会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明申请
    • Method and system of releasing a MEMS structure
    • 释放MEMS结构的方法和系统
    • US20060228831A1
    • 2006-10-12
    • US11094101
    • 2005-03-29
    • Steven NasiriAnthony FlanneryMartin Lim
    • Steven NasiriAnthony FlanneryMartin Lim
    • H01L21/00
    • B81C1/00333
    • A method and system for releasing MEMS cover-structure on a wafer is disclosed. It includes at least one MEMS wafer structure made up of two wafers, one protective cover, and one containing at least one MEMS feature that are bonded together by various standard wafer bonding means. Also, one wafer substrate with patterned aluminum features and input/output pads. The method and system comprise providing for a built in channels between the said first cover wafer, and second said MEMS wafer allowing for a saw blade to cut a channel into the cover wafer, while the MEMS wafer providing for protection against saw slurries to get over the contact pad area on the said substrate wafer. Providing a tab area over the at least one bond pad and the dicing of the tab area to remove at least a portion of tab area above the at least one bond pad. A method and system of using industry dicing techniques to release the MEMS cover-structure from the substrate is disclosed. Dicing is much more benign chemically and is compatible with a much greater range of materials. The cost of dicing and complexity of infrastructure required are much less than that required for DRIE. Also, unlike conventional methods, a dicing release does not require an additional masking step.
    • 公开了一种用于在晶片上释放MEMS覆盖结构的方法和系统。 它包括由两个晶片组成的至少一个MEMS晶片结构,一个保护盖,以及包含通过各种标准晶片接合装置粘接在一起的至少一个MEMS特征的MEMS晶片结构。 而且,具有图案化铝特征的一个晶片衬底和输入/输出焊盘。 该方法和系统包括提供在所述第一覆盖晶片和第二所述MEMS晶片之间的内置通道,所述第二所述MEMS晶片允许锯片将通道切割入所述盖晶片,同时所述MEMS晶片提供保护以防止锯浆料过渡 所述衬底晶片上的接触焊盘区域。 在所述至少一个接合焊盘上提供突片区域,并且对所述突片区域进行切割以去除所述至少一个接合焊盘上方的突片区域的至少一部分。 公开了一种使用工业切割技术从基板释放MEMS覆盖结构的方法和系统。 切割化学性质更加良好,与更广泛的材料相容。 切割成本和所需基础设施的复杂性远低于DRIE要求的。 此外,与传统方法不同,切割释放不需要额外的掩模步骤。
    • 6. 发明授权
    • Micromachined apparatus and technique to align two dimensional fiber array
    • 微机械设备和技术对齐二维光纤阵列
    • US06633708B1
    • 2003-10-14
    • US09799965
    • 2001-03-06
    • Martin Lim
    • Martin Lim
    • G02B626
    • G02B6/4226
    • Optical fibers are aligned in a jig of parallel apertured plates in which the fibers are inserted and positioned by the use of V-shaped or positioning ribbon actuators. The actuators are thermally actuated by a closed loop feedback system to center each individual fiber and its light output on an equivalent juxtaposed photodetector array. When the fiber is centered by this feedback technique it is permanently fixed in that position by potting, for example. The feedback control constitutes either a totally electrical system utilizing a processing unit or can be partially manually controlled by a human operator operating a joystick and viewing a meter or similar device which indicates an approach to a maximum output from a photodetector.
    • 光纤在平行孔板的夹具中排列,其中纤维通过使用V形或定位色带致动器插入和定位。 致动器由闭环反馈系统热启动,以将每个单独的光纤及其光输出集中在等效的并置的光电检测器阵列上。 当纤维由该反馈技术居中时,例如通过灌封将其永久固定在该位置。 反馈控制构成利用处理单元的完全电气系统,或者可以由操作操纵杆的人操作器部分手动控制,并且观察表示从光电检测器的最大输出的方法的仪表或类似装置。
    • 7. 发明授权
    • Micromachined magnetic field sensors
    • 微加工磁场传感器
    • US08395381B2
    • 2013-03-12
    • US12833390
    • 2010-07-09
    • Chiung C. LoJoseph SeegerMartin Lim
    • Chiung C. LoJoseph SeegerMartin Lim
    • G01R33/02G01R33/09G01R33/07
    • G01R33/0011G01R33/07H01L2224/48091H01L2224/73265H01L2924/00014
    • A micromachined magnetic field sensor integrated with electronics is disclosed. The magnetic field sensors utilize Hall-effect sensing mechanisms to achieve 3-axis sensing. A Z axis sensor can be fabricated either on a device layer or on a conventional IC substrate with the design of conventional horizontal Hall plates. An X and Y axis sensor are constructed on the device layer. In some embodiments, a magnetic flux concentrator is applied to enhance the performance of the magnetic field sensor. In some embodiments, the magnetic field sensors are placed on slope sidewalls to achieve 3-axis magnetic sensing system. In some embodiments, a stress isolation structure is incorporated to lower the sensor offset. The conventional IC substrate and device layer are connected electrically to form a 3-axis magnetic sensing system. The magnetic field sensor can also be integrated with motion sensors that are constructed in the similar technology.
    • 公开了一种与电子器件集成的微加工磁场传感器。 磁场传感器利用霍尔效应感测机构实现3轴感测。 Z轴传感器可以在设备层或常规IC基板上制造,具有常规水平霍尔板的设计。 X和Y轴传感器构造在器件层上。 在一些实施例中,施加磁通集中器以增强磁场传感器的性能。 在一些实施例中,磁场传感器被放置在倾斜侧壁上以实现3轴磁感测系统。 在一些实施例中,结合了应力隔离结构以降低传感器偏移。 常规IC基板和器件层电连接以形成3轴磁感测系统。 磁场传感器也可以与以类似技术构造的运动传感器集成。