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    • 2. 发明申请
    • METHOD AND DEVICE FOR PRODUCING A SEMI-FINISHED GOOD OR A SECURITY DOCUMENT COMPRISING THE SEMI-FINISHED GOOD
    • 方法和设备用于生产半成品或半决赛全面的安全文档
    • WO2010149358A8
    • 2011-03-24
    • PCT/EP2010003785
    • 2010-06-22
    • BUNDESDRUCKEREI GMBHSTIEMERT PETERMAERTENS DETLEF
    • STIEMERT PETERMAERTENS DETLEF
    • G06K19/077
    • G06K19/07749G06K19/0775G06K19/07754G06K19/07783
    • The invention relates to a method for producing a semi-finished good (21) or a security document (20) comprising the semi-finished good (21), to the semi-finished good (21), and to a device for the production thereof. A semi-finished good (21) comprises at least one substrate (1), a circuit structure (5) having at least one chip contact region (6), and an antenna structure (2) having at least one antenna contact region (4), wherein the antenna structure (2) and the circuit structure (5) are applied to the substrate (1) so that the at least one antenna contact region (4) and the at least one chip contact region (6) are adjacent to each other and overlap at least partially in an overlapping region (8), and an electrical contact is formed between the at least one antenna contact region (4) and the at least one chip contact region (6) in the overlap region, wherein at least one pass-through opening (7) is formed in the overlap region (8), permeating the at least one antenna contact region (4) and the at least one chip contact region (6).
    • 本发明涉及一种方法,用于其生产的制造预成型坯(21)或半成品(21),包括在安全文件(20),所述半成品(21)和装置(30)。 提供了一种半成品(21),包括至少一个衬底(1),电路图案(5),具有至少一个芯片接触区域(6),以及天线结构(2)与至少一个天线接触区(4),其中,所述天线结构(2 )与基板(1)上的电路图案(5)被施加,使得所述至少一个天线接触区(4)和所述至少一个芯片接触区域(6)彼此相邻,并在重叠区域8)至少部分地重叠的平面(延伸和 (6)形成在所述重叠区域(8),其中在所述重叠区域中形成至少一个通道开口(7)(8)连接所述至少一个天线接触区域中的至少一个天线接触区(4)和所述至少一个芯片接触区之间的电接触(4) 和所述至少一个芯片接触区域(6)穿透。