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1. 发明申请

US20180338387A1 HEAT SINK FOR OPTICAL TRANSCEIVER 审中-公开
公开(公告)号：US20180338387A1
公开(公告)日：2018-11-22
申请号：US15599272
申请日：2017-05-18
申请人： Arista Networks, Inc.
发明人： Youngbae Park , Jiayi Wu , Robert Wilcox , Richard Hibbs , XIn Xue
IPC分类号： H05K7/20 , H05K1/02 , G02B6/42
摘要： An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

2. 发明授权

US09972577B1 EMI absorber ring 有权
公开(公告)号：US09972577B1
公开(公告)日：2018-05-15
申请号：US15227838
申请日：2016-08-03
申请人： Arista Networks, Inc.
发明人： Duong Lu , Jiayi Wu , Robert Wilcox , Richard Hibbs , Paul Miller
IPC分类号： H01L23/10 , H01L23/552 , H01L23/498 , H01L21/48
CPC分类号： H01L23/552 , H01L21/4817 , H01L23/49816
摘要： An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

3. 发明授权

US10921536B2 Heat sink for optical transceiver 有权
公开(公告)号：US10921536B2
公开(公告)日：2021-02-16
申请号：US15599272
申请日：2017-05-18
申请人： Arista Networks, Inc.
发明人： Youngbae Park , Jiayi Wu , Robert Wilcox , Richard Hibbs , Xin Xue
IPC分类号： G02B6/42 , H05K7/20
摘要： An electronics module is provided. The electronics module includes a housing at least partially enclosing a first printed circuit board configured to couple the electronics module to a connector attached to a second printed circuit board. The electronics module includes a first heat sink disposed along a first surface of the housing and a second heat sink disposed along a second surface of the housing. One or more notches or apertures of the first printed circuit board are proximate to the connector thereby enabling an airflow through the second heat sink along the second surface of the housing to exhaust over a surface of the connector with an airflow through the first heat sink.

4. 发明授权

US10488608B2 Pluggable optical module with heat sink 有权
公开(公告)号：US10488608B2
公开(公告)日：2019-11-26
申请号：US16058081
申请日：2018-08-08
申请人： Arista Networks, Inc.
发明人： Robert Wilcox , Richard Hibbs , Warren Meggitt , Andreas Bechtolsheim , Jiayi Wu , Christophe Metivier
IPC分类号： H04B10/00 , G02B6/42 , H04B10/40
CPC分类号： G02B6/4269 , G02B6/4277 , G02B6/4278 , H04B10/40 , G02B6/4246
摘要： An optical module includes an optoelectronic transceiver. The optical modules includes a heat sink. The heat sink includes a heat radiating element aligned along a length of the heat sink. The heat sink radiates heat received from the optoelectronic transceiver. The optical modules includes a housing. The optoelectronic transceiver is encapsulated by the heat sink and the housing.

5. 发明申请

US20160146212A1 ELECTRICAL CONNECTION MECHANISM FOR REVERSIBLE FAN MODULE 有权
标题翻译：用于可逆风扇模块的电气连接机构
公开(公告)号：US20160146212A1
公开(公告)日：2016-05-26
申请号：US14682852
申请日：2015-04-09
申请人： Arista Networks, Inc.
发明人： David Cananzi , Jiayi Wu , Richard Hibbs , Robert Wilcox
IPC分类号： F04D27/00 , F04D25/06 , F04D25/08 , F04D19/00
CPC分类号： F04D27/00 , F04D19/002 , F04D19/005 , F04D25/06 , F04D25/0613 , F04D25/0693 , F04D25/08 , F04D25/166 , F04D29/601
摘要： A reversible fan module may include a first attachment member that may receive power from a controller when an orientation of the reversible fan module is a first orientation; a second attachment member that may receive power from the controller when the orientation of the reversible fan module is a second orientation; a first electrical connection, disposed between the first attachment member and the second attachment member, that may transmit power from the second attachment member to the first attachment member when the orientation of the reversible fan module is the second orientation; and a second electrical connection, disposed between the first attachment member and a fan unit, that may transmit power to the fan unit.
摘要翻译：可逆风扇模块可以包括第一附接构件，当可逆风扇模块的取向为第一取向时，可以从控制器接收电力; 第二附接构件，当所述可逆风扇模块的取向为第二取向时，所述第二附接构件可从所述控制器接收电力; 设置在所述第一附接构件和所述第二附接构件之间的第一电连接器，当所述可逆风扇模块的取向为所述第二取向时，所述第一电连接可将动力从所述第二附接构件传递到所述第一附接构件; 以及设置在第一附接构件和风扇单元之间的第二电连接，其可以向风扇单元传输电力。

6. 发明授权

US10424546B1 Electromagnetic interference absorber ring 有权
公开(公告)号：US10424546B1
公开(公告)日：2019-09-24
申请号：US15980068
申请日：2018-05-15
申请人： Arista Networks, Inc.
发明人： Duong Lu , Jiayi Wu , Robert Wilcox , Richard Hibbs , Paul Miller
IPC分类号： H01L23/10 , H01L23/552 , H01L21/48 , H01L23/498
摘要： An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.

7. 发明授权

US09920772B2 Reversible fan module 有权
公开(公告)号：US09920772B2
公开(公告)日：2018-03-20
申请号：US15250858
申请日：2016-08-29
申请人： Arista Networks, Inc.
发明人： Robert Wilcox , Richard Hibbs , Jiayi Wu
IPC分类号： H05K7/20 , F04D29/58 , H05K7/14 , F04D29/32 , F04D29/52 , F04D29/56 , H01L23/473
CPC分类号： F04D29/584 , F04D29/325 , F04D29/522 , F04D29/563 , H05K7/14 , H05K7/20145 , H05K7/2019
摘要： A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.

8. 发明授权

US09433124B2 Reversible fan module 有权
标题翻译：可逆风扇模块
公开(公告)号：US09433124B2
公开(公告)日：2016-08-30
申请号：US14549945
申请日：2014-11-21
申请人： Arista Networks, Inc.
发明人： Robert Wilcox , Richard Hibbs , Jiayi Wu
IPC分类号： H05K7/20 , H05K7/14 , H01L23/473
CPC分类号： F04D29/584 , F04D29/325 , F04D29/522 , F04D29/563 , H05K7/14 , H05K7/20145 , H05K7/2019
摘要： A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.
摘要翻译：系统可以包括产生气流的可逆风扇模块。可逆风扇模块可以包括设置在可逆风扇模块的表面上的一组附接构件，其将可逆风扇模块固定为第一取向或第二取向。该系统还可以包括底盘，该底盘包括分隔器，该分隔器将底盘的内部区域分成前隔室和后隔间，设置在分隔器上的窗口，其允许前隔室和后隔室之间的气流，第一在底盘中打开，将前隔间打开到第一外部区域，底盘中的第二开口将后隔间打开到第二外部区域，以及托架，其接收可逆风扇模块。

9. 发明申请

US20160150675A1 REVERSIBLE FAN MODULE 有权
公开(公告)号：US20160150675A1
公开(公告)日：2016-05-26
申请号：US14549945
申请日：2014-11-21
申请人： Arista Networks, Inc.
发明人： Robert Wilcox , Richard Hibbs , Jiayi Wu
IPC分类号： H05K7/20 , H05K7/14
CPC分类号： F04D29/584 , F04D29/325 , F04D29/522 , F04D29/563 , H05K7/14 , H05K7/20145 , H05K7/2019
摘要： A system may include a reversible fan module that creates an airflow. The reversible fan module may include a set of attachment members, disposed on a face of the reversible fan module, that secure the reversible fan module a first orientation or a second orientation. The system may further include a chassis that include a divider that divides an interior region of the chassis into a front compartment and a rear compartment, a window, disposed on the divider, that allows airflow between the front compartment and the rear compartment, a first opening in the chassis that opens the front compartment to a first external region, a second opening in the chassis that opens the rear compartment to a second external region, and a bay that receives the reversible fan module.

10. 发明授权

US10841246B2 Distributed core switching with orthogonal fabric card and line cards 有权
公开(公告)号：US10841246B2
公开(公告)日：2020-11-17
申请号：US15691599
申请日：2017-08-30
申请人： Arista Networks, Inc.
发明人： Andreas V. Bechtolsheim , Richard Hibbs , Jiayi Wu , Warren Meggitt , Robert Wilcox , Alex Rose
IPC分类号： G06F11/30 , H04L12/931
CPC分类号： H04L49/40
摘要： A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

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