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1. 发明授权

US06350623B1 Method of forming intermediate structures in porous substrates in which electrical and optical microdevices are fabricated and intermediate structures formed by the same 失效
标题翻译：在其中制造电和光学微器件的多孔基板中形成中间结构的方法和由其形成的中间结构
公开(公告)号：US06350623B1
公开(公告)日：2002-02-26
申请号：US09699221
申请日：2000-10-27
申请人： Axel Scherer , Theodore Doll , V. Fuenzalida
发明人： Axel Scherer , Theodore Doll , V. Fuenzalida
IPC分类号： H01L2100
CPC分类号： H01G9/055 , B82Y20/00 , G02B6/1225 , H01F41/043 , H01L21/0334 , H01L23/5223 , H01L23/5227 , H01L2924/0002 , Y10S438/96 , H01L2924/00
摘要： The invention is a method of fabricating electrically passive components or optical elements on top or underneath of an integrated circuit by using a porous substrate that is locally filled with electrically conducting, light emitting, insulating or optically diffracting materials. The invention is directed to a method of fabricating electrically passive components like inductors, capacitors, interconnects and resistors or optical elements like light emitters, waveguides, optical switches of filters on top or underneath of an integrated circuit by using porous material layer that is locally filled with electrically conducting, light emitting, insulating or optically diffracting materials. In the illustrated embodiment the fabrication of voluminous, solenoid-type inductive elements in a porous insulating material by standard back- and front-side-lithography and contacting these two layers by electroplating micro-vias through the pores is described. By using a very dense interconnect spacing, an inter-pore capacitor structure is obtained between the metalized pores and the pore walls utilized as insulators.
摘要翻译：本发明是通过使用局部填充有导电，发光，绝缘或光学衍射材料的多孔基底来在集成电路的顶部或底部制造无源部件或光学元件的方法。本发明涉及一种通过使用局部填充的多孔材料层来制造诸如电感器，电容器，互连和电阻器的电学无源部件的方法，如光发射器，波导，集成电路的顶部或下方的滤波器的光学开关具有导电，发光，绝缘或光学衍射材料。在所示实施例中，描述了通过标准的背面和正面光刻在多孔绝缘材料中制造大量的螺线管型感应元件，并通过使微孔电穿孔而接触这两层。通过使用非常密集的互连间距，在金属化孔和用作绝缘体的孔壁之间获得孔间电容器结构。

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