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1. 发明授权

US5306778A Process for producing rubber-modified thermoplastic resin 失效
标题翻译：橡胶改性热塑性树脂的制造方法
公开(公告)号：US5306778A
公开(公告)日：1994-04-26
申请号：US16182
申请日：1993-02-11
申请人： Atushi Ishida , Katsuro Oomura , Yuji Yamamoto , Yuji Nakagawa , Tateki Furuyama , Hisao Nagai , Toshio Teramoto , Yasuo Takahashi , Hideki Ueda , Kazuhiko Yamamoto , Toshihiro Shimamura , Yoshinobu Suzuki
发明人： Atushi Ishida , Katsuro Oomura , Yuji Yamamoto , Yuji Nakagawa , Tateki Furuyama , Hisao Nagai , Toshio Teramoto , Yasuo Takahashi , Hideki Ueda , Kazuhiko Yamamoto , Toshihiro Shimamura , Yoshinobu Suzuki
IPC分类号： C08F279/02 , C08F287/00 , C08L23/02 , C08L51/04 , C08L75/04 , C08L77/00 , C08F379/02 , C08F387/00
CPC分类号： C08L23/02 , C08F279/02 , C08F287/00 , C08L51/04 , C08L75/04 , C08L77/00
摘要： A process for producing a rubber-modified thermoplastic resin, which comprises polymerizing (B) 30-100% by weight of an aromatic alkenyl compound monomer and/or an alkyl (meth)acrylate monomer and (C) 70-0% by weight of at least one other monomer compound copolymerizable therewith, in the presence of (A) a hydrogenated diene copolymer obtained by hydrogenating a diene copolymer comprising a rndom copolymer of 50% by weight or more of at least one conjugated diene and 50% by weight or less of an alkenyl aromatic compound until at least 70% by weight of the olefinic unsaturation of the diene copolymer is hydrogenated. The hydrogenated diene copolymer (A) may be a hydrogenated copolymer consisting of an A-B block copolymer or an A-B-C block copolymer (A is an alkenyl aromatic compound polymer block, B is an alkenyl aromatic compound-conjugated diene random copolymer block, and C is a polymer block composed mainly of an alkenyl aromatic compound), wherein(i) the weight ratio of the alkenyl aromatic compound/the conjugated diene is 5-50/95-50,(ii) the total amount of the alkenyl aromatic compounds of the block A and the block C in the copolymer is 3-40% by weight, and(iii) the vinyl configuration content in the conjugated diene portion of the block B is 10-90%, and wherein at least 90% of the double bonds of the conjugated diene is saturated.
摘要翻译：一种制备橡胶改性热塑性树脂的方法，其包括将（B）30-100重量％的芳族烯基化合物单体和/或（甲基）丙烯酸烷基酯单体和（C）70重量％在（A）通过氢化包含50重量％以上的至少一种共轭二烯和50重量％以下的共聚物的二烯共聚物而获得的氢化二烯共聚物的存在下，可以与其共聚的至少一种其它单体化合物的链烯基芳族化合物直到二烯共聚物的烯属不饱和键的至少70重量％被氢化。氢化二烯共聚物（A）可以是由AB嵌段共聚物或ABC嵌段共聚物（A是烯基芳香族化合物聚合物嵌段，B是烯基芳香族化合物 - 共轭二烯无规共聚物嵌段）构成的氢化共聚物，C是主要由链烯基芳族化合物组成的聚合物嵌段），其中（i）链烯基芳族化合物/共轭二烯的重量比为5-50 / 95-50，（ii）嵌段的烯基芳族化合物的总量 A和共聚物中的嵌段C为3-40重量％，和（iii）嵌段B的共轭二烯部分中的乙烯基构型含量为10-90％，并且其中至少90％共轭二烯是饱和的。

2. 发明授权

US5216074A Thermoplastic elastomer composition 失效
标题翻译：热塑性弹性体组合物
公开(公告)号：US5216074A
公开(公告)日：1993-06-01
申请号：US552303
申请日：1990-07-13
申请人： Takateru Imai , Masanobu Nagano , Masaaki Mawatari , Toshio Teramoto , Minoru Hasegawa
发明人： Takateru Imai , Masanobu Nagano , Masaaki Mawatari , Toshio Teramoto , Minoru Hasegawa
IPC分类号： C08L21/00 , C08L51/00 , C08L53/00 , C08L53/02 , C08L67/02
CPC分类号： C08L53/005 , C08C19/02 , C08L21/00 , C08L51/00 , C08L51/006 , C08L53/025 , C08L67/02 , C08L9/00 , C08L53/02 , C08L77/00 , C08L9/06
摘要： A thermoplastic elastomer composition comprising 99-1 parts by weight of (i) a hydrogenated diene polymer which is a hydrogenation product of a straight or branched chain block copolymer consisting of (C) a polybutadiene block segment having a 1,2-vinyl content of not more than 20% and (D) a block segment which is a polybutadiene or an alkenyl aromatic compound-butadiene copolymer, the butadiene portion of which has a 1,2-vinyl content of 25-95% and 1-99 parts by weight of (ii) at least one of a thermoplastic resin or a rubbery polymer.

3. 发明申请

US20090250835A1 METHOD FOR MANUFACTURING MOLDING DIE AND METHOD FOR MANUFACTURING MOLDED PRODUCT 审中-公开
标题翻译：制造模具的方法和制造模制产品的方法
公开(公告)号：US20090250835A1
公开(公告)日：2009-10-08
申请号：US12441151
申请日：2007-09-18
申请人： Katsuyuki Takase , Kimitaka Morohoshi , Toshio Teramoto
发明人： Katsuyuki Takase , Kimitaka Morohoshi , Toshio Teramoto
IPC分类号： B29C33/38 , B29C39/00
CPC分类号： B29C33/3892 , B22C9/06 , B22C23/00 , B29C64/106 , C08F257/00 , G03F7/0017 , G03F7/033 , C08F212/14 , C08F220/06 , C08F2220/1825
摘要： An object of the present invention is to provide a metal mold for micro components at low cost in a short time by using an optically molded object formed by an optical molding method. A method of manufacturing a mold for molding in accordance with the present invention includes forming a three-dimensional molded object by applying a photo-curable liquid resin composition, irradiating the photo-curable liquid resin composition with light, and removing non-cured portions of the photo-curable liquid resin composition, and forming the mold for molding based on the three-dimensional molded object, the method further including forming a metal coating covering the three-dimensional molded object, removing the three-dimensional molded object covered with the metal coating; and taking the metal coating as the mold for molding.
摘要翻译：本发明的目的是通过使用通过光学模制方法形成的光学模制物体在短时间内以低成本提供微元件的金属模具。本发明的成型用模具的制造方法包括：通过涂布光固化性液体树脂组合物，用光照射光固化型液态树脂组合物，除去未固化部分，形成三维成型体光固化性液体树脂组合物，并且基于三维模制物形成模制成型模具，该方法还包括形成覆盖三维成型物体的金属涂层，去除被金属覆盖的三维模制物体涂层; 并将金属涂层作为模制模具。

4. 发明授权

US07736577B2 Stereolithography apparatus and stereolithography method 有权
标题翻译：立体光刻设备和立体光刻法
公开(公告)号：US07736577B2
公开(公告)日：2010-06-15
申请号：US12064754
申请日：2006-08-17
申请人： Kimitaka Morohoshi , Toshio Teramoto
发明人： Kimitaka Morohoshi , Toshio Teramoto
IPC分类号： B29C35/04
CPC分类号： B29C64/135 , B33Y10/00 , B33Y30/00
摘要： A stereolithography apparatus that forms a three-dimensional model by sequentially laminating cured resin layers through repetition of a cycle of selectively applying light to liquid photocurable resin to form a cured resin layer, further applying liquid photocurable resin on the cured resin layer, and applying light to form a cured resin layer. The apparatus includes a table, a dispenser to supply the liquid photocurable resin onto the table, a recoater to apply the photocurable resin, and a controller to slow down a moving speed of the recoater based on a moving distance of the recoater during application operation of the recoater.
摘要翻译：一种立体光刻装置，其通过重复选择性地施加光到液体光固化树脂的循环来依次层压固化树脂层以形成固化树脂层，从而在固化树脂层上进一步涂布液体光固化树脂，并施加光以形成固化树脂层。该装置包括：桌子，用于将液体光固化树脂供应到桌子上的分配器，用于施加光固化树脂的再涂布器;以及控制器，用于在涂布操作期间基于重涂器的移动距离来减慢重涂器的移动速度重涂器

5. 发明授权

US5191024A Hydrogenated diene block copolymer and composition comprising the same 失效
标题翻译：加氢二烯嵌段共聚物及其组合物
公开(公告)号：US5191024A
公开(公告)日：1993-03-02
申请号：US524809
申请日：1990-05-18
申请人： Tooru Shibata , Toshio Teramoto , Yoshiharu Hashiguchi , Kunio Goshima
发明人： Tooru Shibata , Toshio Teramoto , Yoshiharu Hashiguchi , Kunio Goshima
IPC分类号： C08F8/04 , C08F297/04 , C08L51/00 , C08L53/02
CPC分类号： C08L53/025 , C08F297/04 , C08F8/04 , C08L51/006 , Y10S525/94
摘要： A hydrogenated diene block copolymer having a polystyrene-reduced number-average molecular weight of 50,000-600,000 which is a hydrogenation product of an (A)--(B) block copolymer in which (A) means an alkenyl aromatic compound polymer block and (B) means a conjugated diene homopolymer block wherein the vinyl content of the conjugated diene portion is more than 60%, or an alkenyl aromatic compound-conjugated diene random copolymer block wherein the vinyl content of the conjugated diene portion is 15% or more, an (A)--(B)--(C) block copolymer in which (A) and (B) are as defined above and (C) means an alkenyl aromatic compound-conjugated diene copolymer tapered block wherein the proportion of the alkenyl aromatic compound increases gradually, or an (A)--(B)--(A) block copolymer in which (A) and (B) are as defined above, in which block copolymer(1) the weight proportion of theh alkenyl aromatic compound/the conjugated diene is 5/95 to 60/40, and(2) the content of the bound alkenyl aromatic compound in at least one block (A) is at last 3% by weight and the total of the bound alkenyl aromatic compound contents in the block (A) and the block (C) or the two block (A)'s is 3-50% by weight based on the total monomers,and in which hydrogenation product at least 80% of the double bonds of the conjugated diene portion is saturated by the hydrogenation. Said hydrogenated diene block copolymer is useful as a modifier for polar resins, non-polar resins or both of them.

6. 发明授权

US4591672A Loud speaker assembly 失效
标题翻译：扬声器组件
公开(公告)号：US4591672A
公开(公告)日：1986-05-27
申请号：US645706
申请日：1984-08-30
申请人： Hiroshi Kato , Hitoshi Nakada , Isao Nishiwaki , Toshio Teramoto , Keikichi Yagii , Masahiro Niinomi
发明人： Hiroshi Kato , Hitoshi Nakada , Isao Nishiwaki , Toshio Teramoto , Keikichi Yagii , Masahiro Niinomi
IPC分类号： H04R9/02 , C09J4/02 , C09J4/06 , C09J133/04 , C09J133/08 , H04R7/16 , H04R9/06 , H04R31/00
CPC分类号： H04R9/06 , C09J4/06 , Y10T29/49005
摘要： A loud speaker assembly including members which are bonded together with an adhesive compound, wherein the adhesive compound comprises at least one composition selected from the group consisting of alkyl acrylate, alkyl methacrylate, acrylic acid and methacrylic acid; a copolymerized elastomer including at least 5 percent by weight of a functional monomer, an unsaturated nitrile and at least one of butadiene and isoprene; and an organic peroxide. In such a loud speaker assembly, the adhesive compound may be used to provide connection between the cone housing and the edge member, between the one housing and the baffle gasket and, between the cone housing and each of the edge member and the baffle gasket, between the vibrator cone and the voice coil unit, between the voice coil unit and the damper or spider element, between the vibrator cone and the voice coil unit, between the voice coil unit and an electric lead wire connected to the voice coil unit, between the vibrator cone and a center cap member, between the field magnet and the magnet support member, and/or between the field magnet and the pole-piece plate of the speaker assembly.
摘要翻译：一种扬声器组件，包括与粘合剂化合物结合在一起的构件，其中所述粘合剂化合物包含至少一种选自丙烯酸烷基酯，甲基丙烯酸烷基酯，丙烯酸和甲基丙烯酸的组合物; 包括至少5重量％的官能单体，不饱和腈和丁二烯和异戊二烯中的至少一种的共聚弹性体; 和有机过氧化物。在这样一个扬声器组件中，粘合剂可用于在一个壳体和挡板垫圈之间以及在锥体壳体与每个边缘构件和挡板垫圈之间提供锥体壳体和边缘构件之间的连接，在振动器锥体和音圈单元之间，在音圈单元和阻尼器或者蜘蛛元件之间，在振子锥体和音圈单元之间，在音圈单元和连接到音圈单元的电引线之间，在振动器锥体和中心帽构件之间，位于磁场磁体和磁体支撑构件之间，和/或在场磁体和扬声器组件的极板之间。

7. 发明申请

US20080305537A1 Microchips and its Manufacturing Methods Thereof 审中-公开
标题翻译：微芯片及其制造方法
公开(公告)号：US20080305537A1
公开(公告)日：2008-12-11
申请号：US11944059
申请日：2007-11-21
申请人： Setsuya Sato , Yoshitaka Matsumoto , Toshio Teramoto , Kimitaka Morohoshi
发明人： Setsuya Sato , Yoshitaka Matsumoto , Toshio Teramoto , Kimitaka Morohoshi
IPC分类号： C12M1/14 , C23C14/54
CPC分类号： B01L3/502761 , B01J19/0046 , B01J2219/00286 , B01J2219/00378 , B01J2219/00527 , B01J2219/00605 , B01J2219/00659 , B01L3/502707 , B01L9/527 , B01L2200/027 , B01L2200/0668 , B01L2200/12 , B01L2300/0654 , B01L2300/0816 , B01L2300/0874 , B01L2300/0887 , B81B2201/0214 , B81B2201/058 , B81C1/00119
摘要： A microchip is provided with a lower substrate configured as the lower portion of the microchip, an intermediate section formed on the top of the lower substrate, and an upper substrate formed on the top of the intermediate section, wherein the lower substrate, the intermediate section, and the upper substrate are made of light-transmissive and cured resin.
摘要翻译：微芯片设置有被配置为微芯片的下部的下基板，形成在下基板的顶部上的中间部分和形成在中间部分的顶部上的上基板，其中下基板，中间部分，上基板由透光固化树脂制成。

8. 发明授权

US06730178B2 Coating method by intermetallic compound 有权
标题翻译：金属间化合物的涂覆方法
公开(公告)号：US06730178B2
公开(公告)日：2004-05-04
申请号：US09903747
申请日：2001-07-13
申请人： Yoshinari Miyamoto , Kiyotaka Matsuura , Toshio Teramoto
发明人： Yoshinari Miyamoto , Kiyotaka Matsuura , Toshio Teramoto
IPC分类号： C23C2200
CPC分类号： C23C26/02 , B23P6/002 , C23C26/00 , Y02T50/67
摘要： A metallic base material is covered with a coating layer of intermetallic compound, or a plurality of metallic base materials are welded to each other with an intermetallic compound, with reduced energy consumption within a short period of time. First metallic substance 31 in powdery form is piled up on metallic base material 2. Second metallic substance 3 in molten form is delivered onto piling layer 80 of the first substance. Thus, under the control of reaction initiation temperature, coating layer (or building up coating layer) 84 of intermetallic compound having a thickness of hundreds of microns (&mgr;m) to millimeters (mm) is formed on the base material 2 by the self-exothermic reaction between the first substance and the second substance. This method is also useful in the welding of a plurality of metallic base materials to each other with an intermetallic compound. The first substance can be constituted of, for example, Ni, Co or Fe. The second substance can be constituted of, for example, Al or Ti. Each base material may be constituted of a metal common with or homologous to the first substance or second substance. The first substance and the second substance can be used in powdery form or molten form, provided that at least one thereof is used in molten form. The first substance may contain a ceramic for imparting reinforcement.
摘要翻译：用金属间化合物的涂层覆盖金属基材，或者多个金属基材料以金属间化合物彼此焊接，并在短时间内降低能量消耗。粉末状的第一金属物质31堆积在金属基材2上。熔融形式的第二金属物质3被输送到第一物质的堆叠层80上。因此，在反应引发温度的控制下，通过自发热形成在基材2上形成厚度为几百微米（毫米）至毫米（mm）的金属间化合物的涂层（或增层涂层）84 第一物质与第二物质之间的反应。该方法也可用于使金属间化合物彼此焊接多个金属基材。第一物质可以由例如Ni，Co或Fe构成。第二物质可以由例如Al或Ti构成。每种基材可以由与第一物质或第二物质共同或同源的金属构成。第一物质和第二物质可以以粉末形式或熔融形式使用，条件是其至少一种以熔融形式使用。第一物质可以含有用于赋予加强物的陶瓷。

9. 发明授权

US5306779A Hydrogenated diene block copolymer and composition comprising the same 失效
标题翻译：氢化二烯嵌段共聚物及其组合物
公开(公告)号：US5306779A
公开(公告)日：1994-04-26
申请号：US937723
申请日：1992-09-01
申请人： Tooru Shibata , Toshio Teramoto , Yoshiharu Hashiguchi , Kunio Goshima
发明人： Tooru Shibata , Toshio Teramoto , Yoshiharu Hashiguchi , Kunio Goshima
IPC分类号： C08F8/04 , C08F297/04 , C08L51/00 , C08L53/02
CPC分类号： C08L53/025 , C08F297/04 , C08F8/04 , C08L51/006 , Y10S525/94
摘要： A hydrogenated diene block copolymer having a polystyrene-reduced number-average molecular weight of 50,000-600,000 which is a hydrogenation product of an (A)-(B) block copolymer in which (A) means an alkenyl aromatic compound polymer block and (B) means a conjugated diene homopolymer block wherein the vinyl content of the conjugated diene portion is more than 60%, or an alkenyl aromatic compound-conjugated diene random copolymer block wherein the vinyl content of the conjugated diene portion is 15% or more, an (A)-(B)-(C) block copolymer in which (A) and (B) are as defined above and (C) means an alkenyl aromatic compound-conjugated diene copolymer tapered block wherein the proportion of the alkenyl aromatic compound increases gradually, or an (A)-(B)-(A) block copolymer in which (A) and (B) are as defined above and in which hydrogenation product at least 80% of the double bonds of the conjugated diene portion is saturated by the hydrogenation. Said hydrogenated diene block copolymer is useful as a modifier for polar resins, non-polar resins or both of them.
摘要翻译：具有聚苯乙烯换算的数均分子量为50,000-600,000的氢化二烯嵌段共聚物，其是（A） - （B）嵌段共聚物的氢化产物，其中（A）表示链烯基芳族化合物聚合物嵌段和（B 是指共轭二烯部分的乙烯基含量大于60％的共轭二烯均聚物嵌段或共轭二烯部分的乙烯基含量为15％以上的链烯基芳香族化合物 - 共轭二烯无规共聚物嵌段，（ A） - （B） - （C）嵌段共聚物，其中（A）和（B）如上所定义，（C）是烯基芳族化合物 - 共轭二烯共聚物渐缩嵌段，其中烯基芳族化合物的比例逐渐增加或（A） - （B） - （A）嵌段共聚物，其中（A）和（B）如上所定义，并且其中至少80％的共轭二烯部分的双键被氢化产物饱和氢化。所述氢化二烯嵌段共聚物可用作极性树脂，非极性树脂或它们两者的改性剂。

10. 发明授权

US5109069A Hydrogenated diene copolymer-containing resin composition and process for producing the same 失效
标题翻译：加氢二烯共聚物树脂组合物及其制造方法
公开(公告)号：US5109069A
公开(公告)日：1992-04-28
申请号：US446692
申请日：1989-12-06
申请人： Tooru Shibata , Toshio Teramoto , Yasuo Takeuchi , Kenya Makino , Masaaki Mawatari , Minoru Maeda , Shinichi Kimura , Minoru Hasegawa , Kunio Goshima , Mikio Takeuchi
发明人： Tooru Shibata , Toshio Teramoto , Yasuo Takeuchi , Kenya Makino , Masaaki Mawatari , Minoru Maeda , Shinichi Kimura , Minoru Hasegawa , Kunio Goshima , Mikio Takeuchi
IPC分类号： C08J3/00 , C08L15/00 , C08L21/00 , C08L23/00 , C08L23/10 , C08L25/00 , C08L25/10 , C08L37/00 , C08L47/00 , C08L67/00 , C08L71/12 , C08L77/00
CPC分类号： C08L15/00 , C08L71/123 , C08L23/10 , C08L25/02 , C08L67/00 , C08L77/00 , Y10S525/905
摘要： A hydrogenated diene copolymer resin composition comprising (A) 5-70% by weight of a hydrogenated diene copolymer which is a hydrogenation product of a random copolymer of at least one conjugated diene and 3-50% by weight of an alkenyl aromatic compound having a number average molecular weight of 5,000-1,000,000 and a molecular weight distribution (Mw/Mn) of 10 or less, the vinyl content in the diene portion of the random copolymer being 10-90%, at least 70% of the olefinic unsaturation of the random copolymer being hydrogenated, and (B) 95-30% by weight of at least one resin selected from the group consisting of a polypropylene resin, a polyphenylene ether resin and an alkenyl aromatic compound polymer resin. The hydrogenated diene copolymer (A) can be used in combination with (B) a polyphenylene ether resin and (C) at least one member selected from the group consisting of a polyamide and a thermoplastic polyester in such a proportion that the amount of (A) is 1-50 parts by weight, the amount of (B) is 10-89 parts by weight and the amount of (C) is 10-89 parts by weight. The above composition has improved impact resistance and improved gloss and appearance of molded article.

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