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1. 发明专利

AT464127T 未知
公开(公告)号：AT464127T
公开(公告)日：2010-04-15
申请号：AT01906946
申请日：2001-02-02
申请人： BREWER SCIENCE INC
发明人： PAGEL RUSSELL , MCCUTCHEON JEREMY , KOHNE JEFFREY
IPC分类号： B05C5/00 , B05C5/02 , B05C11/10 , B65D47/22 , F16K7/06 , H01L21/00
摘要： A dispenser (10) for flowable, viscous material (52) is provided which includes a reservoir (50) for the material (52) with an elongated, synthetic resin deformable outlet tube (80) presenting an outlet end (82) coupled to the reservoir (50). A flow-controlling assembly (16) including a tube-engaging element (84, 132, 150, 158) and an actuator linkage assembly (86, 130, 144, 154) allows precise on-off operation of the dispenser (10). In the flow-permitting position, the element (84, 132, 150, 158) is adjacent the tube (80). When it is desired to terminate material flow, the actuator linkage assembly (86, 130, 144, 154) is operated to cause the element (84, 132,150, 158) to move into deforming engagement with the tube (80) against a backing surface (41); continued movement of the element (84, 132, 150, 158) along the length of the tube (80) in a direction away from outlet end (82) generates a suction force causing material (52) adjacent the end (82) to be drawn into the confines of the tube (80). This prevents air-drying of the material (52) at outlet end (82), ensuring continued smooth operation of the dispenser (10) while minimizing material loss. Preferably, the assembly (16) applies resilient flow-blocking force against the outlet tube (80).

2. 发明专利

SG10201506168WA MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 未知
公开(公告)号：SG10201506168WA
公开(公告)日：2015-09-29
申请号：SG10201506168W
申请日：2011-08-05
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY

3. 发明专利

CA2711266A1 METHOD FOR REVERSIBLY MOUNTING A DEVICE WAFER TO A CARRIER SUBSTRATE 未知
公开(公告)号：CA2711266A1
公开(公告)日：2009-07-30
申请号：CA2711266
申请日：2009-01-23
申请人： BREWER SCIENCE INC
发明人： FLAIM TONY D , MCCUTCHEON JEREMY
IPC分类号： H01L23/12 , H01L23/48
摘要： New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

4. 发明专利

SG10201509693YA Multiple Bonding Layers For Thin-Wafer Handling 未知
公开(公告)号：SG10201509693YA
公开(公告)日：2015-12-30
申请号：SG10201509693Y
申请日：2011-08-05
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY

5. 发明专利

PT2238618E MÉTODO PARA MONTAGEM REVERSÍVEL DE UMA BOLACHA DE DISPOSITIVO NUM SUBSTRATO DE SUPORTE 未知
公开(公告)号：PT2238618E
公开(公告)日：2015-09-03
申请号：PT09703204
申请日：2009-01-23
申请人： BREWER SCIENCE INC
发明人： FLAIM TONY D , MCCUTCHEON JEREMY
IPC分类号： H01L23/12 , H01L21/683 , H01L23/48

6. 发明专利

SG2014014922A MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 未知
公开(公告)号：SG2014014922A
公开(公告)日：2014-07-30
申请号：SG2014014922
申请日：2011-08-05
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY

7. 发明专利

SG187739A1 MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 未知
公开(公告)号：SG187739A1
公开(公告)日：2013-03-28
申请号：SG2013009121
申请日：2011-08-05
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY
摘要： Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

8. 发明申请

WO2009094558A3 METHOD FOR REVERSIBLY MOUNTING A DEVICE WAFER TO A CARRIER SUBSTRATE 审中-公开
标题翻译：将装置晶片可逆地安装到载体衬底的方法
公开(公告)号：WO2009094558A3
公开(公告)日：2009-09-24
申请号：PCT/US2009031862
申请日：2009-01-23
申请人： BREWER SCIENCE INC , FLAIM TONY D , MCCUTCHEON JEREMY
发明人： FLAIM TONY D , MCCUTCHEON JEREMY
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L21/6835 , H01L21/6836 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2924/0002 , H01L2924/19041 , Y10T428/31678 , H01L2924/00
摘要： New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.
摘要翻译：提供了由这些方法形成的新的临时粘合方法和制品。该方法包括仅在其外周界将器件晶片接合到载体晶片或衬底，以便在后续处理和处理期间帮助保护器件晶片及其器件位置。通过该方法形成的边缘结合在化学上和耐热性上，但也可以被软化，溶解或机械破碎，以便在制造过程中的适当阶段，以非常低的力和在室温或接近室温容易地分离晶片。

9. 发明公开

EP2601676A4 MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING 有权
标题翻译：多层用于薄膜WAFER
公开(公告)号：EP2601676A4
公开(公告)日：2014-08-06
申请号：EP11836791
申请日：2011-08-05
申请人： BREWER SCIENCE INC
发明人： PULIGADDA RAMA , ZHONG XING-FU , FLAIM TONY D , MCCUTCHEON JEREMY
IPC分类号： H01L21/20 , H01L21/683
CPC分类号： H01L21/6835 , B32B38/0008 , B32B38/10 , B32B43/006 , H01L21/2007 , H01L21/6836 , H01L24/83 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/351 , Y10T156/10 , Y10T156/11 , Y10T156/1126 , Y10T428/24942 , Y10T428/26 , Y10T428/31511 , Y10T428/31551 , Y10T428/31663 , Y10T428/31721 , Y10T428/31725 , Y10T428/31935 , Y10T428/31938 , H01L2924/00
摘要： Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

10. 发明申请

WO2013036638A3 USE OF MEGASONIC ENERGY TO ASSIST EDGE BOND REMOVAL IN A ZONAL TEMPORARY BONDING PROCESS 审中-公开
标题翻译：使用微波能量来辅助临时粘结过程中的边缘去除
公开(公告)号：WO2013036638A3
公开(公告)日：2013-07-11
申请号：PCT/US2012053962
申请日：2012-09-06
申请人： BREWER SCIENCE INC , MCCUTCHEON JEREMY , STROTHMANN JAMES E
发明人： MCCUTCHEON JEREMY , STROTHMANN JAMES E
IPC分类号： H01L21/306
CPC分类号： H01L21/67092 , H01L21/2007 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381
摘要： New methods of weakening the bonds between a bonded pair of wafers or substrates are provided. The substrates are preferably bonded at their outer peripheries. When it is desired to separate the substrates, they are contacted with a solvent system suitable for weakening, softening, and/or dissolving the bonding composition at their outer peripheries. Megasonic energy is simultaneously directed at the substrates (and preferably the bonding composition itself), so as to increase solvent penetration into the composition, thus decreasing the time needed for substrate separation and increasing throughput.
摘要翻译：提供了削弱一对粘合的晶片或基板之间的键的新方法。基材优选在其外周粘合。当需要分离衬底时，它们与适于在其外周处弱化，软化和/或溶解粘结组合物的溶剂系统接触。超声波能量同时引导到基底（并且优选粘合组合物本身），以便增加溶剂渗透到组合物中，从而减少基底分离所需的时间并增加生产量。

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