interior of the chamber. The inlet end of the sample delivery device is capable of receiving a sample and the exit end of the sample delivery device is aligned with the exit port of the chamber, if the sample is to be delivered to an external analytical device, or aligned with the collection device, for direct collection of the sample.
摘要翻译：公开了一种低于大气压的可变压力样品输送室，其用作将样品引入质谱仪或用于将样品递送至低于大气压的收集装置的样品输送装置的电喷射离子化装置。样品输送室被配置为将操作压力保持在1至750托之间，优选在50至700托之间。腔室具有用于引入气体和出口的入口端口，该出口能够耦合到用于分析装置（通常是质谱仪）的采样孔，或者直接连接到用于去除气体的泵。样品输送装置从腔室外部延伸到腔室的内部。样品输送装置的入口端能够接收样品，并且样品输送装置的出口端与腔室的出口对准，如果样品要被输送到外部分析装置，或者与收集装置，用于直接收集样品。

2. 发明授权

US4772346A Method of bonding inorganic particulate material 失效
标题翻译：粘合无机颗粒材料的方法
公开(公告)号：US4772346A
公开(公告)日：1988-09-20
申请号：US115568
申请日：1987-10-29
申请人： Herbert R. Anderson, Jr. , Constance J. Araps , Renuka S. Divakaruni , Daniel P. Kirby , Robert W. Nufer , Harbans S. Sachdev , Krishna G. Sachdev , Darbha Suryanarayana , Stoyan M. Zalar
发明人： Herbert R. Anderson, Jr. , Constance J. Araps , Renuka S. Divakaruni , Daniel P. Kirby , Robert W. Nufer , Harbans S. Sachdev , Krishna G. Sachdev , Darbha Suryanarayana , Stoyan M. Zalar
IPC分类号： C03C10/00 , C04B35/628 , C04B35/63 , C04B35/632 , C04B35/634 , H01L21/48 , H05K1/03 , C04B35/00
CPC分类号： C04B35/6268 , C03C10/00 , C04B35/195 , C04B35/628 , C04B35/62807 , C04B35/6316 , C04B35/6325 , C04B35/634 , C04B35/6342 , C04B35/638 , H01L21/4807 , H05K1/0306 , C04B2235/3232 , C04B2235/3481 , C04B2235/449 , C04B2235/5436 , C04B2235/6025 , C04B2235/6562 , C04B2235/6582 , C04B2235/6584 , C04B2235/6588 , C04B2235/9661
摘要： In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.
摘要翻译：在由浆料形成元件的方法中，该浆料包括颗粒陶瓷和/或玻璃，有机粘合剂树脂和用于树脂的溶剂，其中元件由浆料成形，并且元件被加热以除去浆料并随后熔化陶瓷和/或玻璃颗粒，其改进包括在用选自有机硅烷，有机硅氮烷，钛螯合物，钛的钛的表面改性化合物形成浆料之前涂覆陶瓷和/或玻璃颗粒酯及其混合物。

3. 发明授权

US4885038A Method of making multilayered ceramic structures having an internal distribution of copper-based conductors 失效
标题翻译：制造具有铜基导体内部分布的多层陶瓷结构体的方法
公开(公告)号：US4885038A
公开(公告)日：1989-12-05
申请号：US858488
申请日：1986-05-01
申请人： Herbert R. Anderson, Jr. , Renuka S. Divakaruni , Joseph M. Dynys , Steven M. Kandetzke , Daniel P. Kirby , Raj N. Master , Jon A. Casey
发明人： Herbert R. Anderson, Jr. , Renuka S. Divakaruni , Joseph M. Dynys , Steven M. Kandetzke , Daniel P. Kirby , Raj N. Master , Jon A. Casey
IPC分类号： H05K3/46 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/28
CPC分类号： H01L21/4867 , H01L21/4846 , H05K1/0306 , H05K1/092 , H05K3/28 , H05K3/4611 , H05K3/4629
摘要： The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.
摘要翻译：本发明提供了一种制造其中具有铜基导体的多层陶瓷结构的方法，其中可以调节铜基导体的烧结开始以接近或匹配结构的陶瓷部分。此外，提供了方法，其中用于形成结构陶瓷部分的聚合物粘合剂树脂可以使用含氧环境除去或燃烧，其中氧含量大于200ppm，而不会氧化铜的导体。

4. 发明授权

US5139851A Low dielectric composite substrate 失效
公开(公告)号：US5139851A
公开(公告)日：1992-08-18
申请号：US503493
申请日：1990-03-30
申请人： John Acocella , Arnold I. Baise , Richard A. Bates , Jon A. Casey , David R. Clarke , Renuka S. Divakaruni , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Amy T. Matts , Robert W. Nufer , Srinivasa S. N. Reddy , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Arnold I. Baise , Richard A. Bates , Jon A. Casey , David R. Clarke , Renuka S. Divakaruni , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Amy T. Matts , Robert W. Nufer , Srinivasa S. N. Reddy , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： C04B41/48 , C04B41/49 , H01L21/48 , H01L23/538 , H05K1/03 , H05K3/40
CPC分类号： C04B41/4961 , C04B41/488 , H01L21/4857 , H01L23/5383 , H05K3/4061 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308 , Y10S428/901 , Y10T428/24917 , Y10T428/24926
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

5. 发明授权

US5135595A Process for fabricating a low dielectric composite substrate 失效
标题翻译：制造低介电复合基板的工艺
公开(公告)号：US5135595A
公开(公告)日：1992-08-04
申请号：US503495
申请日：1990-03-30
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

6. 发明授权

US5277725A Process for fabricating a low dielectric composite substrate 失效
标题翻译：低介电复合衬底的制造方法
公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译：在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

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