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1. 发明授权

US08873173B2 Object lens drive unit and optical pickup using the same 有权
标题翻译：物镜驱动单元和使用其的光学拾取器
公开(公告)号：US08873173B2
公开(公告)日：2014-10-28
申请号：US13430816
申请日：2012-03-27
申请人： Atsushi Kazama , Katsuhiko Kimura , Takahiro Yamaguchi , Souichirou Yamada
发明人： Atsushi Kazama , Katsuhiko Kimura , Takahiro Yamaguchi , Souichirou Yamada
IPC分类号： G02B7/02 , G11B7/09
CPC分类号： G11B7/0932
摘要： In the object lens drive unit including a lens holder with an object lens attached to, a plurality of driving coils attached to the lens holder, connection substrates attached to both sides of the lens holder, and a plurality of suspension wires with end parts thereof connected to the connection substrates for operatively supporting the lens holder, a plurality of sets of wire connection electrodes for connecting the suspension wires and coil connection electrodes electrically connected to the wire connection electrodes for connecting terminal wires of the coils are arranged in line in an optic axis direction of the object lens and the wire connection electrodes and the coil connection electrodes are formed in a symmetric shape to a central axis parallel to the optic axis direction on the connection substrates.
摘要翻译：在包括安装有物镜的透镜保持器的物镜驱动单元中，安装在透镜保持器上的多个驱动线圈，连接到透镜保持器两侧的连接基板和多个悬挂线，其端部连接到用于可操作地支撑透镜保持器的连接基板，用于连接悬挂线的多组线连接电极和电连接到用于连接线圈的端子线的线连接电极的线圈连接电极在光轴物镜和线连接电极和线圈连接电极的方向形成为与连接基板上的光轴方向平行的中心轴对称的形状。

2. 发明申请

US20050258735A1 Display apparatus 有权
标题翻译：显示装置
公开(公告)号：US20050258735A1
公开(公告)日：2005-11-24
申请号：US11132295
申请日：2005-05-19
申请人： Takeshi Terasaki , Atsushi Kazama , Makoto Kitano , Tatsuya Nagata , Takashi Fujimura
发明人： Takeshi Terasaki , Atsushi Kazama , Makoto Kitano , Tatsuya Nagata , Takashi Fujimura
IPC分类号： H01J29/86 , H01J29/87 , H01J31/12
CPC分类号： H01J31/123 , H01J29/87
摘要： An object of the present invention is to achieve high resolution, lightening, and thinning of a display apparatus. The display apparatus includes an anode substrate, a planar cathode substrate forming an electron emitting chamber vacuously sealed between the cathode substrate and the anode substrate, electron sources formed on the cathode substrate, phosphors formed on the anode substrate, and a vacuum seal member forming a pressure balancing chamber on the back of the electron emitting chamber side of the cathode substrate. The vacuum seal member is placed covering the back of the electron emitting chamber side, and has a shell structure for receiving the atmospheric pressure.
摘要翻译：本发明的目的是实现显示装置的高分辨率，减轻和减薄。显示装置包括阳极基板，形成在阴极基板和阳极基板之间真空密封的电子发射室的平面阴极基板，形成在阴极基板上的电子源，形成在阳极基板上的荧光体和形成在阳极基板上的真空密封部件阴极基板的电子发射室侧背面的压力平衡室。真空密封构件被覆盖在电子发射室侧的背面，并且具有用于接收大气压的壳结构。

3. 发明申请

US20050013534A1 Beam direction module and optical switch using the same 失效
标题翻译：光束方向模块和光开关使用相同
公开(公告)号：US20050013534A1
公开(公告)日：2005-01-20
申请号：US10890131
申请日：2004-07-14
申请人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
发明人： Atsushi Kazama , Kazuyuki Fukuda , Toshiya Shiramatsu , Masaya Horino , Yasuhiro Itou
IPC分类号： G02B6/26 , G02B6/32 , G02B6/35 , G02B26/08
CPC分类号： G02B6/3556 , G02B6/32 , G02B6/3512 , G02B6/3544 , G02B6/357 , G02B6/3572 , G02B6/3578 , G02B6/3584
摘要： A beam direction module which can be applied to an optical switch, comprising: a collimator support member; a first mirror substrate including first micro-mirrors, and first windows through which beams can pass; a first electrode substrate including first mirror driving electrodes, and second windows through which beams can pass; a first spacer; a second mirror substrate including second micro-mirrors, and third windows through which beams can pass; a second electrode substrate including second mirror driving electrodes, and fourth windows through which beams can pass; a second spacer; and an inter-mirror spacer, wherein the first electrode substrate, the first spacer, the first mirror substrate, the inter-mirror spacer, the second mirror substrate, the second spacer and the second electrode substrate are stacked successively on the collimator support member and fixed between caps and the collimator support member while pins protruding from the collimator support member are inserted into alignment through-holes formed.
摘要翻译：可以应用于光开关的光束方向模块，包括：准直器支撑部件; 包括第一微反射镜的第一反射镜基板和光束能穿过的第一窗口; 第一电极基板，包括第一反射镜驱动电极和光束能通过的第二窗口; 第一间隔物包括第二微反射镜的第二反射镜基板和光束能穿过的第三窗口; 第二电极基板，包括第二反射镜驱动电极和第四窗口，波束可以通过该第四窗口; 第二间隔物以及反射镜间隔件，其中所述第一电极基板，所述第一间隔件，所述第一反射镜基板，所述反射镜间隔件，所述第二反射镜基板，所述第二间隔物和所述第二电极基板依次堆叠在所述准直器支撑部件上，固定在盖和准直器支撑构件之间，而从准直器支撑构件突出的销插入形成的对准通孔中。

4. 发明授权

US06639315B2 Semiconductor device and mounted semiconductor device structure 有权
公开(公告)号：US06639315B2
公开(公告)日：2003-10-28
申请号：US09925374
申请日：2001-08-10
申请人： Atsushi Kazama , Hideo Miura , Akihiro Yaguchi
发明人： Atsushi Kazama , Hideo Miura , Akihiro Yaguchi
IPC分类号： H01L2348
CPC分类号： H05K1/111 , H01L23/3114 , H01L23/3157 , H01L24/10 , H01L24/13 , H01L2224/05001 , H01L2224/05008 , H01L2224/05022 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05671 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/16237 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10329 , H01L2924/15787 , H01L2924/19041 , H01L2924/30105 , H01L2924/3025 , H01L2924/351 , H05K3/3436 , H05K3/3452 , H05K2201/09381 , H05K2201/0989 , H05K2201/10734 , Y02P70/611 , H01L2924/00 , H01L2924/013 , H01L2924/00014
摘要： A small semiconductor device which can be fabricated at the wafer level has high reliability of external terminals with respect to distortion caused by differential thermal expansion between a semiconductor element of the device and a printed circuit board and has superior electrical performance achieved through reduced static capacitance of interconnections. A thick stress-moderating layer with a low elastic modulus is interposed between the semiconductor element and interconnections and lands and improves the reliability of external terminals by absorbing distortion caused by the differential thermal expansion. The thick stress-moderating layer also reduces static capacitance between the interconnections and internal interconnections of the semiconductor element. Even around element electrodes, where the stress-moderating layer is not formed, static capacitance is reduced by an insulating film interposed between the interconnections and the semiconductor element.

5. 发明申请

US20100218607A1 ACCELERATION SENSOR 失效
标题翻译：加速传感器
公开(公告)号：US20100218607A1
公开(公告)日：2010-09-02
申请号：US12670964
申请日：2008-06-25
申请人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
发明人： Atsushi Kazama , Masakatsu Saitoh , Ryoji Okada , Takanori Aono
IPC分类号： G01P15/12
CPC分类号： G01P15/18 , G01P15/123 , G01P2015/0842 , H01L24/45 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48247 , H01L2224/73265 , H01L2924/1461 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/00012
摘要： An acceleration sensor whose characteristics including sensitivity are less likely to change relative to disturbance force applied to a sensor chip. The acceleration sensor has a support frame, a weight supported within the support frame via flexible beams, semiconductor piezoresistance elements provided on the beams, and wiring interconnecting the piezoresistance elements. The acceleration sensor detects acceleration from changes in resistance of the piezoresistance elements. Stress damping sections are provided on those portions of the beams which exclude the portions where the piezoresistance elements are provided. Each stress damping section is symmetrical with respect to the point of intersection between the length center line of the beam and the width center line of the beam. When disturbance force is applied to a sensor element in the direction in which the entire each of the beams extends, the stress damping sections absorbs the disturbance force. Because stress imposed in the direction in which the entire each of the beams extends becomes minimally changeable, and the deformability of the beam also becomes difficult to change, and this reduces the change in the sensitivity of the acceleration sensor caused by disturbance force.
摘要翻译：包括灵敏度的特性的加速度传感器相对于施加到传感器芯片的干扰力不太可能改变。加速度传感器具有支撑框架，通过柔性梁支撑在支撑框架内的重物，设置在梁上的半导体压阻元件和互连压阻元件的布线。加速度传感器根据压阻元件的电阻变化来检测加速度。应力阻尼部分设置在梁的那些部分上，排除了设置压电元件的部分。每个应力阻尼部分相对于梁的长度中心线和梁的宽度中心线之间的交点相对称。当扰动力沿着每个梁的整个方向延伸的方向施加到传感器元件时，应力阻尼部分吸收扰动力。由于施加在整个梁的整个延伸方向上的应力最小可变化，并且梁的变形性也变得难以改变，并且这减小了由扰动力引起的加速度传感器的灵敏度的变化。

6. 发明申请

US20080120449A1 Bus relay device and bus control system 有权
标题翻译：总线继电器和总线控制系统
公开(公告)号：US20080120449A1
公开(公告)日：2008-05-22
申请号：US11984607
申请日：2007-11-20
申请人： Atsushi Kazama
发明人： Atsushi Kazama
IPC分类号： G06F13/18
CPC分类号： G06F13/4031
摘要： In the conventional bus control system, the interconnect section and the bridge section have the arbitration function. Meanwhile, the interconnect section and the bridge section were designed by different designers. Accordingly, a large number of man-hours are needed not only for designing the bridge section but also for inspecting the bridge section. To solve this problem, provided is a system comprising a plurality of bus masters coupled to a high speed bus and outputting first control signals respectively via the high speed bus; a bus slave coupled to a low speed bus and receiving a second control signal via the low speed bus; an interconnect section receiving the first control signals via the high speed bus, selecting one of the first control signals, and converting the selected one of the first signals into a third control signal relative to the second control signal; and a bridge section coupled to the low speed bus, converting the third control signal into the second control signal, and outputting the second control signal to the low speed bus. With this configuration, the bus arbitrations can be collectively controlled in the interconnect section alone. In addition, a circuit size can be reduced.
摘要翻译：在常规总线控制系统中，互连部分和桥接部分具有仲裁功能。同时，互连部分和桥接部分由不同的设计者设计。因此，不仅需要设计桥段，而且还需要大量工时来检查桥段。为了解决这个问题，提供了一种系统，包括耦合到高速总线的多个总线主机，并分别经由高速总线输出第一控制信号; 耦合到低速总线并经由低速总线接收第二控制信号的总线从设备; 互连部分，经由高速总线接收第一控制信号，选择第一控制信号中的一个，并将所选择的一个第一信号转换成相对于第二控制信号的第三控制信号; 以及耦合到所述低速总线的桥接部分，将所述第三控制信号转换为所述第二控制信号，并将所述第二控制信号输出到所述低速总线。利用这种配置，总线仲裁可以单独地在互连部分中统一控制。此外，可以减小电路尺寸。

7. 发明授权

US07233715B2 Optical switch and optical switch system 失效
标题翻译：光开关和光开关系统
公开(公告)号：US07233715B2
公开(公告)日：2007-06-19
申请号：US10765984
申请日：2004-01-29
申请人： Atsushi Kazama , Kazuyuki Fukuda , Masaya Horino , Yasuhiro Itou
发明人： Atsushi Kazama , Kazuyuki Fukuda , Masaya Horino , Yasuhiro Itou
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/3564 , G02B6/3518 , G02B6/3556 , G02B6/357 , G02B6/359
摘要： A small-size thin-bodied 3-dimensional matrix switch using a micro mirror array, comprises a collimator array with a plurality of collimators coupled to optical fibers, a mirror array with a plurality of movable mirrors, in which each movable mirror has light from a first collimator of the collimator array optically coupled thereto, a first mirror which has the light from the mirror of the mirror array optically coupled thereto, a second mirror which has the light from the first mirror optically coupled thereto, and a second collimator of the collimator array, which has the light from the second mirror coupled thereto, wherein the light leaving the second mirror passes the first mirror and the mirror array and optically couples to the second collimator.
摘要翻译：使用微反射镜阵列的小尺寸薄体3维矩阵开关包括具有耦合到光纤的多个准直器的准直器阵列，具有多个可移动反射镜的反射镜阵列，其中每个可移动镜具有来自光学耦合到其上的准直器阵列的第一准直器，第一反射镜，其具有与其光学耦合的反射镜阵列的反射镜的光;第二反射镜，其具有与第一反射镜光耦合的光;以及第二准直器，准直器阵列具有耦合到其上的第二反射镜的光，其中离开第二反射镜的光通过第一反射镜和反射镜阵列并光学耦合到第二准直器。

8. 发明授权

US06946723B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06946723B2
公开(公告)日：2005-09-20
申请号：US09809181
申请日：2001-03-16
申请人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
发明人： Toshiya Satoh , Masahiko Ogino , Tadanori Segawa , Yoshihide Yamaguchi , Hiroyuki Tenmei , Atsushi Kazama , Ichiro Anjo , Asao Nishimura
IPC分类号： H01L23/29 , H01L21/301 , H01L21/3205 , H01L21/56 , H01L21/60 , H01L21/768 , H01L23/31 , H01L23/485 , H01L23/52 , H01L23/522 , H01L23/495
CPC分类号： H01L24/11 , H01L23/3192 , H01L24/13 , H01L2224/02125 , H01L2224/0231 , H01L2224/0236 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05171 , H01L2224/05548 , H01L2224/05644 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor device having a semiconductor element is obtained by cutting a semiconductor wafer, having an electrode pad formed on one side thereof, along a scribe line. The semiconductor device has a semiconductor element protective layer on the semiconductor element so as to form an opening above the pad, a stress cushioning layer on the layer so as to form an opening on the pad, a lead wire portion reaching the layer from the electrode pad via the openings, external electrodes on the lead wire portion, and a conductor protective layer on the layer. The layer, the layer, and the conductor protective layer form respective end faces on the end surface of the semiconductor element inside the scribe line and expose a surface of the semiconductor element from the end face of the end surface to a point inside of the scribe line, thereby to expose the scribe line.
摘要翻译：具有半导体元件的半导体器件通过沿着划线切割具有在其一侧形成的电极焊盘的半导体晶片来获得。半导体器件在半导体元件上具有半导体元件保护层，以便在焊盘上形成开口，该层上的应力缓冲层在焊盘上形成开口，从电极到达该层的引线部分通过开口焊盘，引线部分上的外部电极以及该层上的导体保护层。层，层和导体保护层在划线内部的半导体元件的端面上形成相应的端面，并将半导体元件的表面从端表面的端面暴露于刻痕内侧线，从而暴露划线。

9. 发明授权

US06777816B2 Multi-chip module 有权
公开(公告)号：US06777816B2
公开(公告)日：2004-08-17
申请号：US10700470
申请日：2003-11-05
申请人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
发明人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
IPC分类号： H01L2131
CPC分类号： H01L23/3157 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/1005 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The stress-relaxation layer of a first semiconductor chip is thicker than the stress-relaxation layer of a second semiconductor chip having a distance from a center thereof to an external terminal positioned at an outermost end portion thereof smaller than that of the first semiconductor chip.

10. 发明授权

US06696765B2 Multi-chip module 有权
标题翻译：多芯片模块
公开(公告)号：US06696765B2
公开(公告)日：2004-02-24
申请号：US09988415
申请日：2001-11-19
申请人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
发明人： Atsushi Kazama , Akihiro Yaguchi , Hideo Miura , Asao Nishimura
IPC分类号： H01L2131
CPC分类号： H01L23/3157 , H01L23/3114 , H01L23/3171 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/73 , H01L25/0655 , H01L25/105 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/16 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2225/1005 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module has at least two semiconductor chips. Each of the semiconductor chips has chip electrodes of the semiconductor chip, electrically conductive interconnections for electrically connection with the chip electrodes, electrically conductive lands for electrically connection with the interconnections, external terminals placed on the lands, and a stress-relaxation layer intervening between the lands and the semiconductor chip. The semiconductor chips are placed on a mounting board via the external terminals. The stress-relaxation layer of a first semiconductor chip is thicker than the stress-relaxation layer of a second semiconductor chip having a distance from a center thereof to an external terminal positioned at an outermost end portion thereof smaller than that of the first semiconductor chip.
摘要翻译：多芯片模块具有至少两个半导体芯片。每个半导体芯片具有半导体芯片的芯片电极，用于与芯片电极电连接的导电互连，用于与互连电连接的导电焊盘，设置在焊盘上的外部端子以及介于两者之间的应力松弛层土地和半导体芯片。半导体芯片通过外部端子放置在安装板上。第一半导体芯片的应力松弛层厚于第二半导体芯片的应力松弛层，该第二半导体芯片的距离其中心至位于其最外端部分的外部端子的距离小于第一半导体芯片的应力松弛层。

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