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1. 发明授权

US06702654B2 Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof 有权
标题翻译：用于调节半导体晶片抛光垫的调节轮及其制造方法
公开(公告)号：US06702654B2
公开(公告)日：2004-03-09
申请号：US09778986
申请日：2001-02-07
申请人： Arun K. Nanda , Jose Omar Rodriguez , Laurence D. Schultz , Charles A. Storey
发明人： Arun K. Nanda , Jose Omar Rodriguez , Laurence D. Schultz , Charles A. Storey
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/12 , B24D3/06 , B24D3/34 , Y10T29/4981 , Y10T29/49888
摘要： The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.
摘要翻译：本发明提供了一种用于调节用于抛光半导体晶片的抛光垫的改进的调节轮。在一个实施例中，调节轮包括具有位于其上的金属表面的平面主体。金属表面具有嵌入其中的磨料颗粒和沉积在金属表面上的保持器涂层和磨料颗粒。保持器涂层在调节过程中抑制磨料颗粒的移动。

2. 发明授权

US06951510B1 Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size 失效
标题翻译：化学机械抛光垫，槽间距较大，沟槽尺寸较小
公开(公告)号：US06951510B1
公开(公告)日：2005-10-04
申请号：US10799279
申请日：2004-03-12
申请人： Jose Omar Rodriguez , Charles A. Storey , John F. Thompson
发明人： Jose Omar Rodriguez , Charles A. Storey , John F. Thompson
IPC分类号： B24B1/00
CPC分类号： B24B37/26
摘要： A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.
摘要翻译：提供化学机械抛光（CMP）垫。 CMP垫包括设置在垫的抛光表面上的凹槽图案。凹槽图案由间隔开的凹槽的交替顺序形成。槽的交替顺序包括第一尺寸的凹槽和第二尺寸的凹槽，其中第一和第二凹槽尺寸彼此不同。

3. 发明授权

US07527544B2 System of using offset gage for CMP polishing pad alignment and adjustment 失效
标题翻译： CMP抛光垫对准和调整使用偏移量计的系统
公开(公告)号：US07527544B2
公开(公告)日：2009-05-05
申请号：US11968930
申请日：2008-01-03
申请人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
发明人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/34 , B24B37/20
摘要： A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.
摘要翻译：提供了使用偏移表盘来对准和调整已经附着到化学机械抛光（CMP）装置的转盘上的抛光垫的方法和系统。在所描述的实施例中，偏移表盘具有接触转盘侧面的表面，而传感器尖端接触位于转台上的抛光垫的边缘。这提供了在该测量点处相对于转台侧的抛光垫边缘的径向位移的评估。基于一个或多个这样的测量，可以发现抛光垫可接受地定位，可以被修整或可以被替换。该方法和系统减少或消除与CMP转台相关的半导体晶片的侧面卸载发生的缺陷图案的发生。

4. 发明授权

US07338569B2 Method and system of using offset gage for CMP polishing pad alignment and adjustment 有权
标题翻译： CMP抛光垫对准和调整使用偏移量计的方法和系统
公开(公告)号：US07338569B2
公开(公告)日：2008-03-04
申请号：US10953477
申请日：2004-09-29
申请人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
发明人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
IPC分类号： B32B41/00
CPC分类号： B24B37/34 , B24B37/20
摘要： A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.
摘要翻译：提供了使用偏移表盘来对准和调整已经附着到化学机械抛光（CMP）装置的转盘上的抛光垫的方法和系统。在所描述的实施例中，偏移表盘具有接触转盘侧面的表面，而传感器尖端接触位于转台上的抛光垫的边缘。这提供了在该测量点处相对于转台侧的抛光垫边缘的径向位移的评估。基于一个或多个这样的测量，可以发现抛光垫可接受地定位，可以被修整或可以被替换。该方法和系统减少或消除与CMP转台相关的半导体晶片的侧面卸载发生的缺陷图案的发生。

5. 发明授权

US07172496B1 Method and apparatus for cleaning slurry depositions from a water carrier 有权
标题翻译：从水载体清洗浆料沉积物的方法和装置
公开(公告)号：US07172496B1
公开(公告)日：2007-02-06
申请号：US11205382
申请日：2005-08-17
申请人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
发明人： Jose Omar Rodriguez , Charles A. Storey , Andres B. Garcia , Margareth Seputro , Frank Miceli
IPC分类号： B24B55/00
CPC分类号： B24B37/345 , B08B3/02 , B24B55/00
摘要： Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.
摘要翻译：这里公开了一种减少集成电路晶片的污染的方法，该集成电路晶片由布置在载体背面的残余浆料组分引起，用于接合集成电路晶片。还公开了一种被配置为洗涤载体的背面的CMP机器。

6. 发明授权

US07033257B2 Carrier head for chemical mechanical polishing 失效
公开(公告)号：US07033257B2
公开(公告)日：2006-04-25
申请号：US10895574
申请日：2004-07-21
申请人： Andres B. Garcia , Jose Omar Rodriguez , Charles A. Storey
发明人： Andres B. Garcia , Jose Omar Rodriguez , Charles A. Storey
IPC分类号： B24B29/00 , B24B5/00
CPC分类号： B24B37/30 , B24B49/16
摘要： A carrier head for supporting a wafer during a chemical mechanical polishing process is provided. In one exemplary implementation, the carrier head may comprise a wear ring, and a slidably movable pressure plate disposed within the wear ring. The pressure plate may be arranged to provide slidable movement relative to the wear ring. This degree of freedom can accommodate height dimensional changes that may occur in the wear ring.

7. 发明授权

US06354910B1 Apparatus and method for in-situ measurement of polishing pad thickness loss 有权
标题翻译：用于现场测量抛光垫厚度损失的装置和方法
公开(公告)号：US06354910B1
公开(公告)日：2002-03-12
申请号：US09494705
申请日：2000-01-31
申请人： Richardson O. Adebanjo , William Graham Easter , Alvaro Maury , Frank Miceli , Jose Omar Rodriguez
发明人： Richardson O. Adebanjo , William Graham Easter , Alvaro Maury , Frank Miceli , Jose Omar Rodriguez
IPC分类号： B24B4900
CPC分类号： B24B37/11 , B24B49/02 , B24B53/017
摘要： A non-destructive method for measuring the thickness loss of a polishing pad due to pad conditioning includes the use of rigid planar members placed on the surfaces of both the conditioned and non-conditioned sections of the polishing pad. Measurements are made using measurement instruments which overhang the depressed conditioned section and measure the height difference between the upper surfaces of the planar members. The measurement instruments may be repositioned and measurements repeated to obtain an average thickness loss.
摘要翻译：用于测量由于衬垫调节引起的抛光垫的厚度损失的非破坏性方法包括使用放置在抛光垫的调理部分和非调节部分的表面上的刚性平面部件。使用测量仪器进行测量，该测量仪器伸出凹陷的调节部分并测量平面部件的上表面之间的高度差。可以重新定位测量仪器并重复测量以获得平均厚度损失。

8. 发明授权

US5975836A Apparatus for visually reading semiconductor wafer identification indicia 失效
标题翻译：用于视觉读取半导体晶片识别标记的装置
公开(公告)号：US5975836A
公开(公告)日：1999-11-02
申请号：US824574
申请日：1997-03-26
申请人： Jose Omar Rodriguez
发明人： Jose Omar Rodriguez
IPC分类号： H01L21/677 , H01L21/68
CPC分类号： H01L21/67781 , Y10S414/137
摘要： The apparatus has a substantially planar base having a surface which defines a wafer cassette receiving station and a wafer receiving station. A transportable wafer cassette is removably coupled to the base in the wafer cassette receiving station. The transportable wafer cassette is provided for holding a plurality of wafers in an axially aligned manner, each of the wafers having identification indicia disposed on a surface thereof. A wafer receiving cassette is coupled to the base adjacent to the transportable wafer cassette in the wafer receiving station. A first reciprocally moveable wafer transfer member is attached to the base, and is operative for transferring the wafers held in the transportable wafer cassette to the wafer receiving cassette. The wafer transfer member includes a wedge shaped block for aligning the wafers in the wafer receiving cassette in an axially offset manner relative to each other so that the identification indicia on the surface of each wafer is visible for reading by an operator. A second reciprocally moveable wafer transfer member disposed adjacent to the base is provided for transferring the remaining wafers from the wafer receiving cassette to the transportable wafer cassette and aligning the wafers in the transportable wafer cassette in an axially aligned manner.
摘要翻译：该装置具有基本平坦的基底，其具有限定晶片盒接收台和晶片接收台的表面。可移动的晶片盒可拆卸地联接到晶片盒接收台中的基座。可移动的晶片盒被提供用于以轴向对准的方式保持多个晶片，每个晶片具有设置在其表面上的识别标记。晶片接收盒与晶片接收台中的可移动晶片盒相邻的基座耦合。第一可往复移动的晶片传送构件附接到基座，并且可操作用于将保持在可移动的晶片盒中的晶片传送到晶片接收盒。晶片传送构件包括楔形块，用于使晶片接收盒中的晶片相对于彼此以轴向偏移的方式对准，使得每个晶片的表面上的识别标记可见以供操作员阅读。设置邻近基座设置的第二可往复移动的晶片传送部件，用于将剩余的晶片从晶片接收盒传送到可移动的晶片盒，并以轴向对准的方式将可移动的晶片盒中的晶片对准。

9. 发明授权

US06373945B1 Terminal block extension for greater wire packing efficiency 有权
标题翻译：接线端子延伸，以提高线材包装效率
公开(公告)号：US06373945B1
公开(公告)日：2002-04-16
申请号：US09417232
申请日：1999-10-13
申请人： William G. Easter , Dale D. Evans , John A. Maze , Frank Miceli , Jose Omar Rodriguez
发明人： William G. Easter , Dale D. Evans , John A. Maze , Frank Miceli , Jose Omar Rodriguez
IPC分类号： H04M100
CPC分类号： H04M1/0293 , H01R31/005 , H01R2201/16 , H04Q1/142
摘要： The present invention provides a terminal block extension for use with a terminal block having electrical contacts and that is electrically coupled to a wiring system. In one embodiment, the terminal block comprises an insulating body having first and second coupling ends and a first conductor disposed within the insulating body having first and second conducting ends. The first coupling end is configured to mechanically couple to the terminal block. The second coupling end is configured to mechanically couple to another terminal block extension. The first conducting end is configured to couple to one of the electrical contacts. The second conducting end is configured to receive a first wire of the wiring system and cooperatively engage a first coupling end of another terminal block extension.
摘要翻译：本发明提供了一种用于具有电触头并且电连接到布线系统的端子块的端子块延伸。在一个实施例中，端子块包括具有第一和第二耦合端的绝缘体和设置在绝缘体内的具有第一和第二导电端的第一导体。第一耦合端被配置为机械地耦合到端子块。第二联接端被配置为机械地耦合到另一端子块延伸部。第一导电端被配置成耦合到一个电触点。第二导电端被配置为接收布线系统的第一线，并协同地接合另一端子块延伸部的第一耦合端。

10. 发明授权

US06281128B1 Wafer carrier modification for reduced extraction force 有权
标题翻译：晶片载体修改减少提取力
公开(公告)号：US06281128B1
公开(公告)日：2001-08-28
申请号：US09332216
申请日：1999-06-14
申请人： Alvaro Maury , John A. Maze , Frank Miceli , Jose Omar Rodriguez , Robert M. Symons
发明人： Alvaro Maury , John A. Maze , Frank Miceli , Jose Omar Rodriguez , Robert M. Symons
IPC分类号： H01L21302
CPC分类号： B24B37/30
摘要： The present invention provides a wafer carrier for use with a semiconductor wafer polishing apparatus. In one embodiment, the wafer carrier comprises a carrying head having opposing first and second surfaces, a primary channel system formed in the second surface, and a secondary channel system formed in the second surface. The first surface is coupleable to the semiconductor polishing apparatus and the second surface is adapted to receive a semiconductor wafer to be polished. The primary channel system comprises first and second intersecting channels. The secondary channel system intersects the primary channel system so that the secondary channel system and the primary channel system cooperate to occupy a substantial portion of a surface area of the second surface. Therefore, the primary channel system and the secondary channel system decrease an amount of force required to remove the semiconductor wafer from the second surface.
摘要翻译：本发明提供一种与半导体晶片抛光装置一起使用的晶片载体。在一个实施例中，晶片载体包括具有相对的第一和第二表面的承载头，形成在第二表面中的主要通道系统，以及形成在第二表面中的辅助通道系统。第一表面可耦合到半导体抛光装置，第二表面适于接收待抛光的半导体晶片。主通道系统包括第一和第二相交通道。次通道系统与主通道系统相交，使得辅助通道系统和主通道系统协同占据第二表面的表面区域的主要部分。因此，主通道系统和次通道系统减少了从第二表面移除半导体晶片所需的力。

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