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1. 发明申请

US20030108674A1 Cyclical deposition of refractory metal silicon nitride 有权
$Cyclical deposition of refractory metal silicon nitride$
标题翻译：难熔金属氮化硅的循环沉积
公开(公告)号：US20030108674A1
公开(公告)日：2003-06-12
申请号：US10199419
申请日：2002-07-18
申请人： Applied Materials, Inc.
发明人： Hua Chung , Ling Chen , Barry L. Chin
IPC分类号： C23C016/34
CPC分类号： C23C16/45531 , C23C16/34 , H01L21/28562 , H01L21/76843
摘要： Embodiments of the invention relate to an apparatus and method of cyclical layer deposition utilizing three or more precursors. In one embodiment, the method includes providing at least one cycle of precursors to form a ternary material layer. Providing at least one cycle of precursors includes introducing a pulse of a first precursor, introducing a pulse of a second precursor, and introducing a pulse of a third precursor, wherein the pulses of two of the three precursors are introduced simultaneously or sequentially. In anoher embodiment, the method includes introducing a pulse of a first precursor, introducing a pulse of a second precursor, repeating the introduction of the first and the second precursors at least one time to form a binary material layer on the substrate surface, and introducing a pulse of a third precursor to form the ternary material layer.
摘要翻译：本发明的实施例涉及利用三种或更多种前体的循环层沉积的装置和方法。在一个实施方案中，该方法包括提供至少一个循环的前体以形成三元材料层。提供至少一个前体循环包括引入第一前体的脉冲，引入第二前体的脉冲，以及引入第三前体的脉冲，其中三个前体中的两个的脉冲同时或顺序地引入。在另一实施例中，该方法包括引入第一前体的脉冲，引入第二前体的脉冲，至少一次重复引入第一和第二前体，以在衬底表面上形成二元材料层，并引入形成三元材料层的第三前体的脉冲。

2. 发明申请

US20030082301A1 Enhanced copper growth with ultrathin barrier layer for high performance interconnects 审中-公开
标题翻译：增强铜生长与超薄屏障层的高性能互连
公开(公告)号：US20030082301A1
公开(公告)日：2003-05-01
申请号：US10199415
申请日：2002-07-18
申请人： Applied Materials, Inc.
发明人： Ling Chen , Hua Chung , Barry L. Chin , Hong Zhang
IPC分类号： C23C016/00 , B05D001/36
CPC分类号： H01L21/28562 , C23C16/34 , C23C16/4411 , C23C16/4412 , C23C16/45504 , C23C16/45508 , C23C16/45512 , C23C16/45525 , C23C16/45544 , C23C16/45563 , C23C16/45582 , H01L21/76843 , H01L21/76846 , H01L21/76871
摘要： A method for depositing a refractory metal nitride barrier layer having a thickness of about 20 angstroms or less is provided. In one aspect, the refractory metal nitride layer is formed by introducing a pulse of a metal-containing compound followed by a pulse of a nitrogen-containing compound. The refractory metal nitride barrier layer provides adequate barrier properties and allows the grain growth of the first metal layer to continue across the barrier layer into the second metal layer thereby enhancing the electrical performance of the interconnect.
摘要翻译：提供了一种沉积具有约20埃或更小厚度的难熔金属氮化物阻挡层的方法。一方面，难熔金属氮化物层是通过引入含金属化合物的脉冲，随后是含氮化合物的脉冲而形成的。难熔金属氮化物阻挡层提供了足够的阻挡性能，并且允许第一金属层的晶粒生长继续穿过阻挡层进入第二金属层，从而增强了互连的电性能。

3. 发明申请

US20030023338A1 Atomic layer deposition apparatus 失效
标题翻译：原子层沉积装置
公开(公告)号：US20030023338A1
公开(公告)日：2003-01-30
申请号：US09917842
申请日：2001-07-27
申请人： Applied Materials, Inc.
发明人： Barry L. Chin , Alfred W. Mak , Lawrence Chung-Lai Lei , Ming Xi , Hua Chung , Ken Kaung Lai , Jeong Soo Byun
IPC分类号： G06F019/00
CPC分类号： C23C16/45544 , C23C16/45525 , C23C16/45548 , C23C16/45551 , C23C16/4583
摘要： A method and apparatus for atomic layer deposition (ALD) is described. The apparatus comprises a deposition chamber and a wafer support. The deposition chamber is divided into two or more deposition regions that are integrally connected one to another. The wafer support is movable between the two or more interconnected deposition regions within the deposition chamber.
摘要翻译：描述了用于原子层沉积（ALD）的方法和装置。该装置包括沉积室和晶片支架。沉积室被分成两个或更多个彼此一体地连接的沉积区域。晶片支撑件可在沉积室内的两个或更多互连的沉积区域之间移动。

4. 发明申请

US20020029958A1 Damage-free sculptured coating deposition 有权
标题翻译：无损伤雕刻涂层沉积
公开(公告)号：US20020029958A1
公开(公告)日：2002-03-14
申请号：US09886439
申请日：2001-06-20
申请人： Applied Materials, Inc.
发明人： Tony Chiang , Gongda Yao , Peijun Ding , Fusen E. Chen , Barry L. Chin , Gene Y. Kohara , Zheng Xu , Hong Zhang
IPC分类号： C23C014/00 , C23C014/32
CPC分类号： H01L21/76843 , C23C14/046 , C23C14/165 , H01L21/2855 , H01L21/76805 , H01L21/76844 , H01L21/76846 , H01L21/76862 , H01L21/76865 , H01L21/76871 , H01L21/76877 , H01L21/76879 , H01L21/76883
摘要： We disclose a method of applying a sculptured layer of material on a semiconductor feature surface using ion deposition sputtering, wherein a surface onto which the sculptured layer is applied is protected to resist erosion and contamination by impacting ions of a depositing layer, said method comprising the steps of: a) applying a first portion of a sculptured layer with sufficiently low substrate bias that a surface onto which said sculptured layer is applied is not eroded away or contaminated in an amount which is harmful to said semiconductor device performance or longevity; and b) applying a subsequent portion of said sculptured layer with sufficiently high substrate bias to sculpture a shape from said the first portion, while depositing additional layer material. The method is particularly applicable to the sculpturing of barrier layers, wetting layers, and conductive layers upon semiconductor feature surfaces and is especially helpful when the conductive layer is copper. In the application of a barrier layer, a first portion of barrier layer material is deposited on the substrate surface using standard sputtering techniques or using an ion deposition plasma, but in combination with sufficiently low substrate bias voltage (including at no applied substrate voltage) that the surfaces impacted by ions are not sputtered in an amount which is harmful to device performance or longevity. Subsequently, a second portion of barrier material is applied using ion deposition sputtering at increased substrate bias voltage which causes resputtering (sculpturing) of the first portion of barrier layer material, while enabling a more anisotropic deposition of newly depositing material. A conductive material, and particularly a copper seed layer applied to the feature may be accomplished using the same sculpturing technique as that described above with reference to the barrier layer.
摘要翻译：我们公开了使用离子沉积溅射在半导体特征表面上施加雕刻层的材料的方法，其中施加有雕刻层的表面被保护以通过冲击沉积层的离子来抵抗侵蚀和污染，所述方法包括步骤：a）以足够低的衬底偏压施加雕刻层的第一部分，使得施加所述雕刻层的表面不会以对所述半导体器件的性能或寿命有害的量被侵蚀或污染; 以及b）将所述雕刻层的后续部分施加足够高的衬底偏压，以从所述第一部分雕刻形状，同时沉积附加层材料。该方法特别适用于在半导体特征表面上雕刻阻挡层，润湿层和导电层，并且当导电层是铜时尤其有用。在施加阻挡层时，使用标准溅射技术或使用离子沉积等离子体将阻挡层材料的第一部分沉积在衬底表面上，但是与足够低的衬底偏置电压（包括没有施加的衬底电压）组合，受离子影响的表面不会以对器件性能或寿命有害的量溅射。随后，使用离子沉积溅射在增加的衬底偏置电压下施加阻挡材料的第二部分，这导致阻挡层材料的第一部分的再溅射（雕刻），同时能够进行更多的各向异性沉积新沉积的材料。应用于特征的导电材料，特别是铜种子层可以使用与上述参考阻挡层所述相同的雕刻技术来实现。

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