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    • 9. 发明申请
    • Wafer Carrier Drive Apparatus and Method for Operating the Same
    • 晶圆载体驱动装置及其操作方法
    • US20100230243A1
    • 2010-09-16
    • US12786868
    • 2010-05-25
    • Arnold KholodenkoAnwar HusainGeorge Khait
    • Arnold KholodenkoAnwar HusainGeorge Khait
    • H01L21/677B65G35/00B65G47/00
    • H01L21/67748H01L21/67706H01L21/67709
    • A drive rail includes a sealed interior cavity and an exterior drive surface that extends along a length of the drive rail. A first magnetic member is disposed within the interior cavity and adjacent to a surface of the interior cavity that is immediately opposite the exterior drive surface. A drive mechanism is disposed within the interior cavity and in connection with the first magnetic member, and is configured to move the first magnetic member within the interior cavity along the length of the drive rail, such that the first magnetic member remains immediately opposite the exterior drive surface. The first magnetic member is configured to magnetically couple through the exterior drive surface to a wafer carrier disposed adjacent to the exterior drive surface. Movement of the first magnetic member within the interior cavity along the drive rail causes corresponding movement of the wafer carrier along the exterior drive surface.
    • 驱动轨道包括密封的内部空腔和沿驱动轨道的长度延伸的外部驱动表面。 第一磁性构件设置在内部空腔内并且邻近内部空腔的与外部驱动表面相对的表面。 驱动机构设置在内部空腔内并与第一磁性构件连接,并且构造成沿着驱动轨道的长度移动内部空腔内的第一磁性构件,使得第一磁性构件保持与外部的立即相对 驱动面。 第一磁性构件被配置为通过外部驱动表面磁耦合到邻近外部驱动表面设置的晶片载体。 第一磁性构件沿着驱动轨道在内腔内的移动导致晶片载体沿着外部驱动表面的相应移动。