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1. 发明授权

US06601453B2 Pressure detecting apparatus 有权
标题翻译：压力检测装置
公开(公告)号：US06601453B2
公开(公告)日：2003-08-05
申请号：US10101526
申请日：2002-03-20
申请人： Atsushi Miyazaki , Katsuhiko Kikuchi , Hiromichi Ebine , Satoshi Shimada , Masahide Hayashi
发明人： Atsushi Miyazaki , Katsuhiko Kikuchi , Hiromichi Ebine , Satoshi Shimada , Masahide Hayashi
IPC分类号： G01L916
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0084 , G01L19/148 , H01L2224/48091 , H01L2924/00014
摘要： The present invention provides a pressure detector capable of easily responding to changes in specification. The pressure detector has a sensor unit for detecting pressure and electronic parts for reducing electrical disturbance which are electrically joined to an exposed part of lead material of an opening of an external case. Thermoset resin is injected and set in the opening to obtain fixed members. An external electronic part for compensating for transient voltage resistance and electromagnetic failure resistance of a single one-chip semiconductor sensor can be mounted, and cost can be reduced by miniaturization, light weight, and reduction in man-hours required for assembly.
摘要翻译：本发明提供一种能够容易地响应于规格变化的压力检测器。压力检测器具有用于检测压力的传感器单元和用于减少电气干扰的电子部件，其电连接到外部壳体的开口的引线材料的暴露部分。将热固性树脂注入并置于开口中以获得固定构件。可以安装用于补偿单个单芯片半导体传感器的瞬态电压和电磁破坏电阻的外部电子部件，并且可以通过小型化，轻量化和组装所需的工时减少成本。

2. 发明授权

US07414307B2 Electronic device and pressure sensor 有权
标题翻译：电子设备和压力传感器
公开(公告)号：US07414307B2
公开(公告)日：2008-08-19
申请号：US10855344
申请日：2004-05-28
申请人： Hiromichi Ebine , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
发明人： Hiromichi Ebine , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
IPC分类号： H01L23/48
CPC分类号： H05K3/3442 , H01L2924/0002 , H05K3/202 , H05K3/284 , H05K2201/09036 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
摘要翻译：电子设备需要为了静电屏蔽而安装电子部件。这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。在各引线的电子部件安装部中，以组合的方式形成定位凹部，接合物质厚度确保凹部，接合物质厚度确保凹部等，由此在接合物质中产生的裂纹的扩散可以可以提高抑制和可靠性。填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散，并确保接合物质的可靠性更好。

3. 发明授权

US08242587B2 Electronic device and pressure sensor 有权
标题翻译：电子设备和压力传感器
公开(公告)号：US08242587B2
公开(公告)日：2012-08-14
申请号：US12177210
申请日：2008-07-22
申请人： Hiromichi Ebine , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
发明人： Hiromichi Ebine , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
IPC分类号： H01L23/31
CPC分类号： H05K3/3442 , H01L2924/0002 , H05K3/202 , H05K3/284 , H05K2201/09036 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
摘要翻译：电子设备需要为了静电屏蔽而安装电子部件。这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。在各引线的电子部件安装部中，以组合的方式形成定位凹部，接合物质厚度确保凹部，接合物质厚度确保凹部等，由此在接合物质中产生的裂纹的扩散可以可以提高抑制和可靠性。填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散，并确保接合物质的可靠性更好。

4. 发明申请

US20080283997A1 Electronic Device and Pressure Sensor 有权
标题翻译：电子设备和压力传感器
公开(公告)号：US20080283997A1
公开(公告)日：2008-11-20
申请号：US12177210
申请日：2008-07-22
申请人： Hiromichi EBINE , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
发明人： Hiromichi EBINE , Katsuhiko Kikuchi , Satoshi Shimada , Masahide Hayashi
IPC分类号： H01L23/48
CPC分类号： H05K3/3442 , H01L2924/0002 , H05K3/202 , H05K3/284 , H05K2201/09036 , H05K2201/09745 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , H01L2924/00
摘要： An electronic device requires an electronic component to be mounted for the purpose of static shielding. The mounting of such an electronic component raises a problem of avoiding thermal stresses and cracks generated due to the difference between the coefficients of linear expansion of component materials. A positioning recess, a joining-substance thickness ensuring recess, a joining-substance thickness ensuring projection, etc. are formed in a combined manner in an electronic component mount portion of each of leads, whereby spreading of cracks generated in the joining substance can be suppressed and reliability can be improved. Filling a sealing material so as to seal and restrain the electronic component mounted in the electronic component mount portion without leaving voids contributes to further suppressing spreading of cracks generated in the joining substance and ensuring more improved reliability of the joining substance.
摘要翻译：电子设备需要为了静电屏蔽而安装电子部件。这种电子部件的安装提出了避免由于部件材料的线性膨胀系数之间的差异而产生的热应力和裂纹的问题。在各引线的电子部件安装部中，以组合的方式形成定位凹部，接合物质厚度确保凹部，接合物质厚度确保凹部等，由此在接合物质中产生的裂纹的扩散可以可以提高抑制和可靠性。填充密封材料以密封和限制安装在电子部件安装部分中的电子部件而不留空隙有助于进一步抑制在接合物质中产生的裂纹的扩散，并确保接合物质的可靠性更好。

5. 发明申请

US20050115328A1 Pressure sensor, flowmeter electonic component, and method for manufacturing the same 失效
标题翻译：压力传感器，流量计电子部件及其制造方法
公开(公告)号：US20050115328A1
公开(公告)日：2005-06-02
申请号：US10500873
申请日：2003-01-17
申请人： Masahide Hayashi , Katsuhiko Kikuchi , Hiromichi Ebine
发明人： Masahide Hayashi , Katsuhiko Kikuchi , Hiromichi Ebine
IPC分类号： G01L9/00 , G01L19/00
CPC分类号： G01L19/0092 , G01L19/0038 , G01L19/0084 , G01L19/141
摘要： An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially, when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.
摘要翻译：例如，与压力传感器一起使用的外壳连接器部分，量规壳体壳体等通常由热塑性或热固性树脂制成。然而，树脂物理地引起固化收缩。特别地，当金属用树脂嵌入成型时，树脂的固化收缩在树脂和金属之间的界面处产生间隙。通过在间隙中填充厌氧性高渗透性粘合剂，可以确保气密密封，提高可靠性。实现了廉价的密封和增强的可靠性。

6. 发明授权

US07260992B2 Pressure sensor, flowmeter electronic component, and method for manufacturing the same 失效
标题翻译：压力传感器，流量计电子部件及其制造方法
公开(公告)号：US07260992B2
公开(公告)日：2007-08-28
申请号：US10500873
申请日：2003-01-17
申请人： Masahide Hayashi , Katsuhiko Kikuchi , Hiromichi Ebine
发明人： Masahide Hayashi , Katsuhiko Kikuchi , Hiromichi Ebine
IPC分类号： G01L7/00
CPC分类号： G01L19/0092 , G01L19/0038 , G01L19/0084 , G01L19/141
摘要： An outer case connector portion, a gauge housing case, and the like for use with a pressure sensor, for example, are generally made of a thermoplastic or thermosetting resin. However, the resin physically causes curing shrinkage. Especially when a metal is insert molded with a resin, curing shrinkage of the resin generates a gap at the interface between the resin and the metal. By filling an anaerobic, high-permeability adhesive in the gap, hermetic sealing can be ensured and reliability can be enhanced. Inexpensive hermetic sealing and enhanced reliability are realized.
摘要翻译：例如，与压力传感器一起使用的外壳连接器部分，量规壳体壳体等通常由热塑性或热固性树脂制成。然而，树脂物理地引起固化收缩。特别是当金属用树脂嵌入成型时，树脂的固化收缩在树脂和金属之间的界面处产生间隙。通过在间隙中填充厌氧性高渗透性粘合剂，可以确保气密密封，提高可靠性。实现了廉价的密封和增强的可靠性。

7. 发明授权

US09279827B2 Sensor module and sensor system 有权
标题翻译：传感器模块和传感器系统
公开(公告)号：US09279827B2
公开(公告)日：2016-03-08
申请号：US13976372
申请日：2011-11-24
申请人： Daisuke Maeda , Heewon Jeong , Masahide Hayashi
发明人： Daisuke Maeda , Heewon Jeong , Masahide Hayashi
IPC分类号： G01P21/00 , G01C19/5776 , G01C21/16
CPC分类号： G01P21/00 , G01C19/5776 , G01C21/16
摘要： Reliability and accuracy of a sensor are secured while adjustment cost of a sensor module is suppressed. A signal component analysis part 10 receives a signal output from a signal processing part 7 before passing through a low-pass filter 8, analyzes whether or not application of a fragile frequency with respect to a physical quantity is equal to or more than a threshold level, if the application of the fragile frequency is equal to or more than the threshold level, outputs output stop signals to output signal control parts 9, 16. The output signal control parts 9, 16 receive control signals output from the signal component analysis part 10, and outputs an acceleration signal and a physical quantity signal from which noise has been removed by the low-pass filters 8, 15 through the signal processing parts 7, 14.
摘要翻译：确保传感器模块的调整成本得到抑制，从而确保传感器的可靠性和精度。信号分量分析部分10在通过低通滤波器8之前接收从信号处理部分7输出的信号，分析相对于物理量的脆弱频率的施加是否等于或大于阈值水平如果脆弱频率的应用等于或大于阈值电平，则将输出停止信号输出到输出信号控制部9,16。输出信号控制部9,16接收从信号分量分析部10输出的控制信号并且通过信号处理部件7,14输出通过低通滤波器8,15除去噪声的加速度信号和物理量信号。

8. 发明授权

US09151776B2 Combined sensor 有权
标题翻译：组合传感器
公开(公告)号：US09151776B2
公开(公告)日：2015-10-06
申请号：US13983828
申请日：2012-01-10
申请人： Heewon Jeong , Masahide Hayashi
发明人： Heewon Jeong , Masahide Hayashi
IPC分类号： G01C19/5719 , G01P15/125 , G01P15/08 , G01C19/5733 , G01C19/5726 , H01L29/84 , G01C19/5769
CPC分类号： G01P15/125 , G01C19/5719 , G01C19/5726 , G01C19/5733 , G01C19/5769 , G01P15/0802 , G01P2015/0814 , H01L29/84
摘要： An object of the invention is to provide a combined sensor capable of suppressing the influence of electrostatic force generated by a potential difference and preventing a reduction in the S/N ratio or a variation in the sensitivity of a sensor.A combined sensor according to the invention includes first and second movable portions and first and second dummy portions provided around the first and second movable portions, which are formed in a layer of a laminated substrate. The first dummy portion and the second dummy portion are electrically separated from each other. A first potential is applied to the first movable portion and the first dummy portion and a second potential is applied to the second movable portion and the second dummy portion (see FIG. 2).
摘要翻译：本发明的目的是提供一种组合传感器，其能够抑制由电位差产生的静电力的影响，并且防止S / N比的降低或传感器的灵敏度的变化。根据本发明的组合传感器包括第一和第二可移动部分以及设置在第一和第二可移动部分周围的第一和第二虚拟部分，其形成在层压基板的层中。第一虚拟部分和第二虚拟部分彼此电分离。第一电位施加到第一可动部和第一虚拟部，第二电位施加到第二可动部和第二虚拟部（参照图2）。

9. 发明授权

US08438718B2 Manufacturing method of combined sensor 有权
标题翻译：组合传感器的制造方法
公开(公告)号：US08438718B2
公开(公告)日：2013-05-14
申请号：US13028592
申请日：2011-02-16
申请人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
发明人： Takanori Aono , Kengo Suzuki , Akira Koide , Masahide Hayashi
IPC分类号： G01R3/00
CPC分类号： G01C19/56 , B81B2201/0235 , B81B2201/0242 , B81B2207/096 , B81C1/00285 , B81C2203/0118 , B81C2203/035 , G01C19/5769 , G01C19/5783 , G01P15/0802 , G01P2015/0882 , H01L2224/48145 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908 , Y10T29/49171 , Y10T29/49176 , Y10T29/49826 , H01L2924/00012
摘要： A movable device of acceleration sensors and a vibration device of a gyroscope are formed on the same sensor wafer spaced apart from each other by a wall. A cap wafer having gaps corresponding to the movable mechanical components of the acceleration sensors and gyroscope is provided for the wafer and an adsorbent divided into a plurality of divisional portions is disposed in the gap for the gyroscope. After the sensor wafer and the cap wafer have been bonded together at a temperature of inactivation of the adsorbent and in an atmospheric pressure ambience of noble gas and activated gas, the adsorbent divisional portions are activated in sequence to adsorb the activated gas so as to adjust the pressure inside the gyroscope, thus manufacturing a combined sensor wafer.
摘要翻译：加速度传感器的可移动装置和陀螺仪的振动装置形成在通过壁彼此间隔开的相同传感器晶片上。为晶片提供具有与加速度传感器和陀螺仪的可移动机械部件相对应的间隙的盖片晶片，并且分离成多个分割部分的吸附剂设置在用于陀螺仪的间隙中。在传感器晶片和盖晶片已经在吸附剂失活的温度下并且在惰性气体和活性气体的大气压氛围下结合在一起，吸附剂分段依次被激活以吸附活性气体，以便调节陀螺仪内部的压力，从而制造组合的传感器晶片。

10. 发明授权

US5389198A Structure and method of manufacturing the same 失效
标题翻译：其制造方法及结构
公开(公告)号：US5389198A
公开(公告)日：1995-02-14
申请号：US763519
申请日：1991-09-23
申请人： Akira Koide , Kazuo Sato , Seiko Suzuki , Norio Ichikawa , Hidehito Obayashi , Masahide Hayashi
发明人： Akira Koide , Kazuo Sato , Seiko Suzuki , Norio Ichikawa , Hidehito Obayashi , Masahide Hayashi
IPC分类号： G01P15/125 , B81B3/00 , H01L21/306 , H01L21/308 , H01L29/84 , H01L21/00
CPC分类号： H01L21/30608 , H01L21/3086 , G01P2015/0828
摘要： A method of manufacturing structures such as a pressure gauge, an accelerometer and the like with a single crystal material such as silicon uses etching techniques where the shape of a part subjected to stress concentration has a curvature, another part is formed in a plane body and a polyhedron is constituted by combining both.To attain the above constitution, a wafer of single crystal material is formed with a stepped surface having a value corresponding to at least the depth of the curvature in a first anisotropic etching process using a prescribed etching mask, and in a second anisotropic etching process, an etching mask is used by removing at least a part of the etching mask used in the first anisotropic etching process.
摘要翻译：使用诸如硅的单晶材料制造诸如压力计，加速度计等的结构的方法使用蚀刻技术，其中经受应力集中的部分的形状具有曲率，另一部分形成在平面体中，多面体是通过组合两者构成的。为了实现上述结构，在使用规定的蚀刻掩模的第一各向异性蚀刻工艺中，形成具有至少与曲率深度相对应的值的阶梯面的单晶材料晶片，在第二各向异性蚀刻工艺中，通过去除在第一各向异性蚀刻工艺中使用的蚀刻掩模的至少一部分来使用蚀刻掩模。

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