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1. 发明申请

US20120280768A1 ELASTIC WAVE DEVICE 有权
标题翻译：弹性波装置
公开(公告)号：US20120280768A1
公开(公告)日：2012-11-08
申请号：US13521239
申请日：2011-12-14
申请人： Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
发明人： Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
IPC分类号： H03H9/25
CPC分类号： H03H9/725 , H01F38/14 , H03H9/0057 , H03H9/0547 , H03H9/0576 , H03H9/059 , H03H9/1071 , H03H9/12 , H03H9/14588 , H03H9/64
摘要： An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
摘要翻译：弹性波装置包括压电基片，设置在压电基片上的IDT电极，布置在压电基片上并与IDT电极连接的布线电极，设置在压电基片上以密封IDT电极和布线电极的第一绝缘体设置在第一绝缘体上的树脂层，设置在树脂层上的电感器电极，设置在树脂层上以覆盖电感器电极的第二绝缘体，设置在第二绝缘体上的端子电极和穿过第一绝缘体的连接电极绝缘体，第二绝缘体和树脂层，以电连接布线电极，端子电极和电感器电极。第一绝缘体包括分散在树脂中的树脂和填料。树脂层中填料的密度小于第一绝缘体中填料的平均密度。该弹性波器件具有优异的电感特性，同时降低了特性的变化。

2. 发明授权

US07652214B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US07652214B2
公开(公告)日：2010-01-26
申请号：US11575809
申请日：2006-10-30
申请人： Atsushi Takano , Mitsuhiro Furukawa , Ryouichi Takayama
发明人： Atsushi Takano , Mitsuhiro Furukawa , Ryouichi Takayama
IPC分类号： H01L23/48
CPC分类号： H03H9/1092 , H03H9/0576 , H03H9/1085
摘要： In an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.
摘要翻译：在其中通过设置在安装基板上的外部电极安装在安装基板上的电子部件被模制树脂覆盖的电子部件封装中，电子部件具有覆盖部件基板的下表面上的元件的部件盖，并且形成空腔，并且具有比模制树脂低的弹性模量的保护构件设置在不包括与组件盖的下表面中的外部电极接合的部分并且与空腔相对的部分中。

3. 发明授权

US07982364B2 Surface acoustic wave device and method for manufacturing the same 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US07982364B2
公开(公告)日：2011-07-19
申请号：US11887589
申请日：2006-03-30
申请人： Ryouichi Takayama , Mitsuhiro Furukawa , Atsushi Takano
发明人： Ryouichi Takayama , Mitsuhiro Furukawa , Atsushi Takano
IPC分类号： H03H9/125
CPC分类号： H03H9/1092 , Y10T29/42
摘要： A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.
摘要翻译：表面声波装置包括压电基板和彼此相对间隔一定间隔的盖。在盖侧的主表面上的压电基板上设置梳状电极和焊盘电极，在与压电基板相反的一侧的表面上设置有外部端子。此外，表面声波装置包括：电连接焊盘电极和外部端子的连接电极和插入在压电基板的主表面和焊盘电极和盖中的至少一个之间的绝缘体。

4. 发明申请

US20090194325A1 ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：电子元件包装
公开(公告)号：US20090194325A1
公开(公告)日：2009-08-06
申请号：US11575809
申请日：2006-10-30
申请人： Atsushi Takano , Mitsuhiro Furukawa , Ryouichi Takayama
发明人： Atsushi Takano , Mitsuhiro Furukawa , Ryouichi Takayama
IPC分类号： H01L23/28
CPC分类号： H03H9/1092 , H03H9/0576 , H03H9/1085
摘要： The strength of an electronic component package against an external pressure is improved. According to the invention, in order to realize this, in an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.
摘要翻译：电子元件封装相对于外部压力的强度提高。根据本发明，为了实现这一点，在其中通过设置在安装基板上的外部电极安装在安装基板上的电子部件被模制树脂覆盖的电子部件封装中，电子部件具有覆盖放置在部件基板的下表面上并且形成空腔的元件和弹性模量低于模制树脂的保护构件设置在不包括与部件的下表面中的外部电极接合的部分的部分中盖，并且与腔相对。

5. 发明授权

US09124239B2 Elastic wave device 有权
标题翻译：弹性波装置
公开(公告)号：US09124239B2
公开(公告)日：2015-09-01
申请号：US13521239
申请日：2011-12-14
申请人： Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
发明人： Hideaki Nakayama , Atsushi Takano , Mitsuhiro Furukawa
IPC分类号： H03H9/72 , H03H9/25 , H03H9/05 , H03H9/10 , H03H9/00 , H03H9/145
CPC分类号： H03H9/725 , H01F38/14 , H03H9/0057 , H03H9/0547 , H03H9/0576 , H03H9/059 , H03H9/1071 , H03H9/12 , H03H9/14588 , H03H9/64
摘要： An elastic wave device includes a piezoelectric substrate, an IDT electrode disposed on the piezoelectric substrate, a wiring electrode disposed on the piezoelectric substrate and connected to the IDT electrode, a first insulator disposed on the piezoelectric substrate to seal the IDT electrode and the wiring electrode, a resin layer provided on the first insulator, an inductor electrode disposed on the resin layer, a second insulator disposed on the resin layer to cover the inductor electrode, a terminal electrode disposed on the second insulator, and a connecting electrode passing through the first insulator, the second insulator, and the resin layer to electrically connect the wiring electrode, the terminal electrode, and the inductor electrode. The first insulator includes a resin and filler dispersed in the resin. A density of filler in the resin layer is smaller than an average density of the filler in the first insulator. This elastic wave device has excellent characteristics of the inductor while reducing variations of the characteristics.
摘要翻译：弹性波装置包括压电基片，设置在压电基片上的IDT电极，布置在压电基片上并与IDT电极连接的布线电极，设置在压电基片上以密封IDT电极和布线电极的第一绝缘体设置在第一绝缘体上的树脂层，设置在树脂层上的电感器电极，设置在树脂层上以覆盖电感器电极的第二绝缘体，设置在第二绝缘体上的端子电极和穿过第一绝缘体的连接电极绝缘体，第二绝缘体和树脂层，以电连接布线电极，端子电极和电感器电极。第一绝缘体包括分散在树脂中的树脂和填料。树脂层中填料的密度小于第一绝缘体中填料的平均密度。该弹性波器件具有优异的电感特性，同时降低了特性的变化。

6. 发明授权

US07764007B2 Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer 有权
标题翻译：包含应力松弛层和耐扩散层的凹凸金属薄膜
公开(公告)号：US07764007B2
公开(公告)日：2010-07-27
申请号：US11817171
申请日：2006-03-07
申请人： Mitsuhiro Furukawa , Atsushi Takano
发明人： Mitsuhiro Furukawa , Atsushi Takano
IPC分类号： H01L41/047
CPC分类号： H01L24/11 , H01L24/05 , H01L24/13 , H01L2224/0345 , H01L2224/0361 , H01L2224/03622 , H01L2224/0401 , H01L2224/05568 , H01L2224/05624 , H01L2224/11472 , H01L2224/13023 , H01L2224/13084 , H01L2224/13124 , H01L2224/13144 , H01L2224/13155 , H01L2224/13166 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： An under bump metal film formed on a substrate includes a diffusion-resistant barrier layer made of a platinum group metal film, and an aluminum-based stress relaxation layer formed under the diffusion-resistant barrier layer.
摘要翻译：形成在基板上的凸块状金属膜包括由铂族金属膜构成的扩散阻挡层和形成在扩散阻挡层下方的铝系应力缓和层。

7. 发明授权

US07622684B2 Electronic component package 有权
标题翻译：电子元件包装
公开(公告)号：US07622684B2
公开(公告)日：2009-11-24
申请号：US11719160
申请日：2006-10-30
申请人： Atsushi Takano , Mitsuhiro Furukawa
发明人： Atsushi Takano , Mitsuhiro Furukawa
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H03H9/1085 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19105 , H03H3/08 , H03H9/0576 , H03H9/059 , H03H9/6483 , H03H9/725 , H01L2924/00014 , H01L2924/00012
摘要： An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.
摘要翻译：电子部件封装包括：电子部件，其中将器件元件安装在形成在部件基板和覆盖部件基板的部件盖之间的空腔内; 和安装基板。组件盖放置在安装基板上，电子部件安装在安装基板上并用树脂模制。接地电极和虚拟电极中的至少一个设置在部件盖的表面上，该表面被放置在安装基板上。接地电极和虚拟电极中的至少一个设置在与至少一部分空腔相对的位置。

8. 发明申请

US20090051245A1 Surface Acoustic Wave Device and Method for Manufacturing the Same 有权
标题翻译：表面声波装置及其制造方法
公开(公告)号：US20090051245A1
公开(公告)日：2009-02-26
申请号：US11887589
申请日：2006-03-30
申请人： Ryouichi Takayama , Mitsuhiro Furukawa , Atsushi Takano
发明人： Ryouichi Takayama , Mitsuhiro Furukawa , Atsushi Takano
IPC分类号： H01L41/053 , H01L41/22
CPC分类号： H03H9/1092 , Y10T29/42
摘要： A surface acoustic wave device includes a piezoelectric substrate and a lid spaced apart from each other oppositely by a specific interval. A comb electrode and a pad electrode are provided to the piezoelectric substrate on a main surface on the lid side, and an external terminal is provided to the lid on a surface on the opposite side to the piezoelectric substrate. Further, the surface acoustic wave device includes a connection electrode that electrically connects the pad electrode and the external terminal, and an insulator interposed between at least one of the main surface of the piezoelectric substrate and the pad electrode and the lid.
摘要翻译：表面声波装置包括压电基板和彼此相对间隔一定间隔的盖。在盖侧的主表面上的压电基板上设置梳状电极和焊盘电极，在与压电基板相反的一侧的表面上设置有外部端子。此外，表面声波装置包括：电连接焊盘电极和外部端子的连接电极和插入在压电基板的主表面和焊盘电极和盖中的至少一个之间的绝缘体。

9. 发明申请

US20090021109A1 UNDER BUMP METAL FILM, METHOD FOR FORMING SAME, AND SURFACE ACOUSTIC WAVE DEVICE 有权
标题翻译：下金属膜，形成其的方法和表面声波装置
公开(公告)号：US20090021109A1
公开(公告)日：2009-01-22
申请号：US11817171
申请日：2006-03-07
申请人： Mitsuhiro Furukawa , Atsushi Takano
发明人： Mitsuhiro Furukawa , Atsushi Takano
IPC分类号： H01L41/00 , H01L23/48 , H01L21/44
CPC分类号： H01L24/11 , H01L24/05 , H01L24/13 , H01L2224/0345 , H01L2224/0361 , H01L2224/03622 , H01L2224/0401 , H01L2224/05568 , H01L2224/05624 , H01L2224/11472 , H01L2224/13023 , H01L2224/13084 , H01L2224/13124 , H01L2224/13144 , H01L2224/13155 , H01L2224/13166 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01058 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2224/05552
摘要： An under bump metal film formed on a substrate includes a diffusion-resistant barrier layer made of a platinum group metal film, and an aluminum-based stress relaxation layer formed under the diffusion-resistant barrier layer.
摘要翻译：形成在基板上的凸块状金属膜包括由铂族金属膜构成的扩散阻挡层和形成在扩散阻挡层下方的铝系应力缓和层。

10. 发明申请

US20090071711A1 ELECTRONIC COMPONENT PACKAGE 有权
标题翻译：电子元件包装
公开(公告)号：US20090071711A1
公开(公告)日：2009-03-19
申请号：US11719160
申请日：2006-10-30
申请人： Atsushi Takano , Mitsuhiro Furukawa
发明人： Atsushi Takano , Mitsuhiro Furukawa
IPC分类号： H01R13/46
CPC分类号： H03H9/1085 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/19105 , H03H3/08 , H03H9/0576 , H03H9/059 , H03H9/6483 , H03H9/725 , H01L2924/00014 , H01L2924/00012
摘要： An electronic component package comprises: an electronic component where device elements are mounted inside cavities formed between a component substrate and a component cover that covers the component substrate; and a mounting substrate. The component cover is placed on the mounting substrate, and the electronic component is mounted on the mounting substrate and molded by a resin. At least one of a ground electrode and a dummy electrode is provided on a surface of the component cover, the surface being placed on the mounting substrate. At least one of the ground electrode and the dummy electrode is provided in a position opposed to at least part of the cavities.
摘要翻译：电子部件封装包括：电子部件，其中将器件元件安装在形成在部件基板和覆盖部件基板的部件盖之间的空腔内; 和安装基板。组件盖放置在安装基板上，电子部件安装在安装基板上并用树脂模制。接地电极和虚拟电极中的至少一个设置在部件盖的表面上，表面被放置在安装基板上。接地电极和虚拟电极中的至少一个设置在与至少一部分空腔相对的位置。

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