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2. 发明专利

JP2008135708A Joint measurement of joined substrates 有权
标题翻译：接合基板的接合测量
公开(公告)号：JP2008135708A
公开(公告)日：2008-06-12
申请号：JP2007252998
申请日：2007-09-28
申请人： Asml Netherlands Bv , エーエスエムエルネザーランズビー.ブイ.
发明人： KEITH FRANK BEST , GUI CHENG-QUN , SUTEDJA BUDIMAN , DE LAAT WILHELMUS JOHANNES MAR
IPC分类号： H01L21/68 , H01L21/02 , H05K3/00
CPC分类号： B23K31/02 , B23K2201/40
摘要： PROBLEM TO BE SOLVED: To provide a new measurement of joint property for joined substrates in an SOI substrate joining technique. SOLUTION: The invention deals with how to measure a joint property of joined substrates having an upper substrate on an upper surface of a lower substrate, wherein the method includes etching one or more windows within the upper substrate, i.e., an overlay measuring alignment mark on the upper substrate is recognized by a measurement system, an overlay measuring alignment mark on the lower substrate is recognized by the measurement system, which is a measurement system used for measuring positions of the overlay measuring alignment marks, the distance between the correspondent overlay measuring alignment marks on the upper and lower substrates is determined, and in consideration of the offset between the overlay measuring alignment mark on the upper substrate and that of the lower one, the determined distance may be adjusted. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了在SOI衬底接合技术中提供接合衬底的接合特性的新测量。解决方案：本发明涉及如何测量在下基板的上表面上具有上基板的接合基板的接合特性，其中该方法包括蚀刻上基板内的一个或多个窗口，即覆盖测量上基板上的对准标记被测量系统识别，下基板上的覆盖测量对准标记被测量系统识别，该测量系统是用于测量覆盖测量对准标记的位置的测量系统，记者之间的距离确定上基板和下基板上的覆盖测量对准标记，并且考虑到上基板上的覆盖测量对准标记与下基板之间的偏移量，可以调整所确定的距离。版权所有（C）2008，JPO＆INPIT

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