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    • 1. 发明申请
    • MULTI-SUBSTRATE PACKAGE ASSEMBLY
    • 多基板封装组件
    • US20060261252A1
    • 2006-11-23
    • US11383380
    • 2006-05-15
    • Barrett ColeRobert HigashiChristopher ZinsSubash Krishnankutty
    • Barrett ColeRobert HigashiChristopher ZinsSubash Krishnankutty
    • G01J3/50H01L31/00
    • G01J3/02G01J3/0256G01J3/26H01L31/02162H01L31/105H01L31/109
    • A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.
    • 一种具有第一基板,第二基板和封装的多基板封装组件,每个具有多个接合焊盘。 该封装包括用于接收第一和第二基板中的一个或两个的空腔,其中多个接合焊盘沿着空腔的至少一部分周边定位。 第一基板和第二基板优选地定位在封装的空腔中,其中第一基板和第二基板的选定的接合焊盘电连接到封装的选定的接合焊盘。 在一些实施例中,第一衬底的接合焊盘仅连接到空腔的一侧或多侧上的接合焊盘,并且第二衬底的接合焊盘仅连接到第一衬底的一个或多个侧面上的接合焊盘 腔。 本发明的包装组件可用于许多应用中,包括光谱可调光学检测器。