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1. 发明申请

US20060003570A1 Method and apparatus for electroless capping with vapor drying 审中-公开
标题翻译：用蒸气干燥法进行化学镀覆盖的方法和装置
公开(公告)号：US20060003570A1
公开(公告)日：2006-01-05
申请号：US11004014
申请日：2004-12-02
申请人： Arulkumar Shanmugasundram , Robert Tolles , Russel Ellwanger
发明人： Arulkumar Shanmugasundram , Robert Tolles , Russel Ellwanger
IPC分类号： H01L21/4763 , H01L21/44
CPC分类号： H01L21/288 , H01L21/02068 , H01L21/02074 , H01L21/02087 , H01L21/67034 , H01L21/67046 , H01L21/67051 , H01L21/67161 , H01L21/76849 , H01L21/76874
摘要： Embodiments of the invention relate to a method and apparatus for forming an electroless capping layer over the copper features of a substrate including one or more vapor drying steps. An embodiment of the method includes vapor drying the substrate; optionally applying a dielectric clean solution to the substrate; optionally applying a metal clean solution to the substrate; forming a capping layer by electroless deposition selectively over exposed metal portions of the substrate; and optionally applying a post-deposition clean solution to the substrate structure. In one example, a vapor drying step may be performed prior to forming the capping layer. In another example, the vapor drying step may be performed after forming the capping layer. In another example, a vapor drying step may be performed prior to applying the dielectric clean solution or applying the metal clean solution. In still another example, a vapor drying step may be performed after applying a post-deposition clean solution.
摘要翻译：本发明的实施例涉及一种用于在包括一个或多个蒸汽干燥步骤的基底的铜特征上形成无电覆盖层的方法和装置。该方法的一个实施方案包括蒸发干燥基材; 可选地将电介质清洁溶液施加到基底上; 任选地将金属清洁溶液施加到所述基底上; 通过在基板的暴露的金属部分上选择性地通过无电沉积形成覆盖层; 以及任选地将沉积后清洁溶液施加到所述基底结构。在一个实例中，蒸汽干燥步骤可以在形成覆盖层之前进行。在另一个实例中，蒸汽干燥步骤可以在形成覆盖层之后进行。在另一个实例中，蒸汽干燥步骤可以在施加电介质清洁溶液或施加金属清洁溶液之前进行。在另一个实例中，可以在施加沉积后的清洁溶液之后进行蒸气干燥步骤。

2. 发明申请

US20060154568A1 Multilayer polishing pad and method of making 有权
标题翻译：多层抛光垫及其制作方法
公开(公告)号：US20060154568A1
公开(公告)日：2006-07-13
申请号：US11375480
申请日：2006-03-13
申请人： Robert Tolles
发明人： Robert Tolles
IPC分类号： B24B49/00
CPC分类号： B24B37/205 , B24B37/013 , B24B49/12 , Y10S451/921
摘要： A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window that includes an aperture in the backing layer aligned with a solid transparent portion in the polishing layer.
摘要翻译：抛光垫具有抛光层，其具有抛光表面和第一对准标记，以及与抛光层连接并具有与第一对准标记对准的第二对准标记的背衬层。抛光垫可以具有包括背衬层中的孔的窗口，其与抛光层中的固体透明部分对准。

3. 发明申请

US20060194525A1 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 有权
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US20060194525A1
公开(公告)日：2006-08-31
申请号：US11329648
申请日：2006-01-10
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B9/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A polishing method usable in an apparatus including a rotatable member rotatable about a first axis, at least one substrate head assembly supported on said rotatable member, and at least two polishing surfaces arranged below said rotatable member at respective angular positions about said first axis is described. In one implementation, a substrate can be mounted onto a first one of said at least one substrate head assembly. The rotatable member can be rotated to a position so that the substrate overlies a selected one of the polishing surfaces. The substrate can be engaged with said selected polishing surface and relative linear movement imparted between the selected polishing surface and the first substrate head assembly, while the substrate is engaged with the selected polishing surface.
摘要翻译：描述了可用于包括可围绕第一轴可旋转的可旋转构件，支撑在所述可旋转构件上的至少一个基板头组件和在围绕所述第一轴线的各个角位置处布置在所述可旋转构件下方的至少两个抛光表面的设备的抛光方法，。在一个实施方案中，可以将衬底安装在所述至少一个衬底头组件中的第一个上。可旋转构件可以旋转到一个位置，使得衬底覆盖所选择的一个抛光表面。衬底可以与所选择的抛光表面接合并且在所选择的抛光表面和第一衬底头组件之间施加的相对线性运动，同时衬底与所选择的抛光表面接合。

4. 发明授权

US06371836B1 Groove cleaning device for chemical-mechanical polishing 失效
标题翻译：用于化学机械抛光的槽清洁装置
公开(公告)号：US06371836B1
公开(公告)日：2002-04-16
申请号：US09666511
申请日：2000-09-20
申请人： Brian J. Brown , Robert Tolles , James C. Nystrom , Doyle Bennett , Madhavi Chandrachood
发明人： Brian J. Brown , Robert Tolles , James C. Nystrom , Doyle Bennett , Madhavi Chandrachood
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.
摘要翻译：提供了改进的化学机械抛光方法和装置。使用刷子来持续地从抛光垫上的表面特征（例如凹槽）刷洗浆料颗粒。以这种方式，当浆料通过下方并且经受晶片抛光头的压缩力时，防止浆料在凹槽内变得压实。本发明可以通过使用可操作地耦合到抛光垫表面的固定刷或者通过改进的调节组件来实现，该调节组件具有用于调节抛光垫的金刚石表面和用于清洁垫的表面特征的刷子。当调整组件的刷部分扫过抛光垫的表面时，调节组件的刷部分可以或可以不旋转。

5. 发明申请

US20050048880A1 Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motion 失效
标题翻译：化学机械抛光系统具有多个抛光台并提供相对的线性抛光运动
公开(公告)号：US20050048880A1
公开(公告)日：2005-03-03
申请号：US10965202
申请日：2004-10-13
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B27/00 , B24B37/04 , B24B41/00 , B24B41/06 , B24B53/007 , B24B53/12 , B24B57/02 , H01L21/00 , H01L21/306 , B24B49/00 , B24B7/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： An apparatus and associated methods for polishing semiconductor wafers and other workpieces that includes polishing surfaces located at multiple polishing stations. Multiple wafer heads, preferably at least one greater in number than the number of polishing stations, can be loaded with individual wafers. The wafer heads are suspended from a rotatable support, which provides circumferential positioning of the heads relative to the polishing surfaces, and the wafer heads move linearly with respect to the polishing surface, thus providing relative linear motion between the wafer and the polishing station. A load/unload station may be located at a position symmetric with the polishing surfaces. The rotatable support can simultaneously position one of the heads over the load/unload station while the remaining heads are located over polishing stations for wafer polishing so that loading and unloading of wafers can be performed concurrently with wafer polishing. The multiple polishing stations can be used to sequentially polish a wafer held in a wafer head in a step of multiple steps. The steps may be equivalent, may provide polishes of different finish, or may be directed to polishing different levels. Alternately, more than one wafer may equivalently be polished at multiple polishing stations.
摘要翻译：一种用于抛光半导体晶片和其它工件的装置和相关方法，其包括位于多个抛光站处的抛光表面。多个晶片头，优选地至少比抛光站的数量多一个，可以加载单独的晶片。晶片头从可旋转的支撑件悬挂，其提供头部相对于抛光表面的周向定位，并且晶片头相对于抛光表面线性移动，从而在晶片和抛光台之间提供相对的线性运动。装载/卸载站可以位于与抛光表面对称的位置。可旋转支撑件可以将其中一个头部同时放置在装载/卸载台上，而其余的头部位于用于晶片抛光的抛光站之上，从而可以与晶片抛光同时进行晶片的加载和卸载。多个抛光站可以用于在多个步骤的步骤中顺序抛光保持在晶片头中的晶片。这些步骤可以是等效的，可以提供不同涂饰的抛光剂，或者可以指向抛光不同的水平。或者，可以在多个抛光站等效地抛光多于一个晶片。

6. 发明授权

US6135868A Groove cleaning device for chemical-mechanical polishing 失效
公开(公告)号：US6135868A
公开(公告)日：2000-10-24
申请号：US21765
申请日：1998-02-11
申请人： Brian J. Brown , Robert Tolles , James C. Nystrom , Doyle Bennett , Madhavi Chandrachood
发明人： Brian J. Brown , Robert Tolles , James C. Nystrom , Doyle Bennett , Madhavi Chandrachood
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , H01L21/304 , B24B21/18
CPC分类号： B24B53/017 , B24B37/26
摘要： An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e.g., grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

7. 发明授权

US07950407B2 Apparatus for rapid filling of a processing volume 失效
标题翻译：用于快速填充处理量的装置
公开(公告)号：US07950407B2
公开(公告)日：2011-05-31
申请号：US11672254
申请日：2007-02-07
申请人： Victor Burton Mimken , Robert Tolles
发明人： Victor Burton Mimken , Robert Tolles
IPC分类号： B67D3/00
CPC分类号： H01L21/67173 , H01L21/67057 , H01L21/67751 , Y10T137/0396 , Y10T137/4259
摘要： A method and apparatus for supplying greater fluid flow and/or fluid volume from a fluid provided from a facility source to a substrate processing chamber is provided. The apparatus couples to an existing facility fluid source and accumulates the fluid, and the flow characteristics of the accumulated fluid are enhanced for delivery to the processing chamber. The apparatus includes a tank in fluid communication with the facility source and one or more processing chambers, and a valve disposed between the tank and the processing chambers adapted to receive a signal from a controller to facilitate filling or draining of the tank. The apparatus and method affects cost of ownership by altering the pressure and/or volume of the existing facility source without the need to alter the facility source.
摘要翻译：提供了一种用于从从设备源提供到衬底处理室的流体提供更大的流体流动和/或流体体积的方法和装置。该装置耦合到现有的设备流体源并且积聚流体，并且增强了累积流体的流动特性以便输送到处理室。该设备包括与设备源和一个或多个处理室流体连通的罐，以及设置在罐和处理室之间的阀，适于从控制器接收信号以便于罐的填充或排放。该设备和方法通过改变现有设施来源的压力和/或体积来影响所有权成本，而不需要改变设施来源。

8. 发明申请

US20070238399A1 CHEMICAL MECHANICAL POLISHING SYSTEM HAVING MULTIPLE POLISHING STATIONS AND PROVIDING RELATIVE LINEAR POLISHING MOTION 失效
标题翻译：具有多个抛光站和提供相对线性抛光运动的化学机械抛光系统
公开(公告)号：US20070238399A1
公开(公告)日：2007-10-11
申请号：US11759770
申请日：2007-06-07
申请人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
发明人： Robert Tolles , Norm Shendon , Sasson Somekh , Ilya Perlov , Eugene Gantvarg , Harry Lee
IPC分类号： B24B7/04 , B24B41/06 , B24B9/00 , B24B7/00
CPC分类号： H01L21/67057 , B08B1/007 , B24B27/0023 , B24B37/30 , B24B37/345 , B24B41/005 , B24B53/017 , B24B57/02 , H01L21/30625 , H01L21/67051
摘要： A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.
摘要翻译：一种化学机械抛光装置，包括台面，安装在桌面上的转印站，安装在桌面上的多个抛光站，多个洗涤站以及由可围绕一个轴。每个洗涤站位于第一抛光站和第二抛光站或转移站之间，并且传送站和多个抛光站围绕轴线以大致相等的角度间隔布置。

9. 发明申请

US20070068552A1 Ozonation for elimination of bacteria for wet processing systems 审中-公开
标题翻译：用于消除湿处理系统的细菌的臭氧化
公开(公告)号：US20070068552A1
公开(公告)日：2007-03-29
申请号：US11525532
申请日：2006-09-22
申请人： Bruce Willing , Daniel Forster , David Huo , Robert Tolles , Christopher Haynes , Steven Mear , David Paul , William Evans
发明人： Bruce Willing , Daniel Forster , David Huo , Robert Tolles , Christopher Haynes , Steven Mear , David Paul , William Evans
IPC分类号： B08B7/04 , B08B3/00 , B08B3/12
CPC分类号： B08B3/04 , B08B3/08 , B08B2203/005 , C02F1/78 , C02F9/005 , C02F2103/02 , C02F2201/782 , C11D11/0047 , G03F7/423 , H01L21/6704
摘要： In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.
摘要翻译：在第一方面，提供一种适于清洁半导体器件制造部件的装置。该装置包括适于（1）获得臭氧的臭氧模块; （2）将臭氧与流体混合以产生臭氧化流体; 和（3）将臭氧化流体输送到半导体器件制造部件以清洁半导体器件制造部件。提供了许多其他方面。

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