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1. 发明授权

US08586875B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08586875B2
公开(公告)日：2013-11-19
申请号：US12956753
申请日：2010-11-30
申请人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
发明人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/185 , H05K3/4602 , H05K2201/10015
摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
摘要翻译：布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物，形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。第一个导体连接第一和第二个电路。第二导体连接第一和第二导电部分。第一电路的厚度被设定为大于第一导电部分的厚度。

2. 发明申请

US20110209905A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20110209905A1
公开(公告)日：2011-09-01
申请号：US12956753
申请日：2010-11-30
申请人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
发明人： Haruhiko Morita , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/09 , H01K3/10
CPC分类号： H05K1/0222 , H05K1/185 , H05K3/4602 , H05K2201/10015
摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
摘要翻译：布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物，形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。第一个导体连接第一和第二个电路。第二导体连接第一和第二导电部分。第一电路的厚度被设定为大于第一导电部分的厚度。

3. 发明申请

US20110284282A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20110284282A1
公开(公告)日：2011-11-24
申请号：US13053644
申请日：2011-03-22
申请人： Atsushi Ishida , Ryojiro Tominaga , Haruhiko Morita
发明人： Atsushi Ishida , Ryojiro Tominaga , Haruhiko Morita
IPC分类号： H05K1/11 , H05K3/42
CPC分类号： H05K1/0251 , H05K3/429 , H05K3/4602 , H05K2201/09809 , Y10T29/49165
摘要： A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.
摘要翻译：一种印刷线路板布线板，包括：具有形成在第一贯通孔周围的第一贯通孔和多个第二贯通孔的基板，形成在基板的一个面上的第一导电部和第二导电部，第三导电部和第四导电部形成在所述基板的相对表面上的导电部分，形成在所述第一贯通孔中并连接所述第一导电部和所述第三导电部的第一通孔导体，以及形成在所述第二贯通孔中的多个第二通孔导体，第二导电部分和第四导电部分。第一通孔导体和第二通孔导体由填充在第一贯通孔或第二贯通孔中的导电材料构成。

4. 发明授权

US08729405B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08729405B2
公开(公告)日：2014-05-20
申请号：US13053644
申请日：2011-03-22
申请人： Atsushi Ishida , Ryojiro Tominaga , Haruhiko Morita
发明人： Atsushi Ishida , Ryojiro Tominaga , Haruhiko Morita
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K3/429 , H05K3/4602 , H05K2201/09809 , Y10T29/49165
摘要： A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.
摘要翻译：一种印刷线路板布线板，包括：具有形成在第一贯通孔周围的第一贯通孔和多个第二贯通孔的基板;形成在基板的一个面上的第一导电部和第二导电部，第三导电部和第四导电部形成在所述基板的相对表面上的导电部分，形成在所述第一贯通孔中并连接所述第一导电部和所述第三导电部的第一通孔导体，以及形成在所述第二贯通孔中的多个第二通孔导体，第二导电部分和第四导电部分。第一通孔导体和第二通孔导体由填充在第一贯通孔或第二贯通孔中的导电材料构成。

5. 发明授权

US08541695B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08541695B2
公开(公告)日：2013-09-24
申请号：US12956826
申请日：2010-11-30
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/0271 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K2201/0347 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09827
摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.
摘要翻译：布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部，以及在所述第二穿透孔的相对端上的第二导电部分。第一导体连接第一电路和第二电路。第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。

6. 发明申请

US20100243311A1 SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有金属膜的基板及其制造方法
公开(公告)号：US20100243311A1
公开(公告)日：2010-09-30
申请号：US12607666
申请日：2009-10-28
申请人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H01R12/04 , H01K3/10
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/387 , H05K3/422 , H05K3/4682 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/09581 , H05K2201/09827 , H05K2203/1168
摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.
摘要翻译：一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层，第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。第一绝缘层的第一表面面向第二绝缘层的第二表面。

7. 发明授权

US08826530B2 Method for manufacturing substrate with metal film 有权
标题翻译：金属膜制造衬底的方法
公开(公告)号：US08826530B2
公开(公告)日：2014-09-09
申请号：US12732635
申请日：2010-03-26
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H01K3/10 , H05K3/46 , H05K3/00 , C25D7/12 , H05K3/42 , C25D5/02 , H05K3/38
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译：一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

8. 发明授权

US08624127B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US08624127B2
公开(公告)日：2014-01-07
申请号：US12952864
申请日：2010-11-23
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译：布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路，衬底和第一或第二电路，以及在层间层上的第三导电电路。层间层在层间层中具有通孔导体，并连接第三电路和第二导体。衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体。通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

9. 发明申请

US20100243305A1 SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有金属膜的基板及其制造方法
公开(公告)号：US20100243305A1
公开(公告)日：2010-09-30
申请号：US12732635
申请日：2010-03-26
申请人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/00 , C08F2/48 , B05D3/06
CPC分类号： H05K3/0032 , C25D5/02 , C25D7/12 , C25D7/123 , H05K3/387 , H05K3/422 , H05K3/4602 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2203/095 , H05K2203/1572 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.
摘要翻译：一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

10. 发明授权

US08563873B2 Substrate with metal film and method for manufacturing the same 有权
标题翻译：金属薄膜基板及其制造方法
公开(公告)号：US08563873B2
公开(公告)日：2013-10-22
申请号：US12607666
申请日：2009-10-28
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
IPC分类号： H05K1/11 , C08F2/46 , C08J7/18
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/387 , H05K3/422 , H05K3/4682 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/09581 , H05K2201/09827 , H05K2203/1168
摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.
摘要翻译：一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层，第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。第一绝缘层的第一表面面向第二绝缘层的第二表面。

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