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1. 发明申请

US20120014087A1 SIMPLE DETACHABLE ILLUMINATION STRUCTURE AND LAMP TUBE 有权
标题翻译：简单的可拆卸照明结构和灯管
公开(公告)号：US20120014087A1
公开(公告)日：2012-01-19
申请号：US13008164
申请日：2011-01-18
申请人： BILY WANG , CHI-TSENG CHANG , CHI-KANG LO , ZHEN HAO FAN
发明人： BILY WANG , CHI-TSENG CHANG , CHI-KANG LO , ZHEN HAO FAN
IPC分类号： F21V9/16 , F21V29/00
CPC分类号： F21V29/503 , F21K9/27 , F21V19/003 , F21V19/045 , F21V23/005 , F21V29/20 , F21V29/506 , F21Y2103/10 , F21Y2115/10
摘要： A simple detachable illumination lamp tube includes a tube unit, a heat-dissipating unit, a light-emitting unit, a support unit and a lateral cover unit. The tube unit has a light-permitting hollow tube. The heat-dissipating unit has a heat-dissipating substrate received in the light-permitting hollow tube. The heat-dissipating substrate has two opposite lateral sides contacting the inner surface of the light-permitting hollow tube. The light-emitting unit has a plurality of strip light-emitting modules received in the light-permitting hollow tube. The strip light-emitting modules are disposed on the heat-dissipating substrate and electrically connected in sequence. The support unit has a plurality of support elements received in the light-permitting hollow tube and disposed between a bottom side of the heat-dissipating substrate and the inner surface of the light-permitting hollow tube. The lateral cover unit has two lateral covers installed on two ends of the light-permitting hollow tube.
摘要翻译：简单的可拆卸照明灯管包括管单元，散热单元，发光单元，支撑单元和侧盖单元。管单元具有允许光的中空管。散热单元具有容纳在光允许中空管中的散热基板。散热基板具有与允许允许中空管的内表面接触的两个相对的侧面。发光单元具有容纳在光允许中空管中的多个条状发光模块。带状发光模块设置在散热基板上并依次电连接。支撑单元具有容纳在允许光的中空管中并且设置在散热基板的底侧和允许光的中空管的内表面之间的多个支撑元件。侧盖单元具有安装在允许中空管的两端的两个侧盖。

2. 发明申请

US20120069583A1 LAMP HEAD ASSEMBLY AND LIGHTING LAMP TUBE 有权
标题翻译：灯头组件和灯管
公开(公告)号：US20120069583A1
公开(公告)日：2012-03-22
申请号：US12987291
申请日：2011-01-10
申请人： BILY WANG , CHI-TSENG CHANG , CHI-KANG LO , ZHEN-HAO FAN
发明人： BILY WANG , CHI-TSENG CHANG , CHI-KANG LO , ZHEN-HAO FAN
IPC分类号： F21V19/02
CPC分类号： F21V21/30 , F21K9/272 , F21Y2103/10 , F21Y2115/10
摘要： A lamp head assembly includes an outer head unit, an inner head unit, and an elastic pressing unit. The outer head unit includes at least two conductive pins. The inner head unit is disposed rotatably in the outer head unit. The elastic pressing unit is disposed movably in the outer head unit for selectively positioning the position of the inner head unit relative to the outer head unit or the position of the outer head unit relative to the inner head unit, wherein the elastic pressing unit includes a pressing element selectively exposed from the outer head unit.
摘要翻译：灯头组件包括外头单元，内头单元和弹性按压单元。外头单元包括至少两个导电销。内头单元可旋转地设置在外头单元中。弹性按压单元可移动地设置在外头单元中，用于相对于外头单元选择性地定位内头单元的位置或外头单元相对于内头单元的位置，其中弹性按压单元包括从外部头部单元选择性地暴露的按压元件。

3. 发明申请

US20120037937A1 LED PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译： LED封装结构及其制造方法
公开(公告)号：US20120037937A1
公开(公告)日：2012-02-16
申请号：US12987296
申请日：2011-01-10
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H01L33/56
CPC分类号： H01L33/642 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014
摘要： An LED package structure includes a substrate unit, a conductive unit, a heat-dissipating unit, a light-emitting unit and a package unit. The substrate unit includes an insulating substrate. The conductive unit includes two top conductive pads disposed on top surface of the insulating substrate, two bottom conductive pads disposed on bottom surface of the insulating substrate, and a plurality of penetrating conductive posts passing the insulating substrate. The two top conducive pads respectively electrically connect the two bottom conductive pads through the penetrating conductive posts. The heat-dissipating unit includes a top heat-dissipating block and a bottom heat-dissipating block respectively disposed on top and bottom surfaces of the insulating substrate. The light-emitting unit includes a light-emitting element on the top heat-dissipating block and electrically connected between the two top conductive pads. The package unit includes a package resin on the conductive unit and the heat-dissipating unit to cover the light-emitting element.
摘要翻译： LED封装结构包括基板单元，导电单元，散热单元，发光单元和封装单元。基板单元包括绝缘基板。导电单元包括设置在绝缘基板的顶表面上的两个顶部导电焊盘，设置在绝缘基板的底表面上的两个底部导电焊盘以及穿过绝缘基板的多个穿透导电柱。两个顶部导电垫分别通过穿透导电柱电连接两个底部导电焊盘。散热单元包括顶部散热块和分别设置在绝缘基板的顶表面和底表面上的底部散热块。发光单元包括顶部散热块上的发光元件，并电连接在两个顶部导电焊盘之间。封装单元包括导电单元上的封装树脂和覆盖发光元件的散热单元。

4. 发明申请

US20110155436A1 CONDUCTIVE SUBSTRATE STRUCTURE WITH CONDUCTIVE CHANNELS FORMED BY USING A TWO-SIDED CUT APPROACH AND A METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有通过使用双面切割方法形成的导电通道的导电基板结构及其制造方法
公开(公告)号：US20110155436A1
公开(公告)日：2011-06-30
申请号：US12649824
申请日：2009-12-30
申请人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
发明人： BILY WANG , SUNG-YI HSIAO , JACK CHEN
IPC分类号： H05K1/11 , B26D3/00
CPC分类号： B26D3/06 , H05K3/0044 , H05K3/0052 , H05K3/107 , H05K3/403 , Y10T29/49155 , Y10T29/49156 , Y10T83/0524
摘要： A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
摘要翻译：导电基板结构包括基板单元，导电焊盘单元和导电层单元。基板单元具有顶表面，底表面，两个相对的侧表面和前表面。导电焊盘单元具有至少两个彼此分离并设置在顶表面上的第一导电焊盘，以及至少两个彼此分离并设置在底表面上的第二导电焊盘。导电层单元具有形成在前表面上并分别电连接到两个第一导电焊盘的两个前侧的至少两个第一导电层，以及分别形成在两个相对的侧表面上并分别电连接的至少两个第二导电层到两个第二导电焊盘的两个相对的侧面。两个第一导电层分别与两个第二导电层电连接。

5. 发明申请

US20110018019A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 有权
标题翻译：不使用线束连接工艺实现片芯型电气连接的半导体芯片封装结构及其制造方法
公开(公告)号：US20110018019A1
公开(公告)日：2011-01-27
申请号：US12648646
申请日：2009-12-29
申请人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
发明人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
IPC分类号： H01L33/00 , H01L31/18 , H01L21/78 , H01L31/02 , H01L23/48
CPC分类号： H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/96 , H01L33/62 , H01L2224/04042 , H01L2224/05599 , H01L2224/24137 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
摘要翻译：用于在不使用引线接合工艺的情况下实现倒装芯片电连接的半导体芯片封装结构包括封装单元，半导体芯片，第一绝缘层，第一导电层，第二绝缘层和第二导电层。包装单元具有接收槽。半导体芯片被容纳在接收槽中并且具有设置在其顶表面上的多个导电焊盘。第一绝缘层形成在导电焊盘之间以使导电焊盘绝缘。第一导电层形成在第一绝缘层和封装单元上，并且每个第一导电层的一侧电连接到相应的导电焊盘。第二绝缘层形成在第一导电层之间，以使第一导电层彼此绝缘。第二导电层分别形成在第一导电层的另一相对侧上。

6. 发明申请

US20100301349A1 WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：用于增加发光效率和散热效果的WAFER LEVEL LED封装结构及其制造方法
公开(公告)号：US20100301349A1
公开(公告)日：2010-12-02
申请号：US12856968
申请日：2010-08-16
申请人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
发明人： BILY WANG , JONNIE CHUANG , CHUAN-FA LIN , CHI-WEN HUNG
IPC分类号： H01L33/60 , H01L33/30 , H01L21/50
CPC分类号： H01L23/544 , H01L23/60 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/48 , H01L25/167 , H01L27/0248 , H01L33/46 , H01L33/62 , H01L2223/54493 , H01L2224/0401 , H01L2224/0603 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/16 , H01L2224/16145 , H01L2224/48091 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2224/45111 , H01L2224/131 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A wafer level LED package structure includes a light-emitting unit, a reflecting unit, a first conductive unit and a second conductive unit. The light-emitting unit has a substrate body, a light-emitting body disposed on the substrate body, a positive and a negative conductive layers formed on the light-emitting body, and a light-emitting area formed in the light-emitting body. The reflecting unit has a reflecting layer formed between the positive and the negative conductive layers and on the substrate body for covering external sides of the light-emitting body. The first conductive unit has a first positive conductive layer formed on the positive conductive layer and a first negative conductive layer formed on the negative conductive layer. The second conductive unit has a second positive conductive structure formed on the first positive conductive layer and a second negative conductive structure formed on the first negative conductive layer.
摘要翻译：晶圆级LED封装结构包括发光单元，反射单元，第一导电单元和第二导电单元。发光单元具有基板主体，设置在基板主体上的发光体，形成在发光体上的正极和负极导电层，以及形成在发光体中的发光区域。反射单元具有形成在正导电层和负导电层之间的反射层和用于覆盖发光体的外侧的基板主体。第一导电单元具有形成在正导电层上的第一正导电层和形成在负导电层上的第一负导电层。第二导电单元具有形成在第一正导电层上的第二正导电结构和形成在第一负导电层上的第二负导电结构。

7. 发明申请

US20120285869A1 LED PACKAGE CHIP CLASSIFICATION SYSTEM 有权
标题翻译： LED包装芯片分类系统
公开(公告)号：US20120285869A1
公开(公告)日：2012-11-15
申请号：US13204616
申请日：2011-08-05
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
IPC分类号： B07C5/344
CPC分类号： G01R31/01 , G01R31/2635
摘要： An LED package chip classification system includes a rotation unit for transporting a plurality of LED package chips, a chip test unit, and a chip classification unit. The rotation unit includes a rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions. Each LED package chip has a positive electrode pad and a negative electrode pad disposed on the bottom side thereof The chip test unit includes a chip test module adjacent to the rotation unit for testing each LED package chip. The chip classification unit includes a plurality of chip classification modules adjacent to the rotation unit for classifying the LED package chips. Therefore, the LED package chips can be classified by matching the rotation unit, the chip test unit, and the chip classification unit.
摘要翻译： LED封装芯片分类系统包括用于传输多个LED封装芯片的转动单元，芯片测试单元和芯片分类单元。旋转单元包括旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个抽吸排气双用途开口。每个LED封装芯片具有设置在其底侧的正极焊盘和负极焊盘。芯片测试单元包括与用于测试每个LED封装芯片的旋转单元相邻的芯片测试模块。芯片分类单元包括与用于分类LED封装芯片的旋转单元相邻的多个芯片分类模块。因此，可以通过匹配旋转单元，芯片测试单元和芯片分类单元来分类LED封装芯片。

8. 发明申请

US20110229991A1 SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FLIP-CHIP TYPE ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME 有权
公开(公告)号：US20110229991A1
公开(公告)日：2011-09-22
申请号：US13150299
申请日：2011-06-01
申请人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
发明人： BILY WANG , HUNG-CHOU YANG , JENG-RU CHANG
IPC分类号： H01L33/62
CPC分类号： H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3121 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/96 , H01L33/62 , H01L2224/04042 , H01L2224/05599 , H01L2224/24137 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01078 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.

9. 发明申请

US20080160658A1 MOLD STRUCTURE FOR PACKAGING LED CHIPS AND METHOD THEREOF 有权
标题翻译：用于包装LED灯的模具结构及其方法
公开(公告)号：US20080160658A1
公开(公告)日：2008-07-03
申请号：US11854066
申请日：2007-09-12
申请人： BILY WANG , JONNIE CHUANG , HUI-YEN HUANG
发明人： BILY WANG , JONNIE CHUANG , HUI-YEN HUANG
IPC分类号： H01L23/28 , B22C9/12
CPC分类号： H01L21/565 , H01L21/561 , H01L2224/97 , H01L2224/85
摘要： A mold structure for packaging LED chips includes a top mold and a bottom mold. The bottom mold is mated with the top mold. The bottom mold has a main flow channel, a plurality of receiving spaces formed beside the main flow channel, a plurality of secondary flow channels for respectively and transversely communicating the receiving spaces with each other, and a plurality of ejection pins penetrating through the bottom mold.
摘要翻译：用于封装LED芯片的模具结构包括顶模和底模。底模与上模相配。底模具有主流道，在主流路旁边形成有多个接收空间，分别形成多个用于使接收空间相互横向连通的二次流动通道，以及贯穿底模的多个排出销。

10. 发明申请

US20130015372A1 LIGHT-EMITTING ELEMENT DETECTION AND CLASSIFICATION DEVICE 有权
标题翻译：发光元件检测和分类装置
公开(公告)号：US20130015372A1
公开(公告)日：2013-01-17
申请号：US13182425
申请日：2011-07-13
申请人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
发明人： BILY WANG , KUEI-PAO CHEN , HSIN-CHENG CHEN
IPC分类号： G01N21/01
CPC分类号： G01R31/01 , G01R31/2635
摘要： A light-emitting element detection and classification device includes a rotation unit for transporting a plurality of light-emitting elements, a chip detection unit, and a chip classification unit. The rotation unit includes at least one rotary turntable, a plurality of receiving portions formed on the rotary turntable, and a plurality of suction-exhaust dual-purpose openings respectively disposed in the receiving portions, each receiving portion selectively receives at least one of the light-emitting elements. Each light-emitting element is an LED package chip having a positive electrode pad and a negative electrode pad disposed on the bottom side thereof. The chip detection unit includes at least one chip detection module adjacent to the rotation unit for detecting each light-emitting element. The chip classification unit includes at least one chip classification module adjacent to the rotation unit for classifying the LED package chips that have been detected by the at least one chip detection module.
摘要翻译：发光元件检测和分类装置包括用于传送多个发光元件的旋转单元，芯片检测单元和芯片分类单元。旋转单元包括至少一个旋转转盘，形成在旋转转台上的多个接收部分和分别设置在接收部分中的多个吸排二重用开口，每个接收部分选择性地接收至少一个光 - 发行元素。每个发光元件是具有设置在其底侧上的正极焊盘和负极焊盘的LED封装芯片。芯片检测单元包括与用于检测每个发光元件的旋转单元相邻的至少一个芯片检测模块。芯片分类单元包括与旋转单元相邻的至少一个芯片分类模块，用于对由至少一个芯片检测模块检测到的LED封装芯片进行分类。

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