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1. 外观设计

USD901510S1 Backplate for an electronic device 有权
公开(公告)号：USD901510S1
公开(公告)日：2020-11-10
申请号：US29701142
申请日：2019-08-08
申请人： Apple Inc.
设计人： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
摘要： FIG. 1 is a top front perspective view of a backplate for an electronic device showing the claimed design;
FIG. 2 is a bottom rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.

2. 发明申请

US20200337184A1 SUPPORT PLATE THIN CLADDING 审中-公开
公开(公告)号：US20200337184A1
公开(公告)日：2020-10-22
申请号：US16708159
申请日：2019-12-09
申请人： Apple Inc.
发明人： Robert F. Meyer , William A. Counts , Michael D. Quinones , Jason P. Shannon , David A. Pakula
IPC分类号： H05K7/20 , F28F21/02 , F28F21/08
摘要： An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

3. 外观设计

USD895628S1 Housing module for an electronic device 有权
公开(公告)号：USD895628S1
公开(公告)日：2020-09-08
申请号：US29691815
申请日：2019-05-20
申请人： Apple Inc.
设计人： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
摘要： FIG. 1 is a bottom front perspective view of a housing module for an electronic device showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.
The oblique shade lines in the figures show transparency or translucency.

4. 外观设计

USD895626S1 Housing module for an electronic device 有权
公开(公告)号：USD895626S1
公开(公告)日：2020-09-08
申请号：US29686166
申请日：2019-04-02
申请人： Apple Inc.
设计人： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Markus Diebel , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Richard H. Koch , Robert F. Meyer , Michael D. Quinones , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Sung-Ho Tan , Christopher S. Tomasetta , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
摘要： FIG. 1 is a bottom front perspective view of a housing module for an electronic device showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.

5. 发明授权

US09872094B2 Speaker coupling and bracket 有权
公开(公告)号：US09872094B2
公开(公告)日：2018-01-16
申请号：US14975508
申请日：2015-12-18
申请人： Apple Inc.
发明人： Robert F. Meyer , Daniel W. Jarvis , Richard Hung Minh Dinh , Stoyan Hristov
IPC分类号： H04R1/02
CPC分类号： H04R1/023 , H04R2499/11
摘要： This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.

6. 发明申请

US20170070795A1 SPEAKER COUPLING AND BRACKET 有权
标题翻译：扬声器联轴器和支架
公开(公告)号：US20170070795A1
公开(公告)日：2017-03-09
申请号：US14975508
申请日：2015-12-18
申请人： Apple Inc.
发明人： Robert F. Meyer , Daniel W. Jarvis , Richard Hung Minh Dinh , Stoyan Hristov
IPC分类号： H04R1/02 , H04R1/04 , H04R1/34
CPC分类号： H04R1/023 , H04R2499/11
摘要： This application relates to an audio assembly that includes both a speaker assembly and a microphone. By mounting both the microphone and the speaker assembly to a unitary audio bracket, space savings can be achieved over a configuration that relies on separate brackets for each component. In some embodiments, an acoustic mesh can be embedded within the audio bracket and extending across an audio channel defined by the audio bracket. The microphone can be aligned with an opening in the audio bracket by an alignment clip that is coupled with the microphone. The alignment clip helps to achieve alignment of a sensor opening of the microphone with a channel defined by the audio bracket.
摘要翻译：本申请涉及包括扬声器组件和麦克风的音频组件。通过将麦克风和扬声器组件安装到单一音频支架，可以通过依赖于每个组件的单独支架的配置实现空间节省。在一些实施例中，声学网格可嵌入在音频支架内并且延伸穿过由音频支架限定的音频通道。麦克风可以通过与麦克风耦合的对准夹与音频支架中的开口对齐。对准夹有助于实现麦克风的传感器开口与由音频支架定义的通道的对准。

7. 发明授权

US12088748B2 Handheld electronic device 有权
公开(公告)号：US12088748B2
公开(公告)日：2024-09-10
申请号：US17471789
申请日：2021-09-10
申请人： Apple Inc.
发明人： Xuyang Zhang , Jason P. Shannon , Jon F. Housour , Robert F. Meyer , Owen D. Hale , Dale T. Morgan , Daniel Jarvis , Nicholas Merz , Benjamin Morse , Rasamy Phouthavong , Michael B. Wittenberg , David A. Pakula , Simon C. Helmore , Gareth L. Rose , Marwan Rammah , Melissa A. Wah , Jacob Barton , Ian A. Spraggs
IPC分类号： H04M1/02 , H04N23/51 , H04N23/57
CPC分类号： H04M1/0264 , H04M1/0262 , H04N23/51 , H04N23/57
摘要： A portable electronic device includes a housing, a sensor array including a first camera module having a first field of view, a second camera module having a second field of view different from the first field of view, and a light source, and a rear cover formed from a glass material and defining a raised sensor array region positioned over the sensor array. The raised sensor array region defines a first hole extending through the rear cover and positioned proximate a first corner region of the raised sensor array region, and a second hole extending through the rear cover and positioned proximate a second corner region diagonal from the first corner region. The first camera module includes a first camera housing defining a recess at a corner of the first camera housing, and the second camera module includes a second camera housing extending into the recess.

8. 发明授权

US11898808B2 Support plate thin cladding 有权
公开(公告)号：US11898808B2
公开(公告)日：2024-02-13
申请号：US16708159
申请日：2019-12-09
申请人： Apple Inc.
发明人： Robert F. Meyer , William A. Counts , Michael D. Quinones , Jason P. Shannon , David A. Pakula
IPC分类号： B29D22/00 , F28F21/02 , F28F21/08 , H05K7/20
CPC分类号： F28F21/02 , F28F21/081 , F28F21/085 , H05K7/20436 , H05K7/20472 , H05K7/20481 , H05K7/20509
摘要： An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.

9. 发明公开

US20230421676A1 HANDHELD ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20230421676A1
公开(公告)日：2023-12-28
申请号：US18243426
申请日：2023-09-07
申请人： Apple Inc.
发明人： Jon F. Housour , Macey E. Dade , Benjamin R. Gray , Reema Shalan , Daniel W. Jarvis , Jason P. Shannon , Marwan Rammah , Robert F. Meyer , Richard H. Koch , Anthony B. Sinclair , Gareth L. Rose
IPC分类号： H04M1/02
CPC分类号： H04M1/0266 , H04M1/0283 , H04M1/0264 , H04M1/0262 , H04M2207/18
摘要： A mobile phone may include an enclosure including a front cover assembly defining a front exterior surface of the enclosure, a rear cover assembly defining a rear exterior surface of the enclosure, and a housing subassembly positioned between the front cover assembly and the rear cover assembly. The housing subassembly may include a first housing component defining a first side exterior surface of the enclosure, a second housing component defining a second side exterior surface of the enclosure opposite the first side exterior surface of the enclosure, and a lower chassis section extending between the first housing component and the second housing component. The mobile phone may further include a camera array coupled to the lower chassis section and positioned in an interior cavity defined between the lower chassis section and the front cover assembly.

10. 外观设计

USD848999S1 Housing module for an electronic device 有权
公开(公告)号：USD848999S1
公开(公告)日：2019-05-21
申请号：US29612835
申请日：2017-08-04
申请人： Apple Inc.
设计人： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
摘要： FIG. 1 is a bottom front perspective view of a housing module for an electronic device showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.
The oblique shade lines in the figures show transparency or translucency.

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