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1. 发明申请

WO2019096426A1 SUBSTRATE PROCESS ARRANGEMENT AND METHOD FOR HOLDING A SUBSTRATE 审中-公开
公开(公告)号：WO2019096426A1
公开(公告)日：2019-05-23
申请号：PCT/EP2017/079800
申请日：2017-11-20
申请人： APPLIED MATERIALS, INC. , LAU, Simon , HELLMICH, Anke , HINTERSCHUSTER, Reiner
发明人： LAU, Simon , HELLMICH, Anke , HINTERSCHUSTER, Reiner
IPC分类号： H01J37/32 , C23C14/50 , C23C16/458 , H01L21/687
摘要： A substrate support (100) for supporting a substrate (101) having a front surface (102) to be processed and an opposing back surface (115) is described. The substrate support includes a support body and a dry adhesive assembly (240) attached to the support body, the dry adhesive assembly having one or more dry adhesive elements (121), wherein the one or more dry adhesive elements support the substrate at the back surface in at least a center region and an outer region.

2. 发明授权

EP3050073B1 METHOD FOR CONTROLLING A GAS SUPPLY TO A PROCESS CHAMBER, CONTROLLER FOR CONTROLLING A GAS SUPPLY TO A PROCESS CHAMBER, AND APPARATUS THEREOF 有权
公开(公告)号：EP3050073B1
公开(公告)日：2019-11-06
申请号：EP13766958.6
申请日：2013-09-24
申请人： Applied Materials, Inc.
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke , KOCH, Thomas , DEPPISCH, Thomas
IPC分类号： H01J37/32 , C23C16/455

3. 发明公开

EP3050073A1 METHOD FOR CONTROLLING A GAS SUPPLY AND CONTROLLER 有权
标题翻译：一种用于控制燃气供给和控制
公开(公告)号：EP3050073A1
公开(公告)日：2016-08-03
申请号：EP13766958.6
申请日：2013-09-24
申请人： Applied Materials, Inc.
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke , KOCH, Thomas , DEPPISCH, Thomas
IPC分类号： H01J37/32 , C23C16/455
CPC分类号： C23C14/0042 , C23C14/544 , H01J37/32449 , H01J37/32981 , H01J37/3299
摘要： A method for controlling a gas supply to a process chamber is provided. The method includes: measuring a gas parameter by each of two or more sensors provided in the process chamber; determining a combined gas parameter from the measured gas parameters; and controlling the gas supply to the process chamber based on the determined combined gas parameter.

4. 发明申请

WO2022194377A1 METHOD OF DEPOSITING MATERIAL ON A SUBSTRATE 审中-公开
公开(公告)号：WO2022194377A1
公开(公告)日：2022-09-22
申请号：PCT/EP2021/056964
申请日：2021-03-18
申请人： APPLIED MATERIALS, INC. , ZILBAUER, Thomas Werner , HELLMICH, Anke , BENDER, Marcus , CHOI, Soo Young , HINTERSCHUSTER, Reiner , MUNDORF, Christoph
发明人： ZILBAUER, Thomas Werner , HELLMICH, Anke , BENDER, Marcus , CHOI, Soo Young , HINTERSCHUSTER, Reiner , MUNDORF, Christoph
IPC分类号： C23C14/35 , C23C14/56 , C23C14/34 , H01J37/34
摘要： A method of depositing at least one material on a substrate is described. The method includes a first deposition including: sputtering from a first and a second rotary target through an aperture, the aperture being adjustable and having less than a first size. The first rotary target has a first magnet assembly providing a plasma confinement in a first direction facing the second rotary target. The second rotary target has a second magnet assembly providing a plasma confinement in a second direction facing the first rotary target. The first direction and the second direction deviate from being parallel to a substrate plane of the substrate by an angle of less than a first value. The method includes a second deposition on top of the first deposition. The second deposition includes: sputtering from the first and the second rotary target through the aperture, the aperture having at least a second size, the second size being larger than the first size. The first magnet assembly provides a plasma confinement in a third direction. The second magnet assembly provides a plasma confinement in a fourth direction. At least one of the third or the fourth direction deviate from being parallel to the substrate plane by an angle of at least a second value, the second value being larger than the first value.

5. 发明申请

WO2015176750A1 DEPOSITION APPARATUS FOR DEPOSITION OF A MATERIAL ON A SUBSTRATE AND METHOD FOR DEPOSITING A MATERIAL ON A SUBSTRATE 审中-公开
标题翻译：用于沉积基材上的材料的沉积装置和在基材上沉积材料的方法
公开(公告)号：WO2015176750A1
公开(公告)日：2015-11-26
申请号：PCT/EP2014/060359
申请日：2014-05-20
申请人： APPLIED MATERIALS, INC. , ZILBAUER, Thomas, Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans, Georg , BENDER, Marcus
发明人： ZILBAUER, Thomas, Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans, Georg , BENDER, Marcus
IPC分类号： C23C14/56 , C23C16/44 , C23C16/54
CPC分类号： C23C14/56 , C23C16/4412 , C23C16/54
摘要： A deposition apparatus (300) for deposition of a material on a substrate is provided. The deposition apparatus (300) includes a first processing chamber (310) and a second processing chamber (320); at least one first deposition source (311) in the first processing chamber (310) and at least one second deposition source (321) in the second processing chamber (320); and at least one first shield device (350). The at least one first shield device (350) is configured to be moveable at least between a first position and a second position, wherein the at least one first shield device (350) is configured to shield the at least one first deposition source (311) when the at least one first shield device (350) is in the first position. The at least one first shield device (350) is configured to be moveable at least between the first processing chamber (310) and the second processing chamber (320).
摘要翻译：提供了用于将材料沉积在基板上的沉积设备（300）。沉积设备（300）包括第一处理室（310）和第二处理室（320）; 第一处理室（310）中的至少一个第一沉积源（311）和第二处理室（320）中的至少一个第二沉积源（321）; 和至少一个第一屏蔽装置（350）。所述至少一个第一屏蔽装置（350）被配置为至少在第一位置和第二位置之间可移动，其中所述至少一个第一屏蔽装置（350）被配置为屏蔽所述至少一个第一沉积源），当所述至少一个第一屏蔽装置（350）处于所述第一位置时。所述至少一个第一屏蔽装置（350）被配置为至少在所述第一处理室（310）和所述第二处理室（320）之间可移动。

6. 发明申请

WO2011098538A1 METHOD FOR PRODUCING AN ITO LAYER AND SPUTTERING SYSTEM 审中-公开
标题翻译：生产ITO层和溅射系统的方法
公开(公告)号：WO2011098538A1
公开(公告)日：2011-08-18
申请号：PCT/EP2011/051991
申请日：2011-02-10
申请人： APPLIED MATERIALS, INC. , HELLMICH, Anke , SCHNAPPENBERGER, Frank , KREMPEL-HESSE, Joerg
发明人： HELLMICH, Anke , SCHNAPPENBERGER, Frank , KREMPEL-HESSE, Joerg
IPC分类号： C23C14/08 , C23C14/34 , C23C14/35
CPC分类号： C23C14/086 , C23C14/3407 , C23C14/3421 , C23C14/35 , H01J37/3405 , H01J37/342
摘要： The present disclosure relates to a method for producing an indium-tin-oxide layer, comprising: providing a substrate to be coated in a sputtering chamber; providing a rotatable non-bonded target around a backing tube for coating the substrate in the sputtering chamber; and sputtering the material from the target in an atmosphere containing an O 2 /H 2 mixture. Further, the present disclosure relates to a sputtering system comprising a sputtering chamber having at least one gas inlet and being adapted for at least one backing tube for a non-bonded rotatable target, a control device adapted to control the flow through the gas inlet, wherein the control device is adapted to control the at least one gas inlet such that a coating on a substrate using a sputtering process is performed in an atmosphere containing an O 2 /H 2 mixture in the sputtering chamber for forming an indium-tin-oxide layer.
摘要翻译：本公开内容涉及一种制造铟锡氧化物层的方法，包括：在溅射室中提供待涂覆的基板; 在背衬管周围提供可旋转的未粘合的靶，用于在溅射室中涂覆基底; 并在含有O 2 / H 2混合物的气氛中从靶上溅射材料。此外，本公开涉及一种溅射系统，其包括具有至少一个气体入口的溅射室，并且适用于至少一个用于非粘合的可旋转靶的背衬管，适于控制通过气体入口的流动的控制装置，其中所述控制装置适于控制所述至少一个气体入口，使得使用溅射工艺的衬底上的涂层在用于形成铟锡氧化物层的溅射室中的含有O 2 / H 2混合物的气氛中进行。

7. 发明申请

WO2016162071A1 CARRIER SYSTEM FOR SUBSTRATES TO BE PROCESSED 审中-公开
标题翻译：用于要处理的基板的载体系统
公开(公告)号：WO2016162071A1
公开(公告)日：2016-10-13
申请号：PCT/EP2015/057768
申请日：2015-04-09
申请人： APPLIED MATERIALS, INC. , DIEGUEZ-CAMPO, Jose, Manuel , JOST, Georg , KELLER, Stefan , HELLMICH, Anke , GEBELE, Thomas
发明人： DIEGUEZ-CAMPO, Jose, Manuel , JOST, Georg , KELLER, Stefan , HELLMICH, Anke , GEBELE, Thomas
IPC分类号： H01L21/687
CPC分类号： H01L21/68771 , H01L21/68785
摘要： A carrier system for a substrate to be processed is described. The carrier system includes a main carrier (100) comprising a sub-carrier coupling means (201) for coupling one or more sub-carriers (400; 800) to the main carrier (100). The main carrier (100) includes a sub- carrier supporting portion (120) having the shape of a grid with crossing grid bars (121), wherein the sub-carrier coupling means (201) are provided at the grid bars (121). The carrier system further includes a sub-carrier (400; 800) for supporting one or more substrates (500) to be processed, wherein the sub-carrier (400; 800) includes one or more openings (422). The sub-carrier (400; 800) further includes substrate coupling means (430; 431) for coupling the substrates (500), wherein the substrate coupling means (430; 431) is configured to hold the substrate (500) in a position overlapping partially with the openings (422) of the sub-carrier (400; 800).
摘要翻译：描述用于待处理衬底的载体系统。载体系统包括主载体（100），其包括用于将一个或多个副载体（400; 800）耦合到主载体（100）的副载体耦合装置（201）。主载体（100）包括具有交叉网格条（121）的网格形状的副载体支撑部分（120），其中副载体联接装置（201）设置在网格杆（121）处。载体系统还包括用于支撑待加工的一个或多个基底（500）的副载体（400; 800），其中副载体（400; 800）包括一个或多个开口（422）。子载体（400; 800）还包括用于联接衬底（500）的衬底耦合装置（430; 431），其中衬底耦合装置（430; 431）构造成将衬底（500）保持在重叠的位置部分地具有副载体（400; 800）的开口（422）。

8. 发明申请

WO2015176751A1 DEPOSITION APPARATUS FOR DEPOSITION OF A MATERIAL ON A SUBSTRATE AND METHOD FOR DEPOSITING A MATERIAL ON A SUBSTRATE 审中-公开
标题翻译：用于沉积基材上的材料的沉积装置和在基材上沉积材料的方法
公开(公告)号：WO2015176751A1
公开(公告)日：2015-11-26
申请号：PCT/EP2014/060360
申请日：2014-05-20
申请人： APPLIED MATERIALS, INC , ZILBAUER, Thomas Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans Georg , BENDER, Marcus
发明人： ZILBAUER, Thomas Werner , HELLMICH, Anke , HINTERSCHUSTER, Reiner , MÜHLFELD, Uwe , STOCK, Bernhard , WOLF, Hans Georg , BENDER, Marcus
IPC分类号： C23C14/56 , C23C14/34
CPC分类号： C23C14/568 , C23C14/3464 , C23C14/562
摘要： A deposition apparatus (300) for deposition of a material on a substrate is provided. The deposition apparatus (300) includes two or more processing chambers including a first processing chamber (310) and a second processing chamber (320); a substrate support (330) extending at least through the first processing chamber (310) and the second processing chamber (320); and two or more deposition source assemblies including a first deposition source assembly (350) in the first processing chamber (310) and a second deposition source assembly (360) in the second processing chamber (320). Each of the two or more deposition source assemblies includes at least one deposition source support (351, 361) configured to support at least one first deposition source and at least one process device. The at least one deposition source support (351, 361) is configured to be moveable at least between a first position and a second position. In the first position, the at least one first deposition source is oriented towards the substrate support (330), and, in the second position, the at least one process device is oriented towards the substrate support (330).
摘要翻译：提供了用于将材料沉积在基板上的沉积设备（300）。沉积装置（300）包括两个或多个处理室，包括第一处理室（310）和第二处理室（320）。至少延伸穿过第一处理室（310）和第二处理室（320）的衬底支撑件（330）; 以及包括第一处理室（310）中的第一沉积源组件（350）和第二处理室（320）中的第二沉积源组件（360）的两个或更多个沉积源组件。两个或更多个沉积源组件中的每一个包括被配置为支撑至少一个第一沉积源和至少一个处理装置的至少一个沉积源支撑件（351,361）。至少一个沉积源支撑件（351,361）构造成至少在第一位置和第二位置之间是可移动的。在第一位置，至少一个第一沉积源朝向衬底支撑件（330）定向，并且在第二位置，至少一个处理装置朝向衬底支撑件（330）取向。

9. 发明申请

WO2015090373A1 ELECTRODE ASSEMBLY FOR DEPOSITION APPARATUS AND METHOD FOR ASSEMBLING SAID ELECTRODE ASSEMBLY 审中-公开
标题翻译：用于沉积电极的电极组件和组装电极组件的方法
公开(公告)号：WO2015090373A1
公开(公告)日：2015-06-25
申请号：PCT/EP2013/076984
申请日：2013-12-17
申请人： APPLIED MATERIALS, INC. , HELLMICH, Anke , SCHNAPPENBERGER, Frank , LOPP, Andreas , GEBELE, Thomas
发明人： HELLMICH, Anke , SCHNAPPENBERGER, Frank , LOPP, Andreas , GEBELE, Thomas
IPC分类号： H01J37/34
CPC分类号： H01J37/342 , H01J37/3405 , H01J37/3435 , H01J37/3452 , H01J37/3455 , H01J37/3461
摘要： An electrode assembly (120; 200; 300; 400; 700; 800; 900) for a sputter deposition apparatus is provided. The electrode assembly includes an assembly element (210; 310; 410; 710; 810; 910) for at least one of providing material to be deposited and holding a rotatable target; a magnet system (230; 330; 430; 730; 830; 930) disposed inside the assembly element (210; 310; 410; 710; 810; 910); and a pole piece (240; 241; 242; 340; 341; 342; 440; 441; 442; 740; 741; 742; 840; 841; 842; 940; 941; 942) for being disposed between the magnet system and the assembly element. Further, a method for assembling an electrode assembly with a magnet system (230; 330; 430; 730; 830; 930) is described.
摘要翻译：提供了一种用于溅射沉积设备的电极组件（120; 200; 300; 400; 700; 800; 900）。电极组件包括用于至少一个提供要沉积的材料并保持可旋转靶的组件元件（210; 310; 410; 710; 810; 910）设置在所述组件元件（210; 310; 410; 710; 810; 910）内的磁体系统（230; 330; 430; 730; 830; 930）和磁极件（240; 241; 242; 340; 341; 342; 440; 441; 442; 740; 741; 742; 840; 841; 842; 940; 941; 942）装配元件此外，描述了一种用于组装具有磁体系统（230; 330; 430; 730; 830; 930）的电极组件的方法。

10. 发明申请

WO2011006801A1 TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM 审中-公开
标题翻译：目标后支管，圆柱形目标组件和喷射系统
公开(公告)号：WO2011006801A1
公开(公告)日：2011-01-20
申请号：PCT/EP2010/059658
申请日：2010-07-06
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
IPC分类号： H01J37/34
CPC分类号： H01J37/3405 , H01J37/3435 , H01J37/3497
摘要： The present application concerns a target backing tube (122) for a rotatable cylindrical target assembly (120) comprising: a tube (122) for at least one target element (126) to be disposed there around, wherein the tube has an exterior surface adapted to be directed to the at least one target element; and a thermal reflection cover (128) covering a portion of at least 20% of the exterior surface of the tube. Further, the present application concerns a rotatable cylindrical target assembly comprising: said target backing tube and at least one target element disposed around the target backing tube, wherein the thermal reflection cover disposed between the target backing tube and the at least one target element.
摘要翻译：本申请涉及一种用于可旋转的圆柱形目标组件（120）的目标支撑管（122），包括：用于至少一个待设置在其周围的目标元件（126）的管（122），其中管具有适于指向至少一个目标元件; 以及覆盖管的外表面的至少20％的一部分的热反射罩（128）。此外，本申请涉及一种可旋转圆柱形目标组件，其包括：所述目标背衬管和围绕目标背衬管设置的至少一个目标元件，其中设置在目标背衬管和至少一个目标元件之间的热反射盖。

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