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    • 5. 发明授权
    • Solution raw material for forming composite oxide type dielectric thin film and dielectric thin film
    • 用于形成复合氧化物型电介质薄膜和电介质薄膜的溶液原料
    • US06485554B1
    • 2002-11-26
    • US09184510
    • 1998-11-02
    • Atsushi ItsukiTaiji TachibanaKatsumi Ogi
    • Atsushi ItsukiTaiji TachibanaKatsumi Ogi
    • C23C1640
    • C23C16/045C23C16/409
    • The present invention provides a solution suitable for forming a composite oxide type dielectric thin film containing at least one organometallic compound dissolved in at least one solvent selected from the group consisting of cyclic or acyclic diethers, alkyl-substituted cyclic monoethers, mono- or di-branched alkyl monoethers, alkoxy alcohols, diols, and acetoacetic esters, or dissolved in a solvent mixture comprising at least one solvent selected from the group consisting of cyclic and acyclic saturated hydrocarbons, and at least one solvent selected from the group consisting of cyclic or acyclic diethers, alkyl-substituted cyclic monoethers, mono- or di-branched alkyl monoethers, alkoxy alcohols, diols, acetoacetic esters, and unsubstituted or alkyl-substituted pyridine. These solutions can be used in a metal oxide chemical deposition method (a MOCVD method, a chemical vapor deposition method using an organometallic compound) to prepare composite oxide (for example, barium strontium titanate) type dielectric thin films on substrates.
    • 本发明提供了一种适用于形成复合氧化物型电介质薄膜的溶液,所述复合氧化物型电介质薄膜含有至少一种溶解在选自环状或非环状二醚,烷基取代环状单醚,单 - 或二 - 支链烷基单醚,烷氧基醇,二醇和乙酰乙酸酯,或溶解在包含至少一种选自环状和非环状饱和烃的溶剂的溶剂混合物中,和至少一种选自环状或非环状的溶剂 二醚,烷基取代的环状单醚,单或二支链烷基单醚,烷氧基醇,二醇,乙酰乙酸酯和未取代的或烷基取代的吡啶。 这些溶液可以用于金属氧化物化学沉积法(MOCVD法,使用有机金属化合物的化学气相沉积法)中以在基底上制备复合氧化物(例如钛酸钡锶)​​型电介质薄膜。
    • 6. 发明授权
    • Organic copper compound, liquid mixture containing the compound, and copper thin-film prepared using the solution
    • 有机铜化合物,含有该化合物的液体混合物,以及使用该溶液制备的铜薄膜
    • US06310228B1
    • 2001-10-30
    • US09736305
    • 2000-12-15
    • Atsushi ItsukiKatsumi Ogi
    • Atsushi ItsukiKatsumi Ogi
    • C07F724
    • C07F7/0896C07F7/0803C07F7/1804Y10T428/31678
    • An organic copper compound is provided that is represented by the following formula (1) in which monovalent copper is coordinated with a &bgr;-diketone compound and an unsaturated hydrocarbon compound having a silyloxy group: wherein R Is an unsaturated hydrocarbon moiety, L is the &bgr;-diketone compound, X1, X2, and X3 are each a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and X1, X2, and X3 may be the same or different from each other. The organic copper compound is barely decomposed in a stock solution before use, has a prolonged storage life, exhibits a high film deposition rate, can be effectively decomposed on a substrate, is highly volatile, and exhibits high adhesiveness to an underlayer.
    • 提供由下式(1)表示的有机铜化合物,其中一价铜与β-二酮化合物和具有甲硅烷氧基的不饱和烃化合物配位:其中R是不饱和烃部分,L是β 二酮化合物,X1,X2和X3各自为氢原子,碳原子数1〜5的烷基或碳原子数1〜4的烷氧基,X1,X2,X3可以相同或不同 从彼此。 有机铜化合物在使用前在储备溶液中几乎不分解,具有延长的储存寿命,显示出高的成膜速率,可以在基材上有效分解,高挥发性,并且对底层粘合性高。