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1. 发明申请

US20120119231A1 LED PACKAGE STRUCTURE WITH A DEPOSITED-TYPE PHOSPHOR LAYER AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：具有沉积型磷光体层的LED封装结构及其制造方法
公开(公告)号：US20120119231A1
公开(公告)日：2012-05-17
申请号：US13181662
申请日：2011-07-13
申请人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
IPC分类号： H01L33/08 , H01L33/58
CPC分类号： H01L25/0753 , B29C41/042 , B29C41/20 , H01L24/97 , H01L33/508 , H01L2224/48091 , H01L2224/48247 , H01L2933/0041 , H01L2933/005 , H01L2924/00014
摘要： An LED package structure with a deposited-type phosphor layer includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes at least one circuit substrate. The light-emitting unit includes a plurality of LED chips disposed on and electrically connected to the at least one circuit substrate. The package unit includes at least one package resin body formed by a mold structure. The at least one package resin body is formed on the at least one circuit substrate to cover the LED chips, and the at least one package resin body includes a continuous phosphor layer formed therein and deposited on outer surfaces of the LED chips by centrifugal force. Hence, the instant disclosure provides the continuous phosphor layer with the deposited phosphor powders for covering the outer surfaces of the LED chips, thus the light-emitting efficiency of the LED package structure can be increased actually.
摘要翻译：具有沉积型磷光体层的LED封装结构包括基板单元，发光单元和封装单元。基板单元包括至少一个电路基板。发光单元包括设置在至少一个电路基板上并与其电连接的多个LED芯片。封装单元包括由模具结构形成的至少一个封装树脂体。所述至少一个封装树脂体形成在所述至少一个电路基板上以覆盖所述LED芯片，并且所述至少一个封装树脂体包括形成在其中的连续荧光体层，并且通过离心力沉积在所述LED芯片的外表面上。因此，本公开为连续荧光体层提供了用于覆盖LED芯片的外表面的沉积的荧光体粉末，从而可以实际上增加LED封装结构的发光效率。

2. 发明申请

US20120106171A1 LED PACKAGE STRUCTURE 审中-公开
标题翻译： LED封装结构
公开(公告)号：US20120106171A1
公开(公告)日：2012-05-03
申请号：US13176799
申请日：2011-07-06
申请人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YU-JEN CHENG , JACK CHEN
IPC分类号： F21V15/00
CPC分类号： H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： An LED package structure includes a conductive substrate unit, a first insulative unit, a second insulative unit, a light-emitting unit and a package unit. The conductive substrate unit includes at least two conductive bases and at least one gap is formed between the two conductive bases. The first insulative unit includes at least one first insulative layer filled in the gap to join the two conductive bases. The second insulative unit includes at least one second insulative layer disposed on the conductive substrate unit and a plurality of openings passing through the second insulative layer for exposing one part of the top surface of each conductive base. The light-emitting unit includes at least one light-emitting element passing one of the openings and electrically connected between the two conductive bases. The package unit includes a package resin body disposed on the second insulative unit to cover the light-emitting element.
摘要翻译： LED封装结构包括导电基板单元，第一绝缘单元，第二绝缘单元，发光单元和封装单元。导电基板单元包括至少两个导电基底，并且在两个导电基底之间形成至少一个间隙。第一绝缘单元包括填充在间隙中以连接两个导电基底的至少一个第一绝缘层。第二绝缘单元包括设置在导电基板单元上的至少一个第二绝缘层和穿过第二绝缘层的多个开口，用于暴露每个导电基底的顶表面的一部分。发光单元包括通过其中一个开口并电连接在两个导电基底之间的至少一个发光元件。封装单元包括设置在第二绝缘单元上以覆盖发光元件的封装树脂体。

3. 发明申请

US20120037937A1 LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译： LED封装结构及其制造方法
公开(公告)号：US20120037937A1
公开(公告)日：2012-02-16
申请号：US12987296
申请日：2011-01-10
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/56
CPC分类号： H01L33/642 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： An LED package structure includes a substrate unit, a conductive unit, a heat-dissipating unit, a light-emitting unit and a package unit. The substrate unit includes an insulating substrate. The conductive unit includes two top conductive pads disposed on top surface of the insulating substrate, two bottom conductive pads disposed on bottom surface of the insulating substrate, and a plurality of penetrating conductive posts passing the insulating substrate. The two top conducive pads respectively electrically connect the two bottom conductive pads through the penetrating conductive posts. The heat-dissipating unit includes a top heat-dissipating block and a bottom heat-dissipating block respectively disposed on top and bottom surfaces of the insulating substrate. The light-emitting unit includes a light-emitting element on the top heat-dissipating block and electrically connected between the two top conductive pads. The package unit includes a package resin on the conductive unit and the heat-dissipating unit to cover the light-emitting element.
摘要翻译： LED封装结构包括基板单元，导电单元，散热单元，发光单元和封装单元。基板单元包括绝缘基板。导电单元包括设置在绝缘基板的顶表面上的两个顶部导电焊盘，设置在绝缘基板的底表面上的两个底部导电焊盘以及穿过绝缘基板的多个穿透导电柱。两个顶部导电垫分别通过穿透导电柱电连接两个底部导电焊盘。散热单元包括顶部散热块和分别设置在绝缘基板的顶表面和底表面上的底部散热块。发光单元包括顶部散热块上的发光元件，并电连接在两个顶部导电焊盘之间。封装单元包括导电单元上的封装树脂和覆盖发光元件的散热单元。

4. 发明申请

US20110155436A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20110155436A1
公开(公告)日：2011-06-30
申请号：US12649824
申请日：2009-12-30
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K1/11 , B26D3/00
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

5. 发明申请

US20120009699A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASE LIGHT-EMITTING EFFICIENCY AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于增加发光效率的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20120009699A1
公开(公告)日：2012-01-12
申请号：US13238101
申请日：2011-09-21
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/52
CPC分类号： H01L33/38 , H01L33/508 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A wafer level LED package structure for increasing light-emitting efficiency includes: a light-emitting unit, an insulating unit, two first conductive units and two second conductive units. The light-emitting unit has a light-emitting body, a positive conductive layer, a negative conductive layer, and a reflecting insulating layer formed between the positive conductive layer and the negative conductive layer. The light-emitting body has a bottom material layer and a top material layer. The insulating unit is formed around an outer area of a top surface of the bottom material layer and formed on a top surface of the reflecting insulating layer. One first conductive unit is formed on one part of the positive conductive layer and the insulating unit, and another first conductive unit is formed on one part of the negative conductive layer and the insulating unit. The two second conductive units are respectively formed on the two first conductive units.
摘要翻译：用于提高发光效率的晶片级LED封装结构包括：发光单元，绝缘单元，两个第一导电单元和两个第二导电单元。发光单元具有形成在正导电层和负导电层之间的发光体，正导电层，负极导电层和反射绝缘层。发光体具有底部材料层和顶部材料层。绝缘单元形成在底部材料层的顶表面的外部区域周围，并形成在反射绝缘层的顶表面上。一个第一导电单元形成在正导电层和绝缘单元的一部分上，另一个第一导电单元形成在负导电层和绝缘单元的一部分上。两个第二导电单元分别形成在两个第一导电单元上。

6. 发明申请

US20110147774A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于增加发光效率和散热效果的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20110147774A1
公开(公告)日：2011-06-23
申请号：US12759077
申请日：2010-04-13
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/30 , H01L33/60 , H01L33/48 , H01L33/64 , H01L21/78
CPC分类号： H01L33/46 , H01L33/0095 , H01L33/486 , H01L33/50 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

7. 发明申请

US20110003434A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于实现无缝连接电路的半导体芯片封装结构，不使用线形焊接工艺及其制造方法
公开(公告)号：US20110003434A1
公开(公告)日：2011-01-06
申请号：US12877351
申请日：2010-09-08
申请人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , YUN-HAO CHANG , JACK CHEN
IPC分类号： H01L21/50
CPC分类号： H01L33/62 , H01L21/6835 , H01L23/3121 , H01L24/19 , H01L24/96 , H01L24/97 , H01L33/486 , H01L2221/68359 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/48091 , H01L2224/48247 , H01L2924/01027 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor chip package structure for achieving face-up electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a substrate unit, a first insulative unit, a first conductive unit, a second conductive unit, and a second insulative unit. The package unit has a central receiving groove and an outer receiving groove formed around the central receiving groove. The semiconductor chip has a plurality of conductive pads. The first insulative unit has a first insulative layer formed between the conductive pads. The first conductive unit has a plurality of first conductive layers. The second conductive unit has a plurality of second conductive layers formed on the first conductive layers. The second insulative unit is formed between the first conductive layers and between the second conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现面朝上电连接的半导体芯片封装结构包括封装单元，半导体芯片，基板单元，第一绝缘单元，第一导电单元，第二导电单元和第二导电单元绝缘单位封装单元具有中心接收槽和围绕中央接收槽形成的外部接收槽。半导体芯片具有多个导电焊盘。第一绝缘单元具有形成在导电焊盘之间的第一绝缘层。第一导电单元具有多个第一导电层。第二导电单元具有形成在第一导电层上的多个第二导电层。第二绝缘单元形成在第一导电层之间和第二导电层之间。

8. 发明申请

US20120122254A1 WHITE LIGHT-EMITTING DIODE PACKAGE STRUCTURE FOR SIMPLIFYING PACKAGE PROCESS AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：用于简化封装工艺的白色发光二极管封装结构及其制造方法
公开(公告)号：US20120122254A1
公开(公告)日：2012-05-17
申请号：US13332544
申请日：2011-12-21
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/50
CPC分类号： H01L33/508 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： A white light-emitting diode package structure for simplifying package process includes a substrate unit, a light-emitting unit, a phosphor unit and a conductive unit. The light-emitting unit is disposed on the substrate, and the light-emitting unit has a positive conductive layer and a negative conductive layer. The phosphor unit has a phosphor layer formed on the light-emitting unit and at least two openings for respectively exposing one partial surface of the positive electrode layer and one partial surface of the negative electrode layer. The conductive unit has at least two conductive wires respectively passing through the two openings in order to electrically connect the positive electrode layer with the substrate unit and electrically connect the negative electrode layer with the substrate unit.
摘要翻译：用于简化封装处理的白色发光二极管封装结构包括衬底单元，发光单元，荧光体单元和导电单元。发光单元设置在基板上，发光单元具有正导电层和负导电层。荧光体单元具有形成在发光单元上的荧光体层和用于分别暴露正极层的一个部分表面和负极层的一个部分表面的至少两个开口。导电单元具有分别通过两个开口的至少两根导线，以将正电极层与衬底单元电连接并将负电极层与衬底单元电连接。

9. 发明申请

US20110304020A1 WAFER LEVEL DIODE PACKAGE STRUCTURE 审中-公开
公开(公告)号：US20110304020A1
公开(公告)日：2011-12-15
申请号：US13217380
申请日：2011-08-25
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L29/861
CPC分类号： H01L29/0657 , H01L21/6836 , H01L23/31 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/96 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05 , H01L2224/12105 , H01L2224/13099 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/0101 , H01L2924/01011 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01046 , H01L2924/0107 , H01L2924/01082 , H01L2924/014 , H01L2924/181 , H01L2924/00015 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A wafer level vertical diode package structure includes a first semiconductor layer, a second semiconductor layer, an insulative unit, a first conductive structure, and a second conductive structure. The second semiconductor layer is connected with one surface of the first semiconductor layer. The insulative unit is disposed around a lateral side of the first semiconductor layer and a lateral side of the second semiconductor layer. The first conductive structure is formed on a top surface of the first semiconductor layer and on one lateral side of the insulative layer. The second conductive structure is formed on a top surface of the second semiconductor layer and on another opposite lateral side of the insulative layer.
摘要翻译：晶圆级垂直二极管封装结构包括第一半导体层，第二半导体层，绝缘单元，第一导电结构和第二导电结构。第二半导体层与第一半导体层的一个表面连接。绝缘单元围绕第一半导体层的侧面和第二半导体层的横向侧设置。第一导电结构形成在第一半导体层的顶表面和绝缘层的一个侧面上。第二导电结构形成在第二半导体层的顶表面上，在绝缘层的另一个相对的侧面上。

10. 发明申请

US20120096710A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20120096710A1
公开(公告)日：2012-04-26
申请号：US13338410
申请日：2011-12-28
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K3/02
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

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