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1. 发明申请

US20110284505A1 APPARATUS AND METHOD FOR TEMPERATURE CONTROL OF A SEMICONDUCTOR SUBSTRATE SUPPORT 有权
标题翻译：半导体基板支持温度控制的装置和方法
公开(公告)号：US20110284505A1
公开(公告)日：2011-11-24
申请号：US12785774
申请日：2010-05-24
申请人： Anthony Ricci , Saurabh Ullal , Michael Kang , Matthew Busche
发明人： Anthony Ricci , Saurabh Ullal , Michael Kang , Matthew Busche
IPC分类号： B23K37/00
CPC分类号： H01L21/67248 , H01J37/32715 , H01J37/32724 , H01L21/67109
摘要： A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T2 in fluid communication with the supply line and the return line, temperature T2 being at least 10° C. above temperature T1; a pre-cooling unit providing liquid at temperature Tpc connected to the inlet and the outlet, temperature Tpc being at least 10° C. below T1; a pre-heating unit providing liquid at temperature Tph connected to the inlet and the outlet, temperature Tph being at least 10° C. above T2; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.
摘要翻译：一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与供应管线和回流管线流体连通的温度T1下提供液体; 第二再循环器在温度T2下提供与供应管线和返回管线流体连通的液体，温度T2在温度T1以上至少10℃; 预冷单元，其在连接到入口和出口的温度Tpc处提供液体，温度Tpc在T1以下至少10℃; 预热单元，其在连接到入口和出口的温度Tph下提供液体，温度Tph在T2以上至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

2. 发明授权

US08410393B2 Apparatus and method for temperature control of a semiconductor substrate support 有权
标题翻译：用于半导体衬底支撑件的温度控制的装置和方法
公开(公告)号：US08410393B2
公开(公告)日：2013-04-02
申请号：US12785774
申请日：2010-05-24
申请人： Anthony Ricci , Saurabh Ullal , Michael Kang , Matthew Busche
发明人： Anthony Ricci , Saurabh Ullal , Michael Kang , Matthew Busche
IPC分类号： B23K37/00
CPC分类号： H01L21/67248 , H01J37/32715 , H01J37/32724 , H01L21/67109
摘要： A recirculation system of a substrate support on which a semiconductor substrate is subjected to a multistep process in a vacuum chamber, the system comprising a substrate support having at least one liquid flow passage in a base plate thereof, an inlet and an outlet in fluid communication with the flow passage, a supply line in fluid communication with the inlet, and a return line in fluid communication with the outlet; a first recirculator providing liquid at temperature T1 in fluid communication with the supply line and the return line; a second recirculator providing liquid at temperature T2 in fluid communication with the supply line and the return line, temperature T2 being at least 10° C. above temperature T1; a pre-cooling unit providing liquid at temperature Tpc connected to the inlet and the outlet, temperature Tpc being at least 10° C. below T1; a pre-heating unit providing liquid at temperature Tph connected to the inlet and the outlet, temperature Tph being at least 10° C. above T2; a controller operable to selectively operate valves of the recirculation system to recirculate liquid between the flow passage and the first recirculator, the second recirculator, the pre-cooling unit or the pre-heating unit.
摘要翻译：一种衬底支撑件的再循环系统，半导体衬底在其上在真空室中进行多步骤处理，所述系统包括衬底支撑件，所述衬底支撑件在其底板中具有至少一个液体流动通道，流体连通的入口和出口与流路连通，与入口流体连通的供应管线和与出口流体连通的回流管线; 第一再循环器，其在与供应管线和回流管线流体连通的温度T1下提供液体; 第二再循环器在温度T2下提供与供应管线和返回管线流体连通的液体，温度T2在温度T1以上至少10℃; 预冷单元，其在连接到入口和出口的温度Tpc处提供液体，温度Tpc在T1以下至少10℃; 预热单元，其在连接到入口和出口的温度Tph下提供液体，温度Tph在T2以上至少10℃; 控制器，其可操作以选择性地操作所述再循环系统的阀，以在所述流动通道和所述第一再循环器，所述第二再循环器，所述预冷单元或所述预热单元之间再循环液体。

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