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1. 发明授权

US07352127B2 LED lamp with light-emitting junction arranged in three-dimensional array 有权
标题翻译： LED灯具发光结排列成三维阵列
公开(公告)号：US07352127B2
公开(公告)日：2008-04-01
申请号：US10953797
申请日：2004-09-29
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , Y10S362/80 , H01L2924/00014
摘要： In accordance with the present invention, there is provided a lamp including a plurality of semi-conductor light emitting junctions with a common layer of fluorescent material arranged thereover, wherein the junctions are provided in a three-dimensional array.
摘要翻译：根据本发明，提供了一种灯，其包括多个半导体发光结，其中布置有布置在其上的荧光材料的公共层，其中所述接合部设置为三维阵列。

2. 发明授权

US07704762B2 Lamp and method of producing a lamp 有权
标题翻译：灯的制作方法
公开(公告)号：US07704762B2
公开(公告)日：2010-04-27
申请号：US10487040
申请日：2003-06-11
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： H01L21/00 , H01L29/201 , H01L23/495 , H01L23/48 , H01L23/52 , H01L29/40 , H01L33/00 , H01J61/94 , H01J1/62 , H01J63/04 , F21V7/10 , F21V1/00 , F21V11/00 , F21V7/00 , F21V21/00 , F21V7/04 , F21S4/00
CPC分类号： H01L33/62 , F21K9/00 , F21Y2107/20 , F21Y2115/10 , H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , Y10S362/80 , Y10S438/956 , H01L2924/00014 , H01L2924/00
摘要： A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection with the support structure.
摘要翻译：一种制造灯的方法，包括：将发光结安装在各个容座中; 将容器安装在弯曲的支撑结构上以形成三维阵列; 并且将发光结放置在与支撑结构电连接的位置。

3. 发明申请

US20110044044A1 LAMP AND A PROCESS FOR PRODUCING A LAMP 审中-公开
标题翻译：灯和制造灯的工艺
公开(公告)号：US20110044044A1
公开(公告)日：2011-02-24
申请号：US12849762
申请日：2010-08-03
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： F21V21/00 , H01J9/00
CPC分类号： F21K9/00 , F21K9/90 , F21Y2107/20 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/49109 , H01L2924/00014 , H01L2224/48091 , H01L2924/00 , H01L2224/48
摘要： A process for producing a lamp, including forming one or more electrical connectors having a predetermined shape for making electrical connections to one or more light source assemblies mounted at predetermined locations on a non-planar support. The light source assemblies are formed by forming an electrical insulator on a peripheral region of an electrically conductive receptacle, forming an electrically conductive contact adapted to fit the peripheral region, attaching the electrically conductive contact to the electrical insulator, mounting a light source in the receptacle, and making a first electrical connection between a first electrically conductive contact of the receptacle and a first contact of the light source, and a second electrical connection between a second electrically conductive contact of the receptacle and a second contact of the light source. The light sources mounted in the electrically conductive receptacles are light emitting diodes and are encapsulated in transparent medium. An array of electrically conductive receptacles is formed from sheet metal by stamping and cutting. Connected receptacles are subsequently separated from the sheet, The electrical connectors are first and second annular connectors with projections and are formed from a metal sheet and subsequently separated by removing joining portions and tie bars.
摘要翻译：一种用于制造灯的方法，包括形成具有预定形状的一个或多个电连接器，用于与安装在非平面支撑件上的预定位置处的一个或多个光源组件进行电连接。光源组件通过在导电插座的周边区域上形成电绝缘体而形成，形成适于安装周边区域的导电触头，将导电触头安装到电绝缘体上，将光源安装在插座中并且在所述插座的第一导电触点和所述光源的第一触点之间以及所述插座的第二导电触头与所述光源的第二触点之间的第二电连接之间进行第一电连接。安装在导电插座中的光源是发光二极管，并且被封装在透明介质中。通过冲压和切割由金属片形成一排导电插座。连接的插座随后与片材分离。电连接器是具有突起的第一和第二环形连接器，并且由金属板形成，并且随后通过去除接合部分和连接杆而分离。

4. 发明授权

US06809475B2 Led lamp with light-emitting junctions arranged in a three-dimensional array 有权
标题翻译：具有以三维阵列排列的发光结的LED灯
公开(公告)号：US06809475B2
公开(公告)日：2004-10-26
申请号：US10049572
申请日：2002-02-14
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： H01J162
CPC分类号： H01L25/0753 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , Y10S362/80 , H01L2924/00014
摘要： A lamp including a plurality of semi-conductor light emitting junctions with a common layer of fluorescent material arranged thereover. The invention provides a lamp including a plurality of light emitting junctions mounted to at least one curved conductor so as to adopt a three-dimensional array.

5. 发明申请

US20100163913A1 LAMP AND METHOD OF PRODUCING A LAMP 审中-公开
标题翻译：灯和灯的制造方法
公开(公告)号：US20100163913A1
公开(公告)日：2010-07-01
申请号：US12722487
申请日：2010-03-11
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： H01L33/52 , H01L33/48 , H01L33/60
CPC分类号： H01L33/62 , F21K9/00 , F21Y2107/20 , F21Y2115/10 , H01L25/0753 , H01L2224/45144 , H01L2224/48091 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , Y10S362/80 , Y10S438/956 , H01L2924/00014 , H01L2924/00
摘要： A method of producing a lamp, including: mounting light emitting junctions in respective receptacles; mounting the receptacles on a curved support structure so as to form a three-dimensional array; and placing the light emitting junctions in electrical connection with the support structure.
摘要翻译：一种制造灯的方法，包括：将发光结安装在各个容座中; 将容器安装在弯曲的支撑结构上以形成三维阵列; 并且将发光结放置在与支撑结构电连接的位置。

6. 发明授权

US07320632B2 Method of producing a lamp 有权
标题翻译：制造灯的方法
公开(公告)号：US07320632B2
公开(公告)日：2008-01-22
申请号：US10305294
申请日：2002-11-26
申请人： Balu Jeganathan , John Albert Montagnat
发明人： Balu Jeganathan , John Albert Montagnat
IPC分类号： H01J9/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/50 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A method of producing a lamp is disclosed. The method provides for mounting light emitting junctions on a support structure such that the junctions adopt a three-dimensional array.
摘要翻译：公开了一种制造灯的方法。该方法提供将发光结安装在支撑结构上，使得接点采用三维阵列。

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