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1. 发明授权

US4264693A Light and current sensitive film and print-display system therewith 失效
标题翻译：光和电流敏感的薄膜和印刷显示系统
公开(公告)号：US4264693A
公开(公告)日：1981-04-28
申请号：US974640
申请日：1978-12-29
申请人： Barbara A. Gardineer , Carlos J. Sambucetti , Hugo K. Seitz
发明人： Barbara A. Gardineer , Carlos J. Sambucetti , Hugo K. Seitz
IPC分类号： B41M5/20 , G03C1/725 , G03G5/00 , G03G17/00
CPC分类号： B41M5/20 , G03C1/725 , G03C1/7253 , G03C1/7256 , Y10S428/913 , Y10T428/256 , Y10T428/31996
摘要： Films are disclosed which are constituted essentially of iodides of heavy metals to which catalysts or sensitizing agents are added to make the films highly sensitive to light and current at room temperature, thus increasing the speed of writing and erasing cycles. The disclosure provides for producing and erasing images on such light and current sensitive films prepared on substrates such as ordinary paper or transparent non-reactive materials. Marking on the films is achieved by light e.g., laser beam and Xenon lamp, or electrical current. Exemplary erasing is done by application of heat. Several examples are disclosed of the formation of these films adherently on non-reactive surfaces.
摘要翻译：公开了基本上由重金属的碘化物构成的膜，其中加入催化剂或增感剂以使膜在室温下对光和电流高度敏感，从而增加写入和擦除循环的速度。本公开提供了在诸如普通纸或透明非反应性材料的基底上制备的这种光和电流敏感膜上产生和擦除图像。膜上的标记通过光例如激光束和氙灯或电流来实现。通过施加热来进行示例性擦除。公开了在非反应性表面上粘附形成这些膜的几个实例。

2. 发明授权

US4999577A Method for contactless testing of conducting paths in a substrate using photon-assisted tunneling 失效
标题翻译：使用光子辅助隧道对基板中导电路径进行非接触测试的方法
公开(公告)号：US4999577A
公开(公告)日：1991-03-12
申请号：US366572
申请日：1989-06-15
申请人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
发明人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
IPC分类号： H01L21/66 , G01N23/225 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： For testing the integrity of conducting lines on or in a substrate, the following steps are executed: (I) Selected pads are irradiated by a focused optical beam so that they are positively charged due to photon-assisted tunneling of electrons from those pads. The charges propagate through existing conductors so that all selected pads and all pads connected to them assume a specific voltage. (II) The whole surface is irradiated by a flooding optical beam. Photon-assisted tunneling of electrons will now occur from those pads which were not charged previously. (III) The tunneling electrons excite an electroluminescent layer whose illumination reveals the spatial distribution of uncharged pads. This method is performed in air under atmospheric conditions and allows completely contactless testing of circuitry to detect line interruptions as well as shortcuts between separate lines. It is suited for surface lines, buried lines and for via connections.

3. 发明授权

US5030909A Method and system for contactless testing of electronic activity in an integrated circuit chip-to-test after passivation thereof 失效
标题翻译：在其钝化后的集成电路芯片中测试电子活动的方法和系统
公开(公告)号：US5030909A
公开(公告)日：1991-07-09
申请号：US478858
申请日：1990-02-12
申请人： Armin U. Blancha , Rolf Clauberg , Ernst H. Rothauser , Hugo K. Seitz
发明人： Armin U. Blancha , Rolf Clauberg , Ernst H. Rothauser , Hugo K. Seitz
IPC分类号： H01L21/64 , G01R31/26 , G01R31/309 , H01L21/66
CPC分类号： G01R31/309
摘要： This chip-to-test (1) has a passivation layer and an overlayer at test points (4). The system comprises a vacuum chamber (8), means (2) for mounting and connecting the chip-to-test (1), a pulsed light source means (9) operable to scan the chip-to-test (1) for inducing photoelectron (15) emission therefrom, means (14) for exercising the circuits of the chip-to-test (1), means (18) for detecting the photoelectrons (15), having a detection threshold and delivering a sequence of signals representative of voltages at the currently scanned test point (4') or points as a function of the scanned point or scanning time, means (23) for flooding the chip-to-test (1) with electrons of energy lower than the detection threshold, means (21) for analyzing said sequence of signlas and means (22) for deriving therefrom a capacitive voltage contrast. The material of the overlayer has a work function lower than the photon energy and can be BeO, MgO, CaO, TiO2, more preferably SrO, Cs2O, BaO or a mixture thereof. This system facilitates testing of a chip-to-test whose passivation layer has a work function above the photon energy, and prevents charging-up of the passivation layer.

4. 发明授权

US4868492A Method for contactless testing of conducting paths in a substrate using photo-assisted tunneling 失效
标题翻译：使用光辅助隧道对基板中的导电路径进行非接触测试的方法
公开(公告)号：US4868492A
公开(公告)日：1989-09-19
申请号：US107441
申请日：1987-10-09
申请人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
发明人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
IPC分类号： H01L21/66 , G01N23/225 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： For testing the integrity of conducting lines on or in a substrate, the following steps are executed: (I) Selected pads are irradiated by a focused optical beam so that they are positively charged due to photon-assisted tunneling of electrons from those pads. The charges propagate through existing conductors so that all selected pads and all pads connected to them assume a specific voltage. (II) The whole surface is irradiated by a flooding optical beam. Photon-assisted tunneling of electrons will now occur from those pads which were not charged previously. (III) The tunneling electrons excite an electroluminescent layer whose illumination reveals the spatial distribution of uncharged pads. This method is performed in air under atmospheric conditions and allows completely contactless testing of circuitry to detect line interruptions as well as shortcuts between separate lines. It is suited for surface lines, buried lines and for via connections.
摘要翻译：为了测试衬底上或衬底中的导线的完整性，执行以下步骤：（I）由聚焦光束照射所选择的焊盘，使得它们由于来自这些焊盘的电子的光子辅助隧穿而带正电荷。电荷通过现有导体传播，使得所有选定的焊盘和连接到它们的所有焊盘都具有特定的电压。（II）整个表面被淹没光束照射。电子的光子辅助隧道现在将从以前没有充电的那些焊盘发生。（III）隧道电子激发电致发光层，其照明显示不带电垫的空间分布。该方法在大气条件下在空气中进行，并允许电路完全非接触测试，以检测线路中断以及分离线路之间的快捷方式。适用于表面线，埋线和通孔连接。

5. 发明授权

US4843329A Method for contactless testing for electrical opens and short circuits in conducting paths in a substrate 失效
标题翻译：用于非接触式测试的方法，用于在基板中的导电路径中的电开路和短路
公开(公告)号：US4843329A
公开(公告)日：1989-06-27
申请号：US107433
申请日：1987-10-09
申请人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
发明人： Johannes G. Beha , Armin U. Blacha , Rolf Clauberg , Hugo K. Seitz
IPC分类号： H01L21/66 , G01N23/22 , G01R31/02 , G01R31/308 , H05K3/00
CPC分类号： G01R31/308
摘要： A method for contactlessly testing for opens and shorts in conducting paths within or on a nonconducting substrate. There are a plurality of conducting pads on the surface of the substrate. Charges are contactlessly generated, e.g., by an optical beam, in at least one selected pad inducing a voltage thereon and on pads electrically connected therewith through one of the conducting paths. A two dimensional electron flux is contactlessly caused to be emitted from the selected pad and at least one other pad of the plurality of pads, e.g., by an optical beam. The flux emitted from the pads depends on the voltage on each pad. The flux is detected to distinguish pads in electrical connection.
摘要翻译：一种用于非接触测试非导电衬底内或之上的导通路径中的开路和短路的方法。在基板的表面上有多个导电焊盘。在至少一个所选择的焊盘中，例如通过光束，通过其中一个导电路径与其电连接的焊盘上无接触地产生电荷。二维电子通量被非接触地引起，例如通过光束从所选择的焊盘和多个焊盘中的至少一个其它焊盘发射。从焊盘发射的焊剂取决于每个焊盘上的电压。检测通量以区分电连接的焊盘。

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