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1. 发明授权

US5926369A Vertically integrated multi-chip circuit package with heat-sink support 失效
标题翻译：垂直集成多芯片电路封装，散热器支持
公开(公告)号：US5926369A
公开(公告)日：1999-07-20
申请号：US9862
申请日：1998-01-22
申请人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
发明人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
IPC分类号： H01L23/367 , H01L25/065 , H05K7/20
CPC分类号： H01L25/065 , H01L23/367 , H05K7/2049 , H01L2224/14181 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311
摘要： A multi-chip carrier which uses less lateral mounting space on the surface of a circuit board or card can be formed using flexible circuitized material. Lateral space is compressed by utilizing more vertical space to package chips and components. The problem of cooling multiple chips in a tight space may be accomplished by integrating the heat sink in with the circuit carrier and having the heat sink double as a support structure. A flex material is folded or shaped. Different regions of the flex are used for mounting chips, mounting support mechanisms, or mounting the structure on a carrier or substrate.
摘要翻译：可以使用柔性电路化材料形成在电路板或卡表面上使用较少横向安装空间的多芯片载体。通过利用更多的垂直空间来封装芯片和部件来压缩横向空间。在紧密空间中冷却多个芯片的问题可以通过将散热器与电路载体集成并且具有作为支撑结构的双重散热器来实现。柔性材料折叠或成形。柔性的不同区域用于安装芯片，安装支撑机构或将结构安装在载体或基板上。

2. 发明授权

US6075287A Integrated, multi-chip, thermally conductive packaging device and methodology 失效
标题翻译：集成的多芯片导热包装装置和方法
公开(公告)号：US6075287A
公开(公告)日：2000-06-13
申请号：US826572
申请日：1997-04-03
申请人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
发明人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
IPC分类号： H01L23/373 , H01L23/498 , H01L23/538 , H01L23/58 , H01L25/065 , H01L23/02
CPC分类号： H01L25/0657 , H01L23/3733 , H01L23/49805 , H01L23/5384 , H01L23/585 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/73253 , H01L2225/06517 , H01L2225/0652 , H01L2225/06541 , H01L2225/06551 , H01L2225/06589
摘要： Electrically conductive lamina are attached by an electrically insulating, thermally conductive adhesive and/or solder to one or more semiconductor devices such as chips and extend beyond the periphery of the chip or chips to form heat sink fins. Electrical connections may be made between such chips through holes (e.g. by a wire or plated through hole) in the electrically conductive lamina lined with an insulating material such as the electrically insulating adhesive to provide a structurally robust assembly. Surface pads and connections may overlie patterns of insulator on the lamina. A further lamina can be wrapped around lateral sides of the assembly to provide further heat sink area and mechanical protection for other heat sink fins. A graphite/carbon fiber composite matrix material is preferred for the lamina and the coefficient of thermal expansion of such materials may be matched to that of the semiconductor material attached thereto. Conductivity of the lamina also provides shielding against electrical noise to improve the noise immunity of short connections between chips made through the lamina as well as that of surface connections which may be formed on the lamina.
摘要翻译：导电层通过电绝缘的导热粘合剂和/或焊料附着到一个或多个半导体器件如芯片上并延伸超过芯片或芯片的周边以形成散热片。电连接可以在这样的芯片之间通过衬有绝缘材料（例如电绝缘粘合剂）的导电层中的孔（例如通过导线或电镀通孔）形成，以提供结构上坚固的组件。表面焊盘和连接可能覆盖层的绝缘体图案。另外的层可以围绕组件的侧面缠绕以提供进一步的散热器区域和用于其它散热片的机械保护。对于层板优选石墨/碳纤维复合材料基体材料，并且这种材料的热膨胀系数可以与附着于其上的半导体材料的热膨胀系数匹配。薄层的电导率还提供了防止电噪声的屏蔽，以提高通过薄片制成的芯片之间的短连接的抗噪声能力以及可能形成在薄片上的表面连接。

3. 发明授权

US06256203B1 Free standing, three dimensional, multi-chip, carrier package with air flow baffle 失效
标题翻译：独立式，三维，多芯片，载体封装带气流挡板
公开(公告)号：US06256203B1
公开(公告)日：2001-07-03
申请号：US09437441
申请日：1999-11-10
申请人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
发明人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
IPC分类号： H05K720
CPC分类号： H01L25/065 , H01L23/467 , H01L23/5385 , H01L25/0657 , H01L2225/06575 , H01L2225/06579 , H01L2225/06589 , H01L2924/0002 , H05K1/189 , H01L2924/00
摘要： An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
摘要翻译：可以在节省板表面积的同时提供多芯片载体的有效的冷却机构。柔性电路化材料用于形成具有空气挡板能力的多芯片载体。弯曲物被折叠或弯曲成所需的形状并且用支撑结构保持就位。芯片的绑定位置位于通过运营商的地区。提供空气挡板功能的形状包括线圈，弹簧状线圈和蛇纹。

4. 发明授权

US6061245A Free standing, three dimensional, multi-chip, carrier package with air flow baffle 失效
标题翻译：独立式，三维，多芯片，载体封装带气流挡板
公开(公告)号：US6061245A
公开(公告)日：2000-05-09
申请号：US10667
申请日：1998-01-22
申请人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
发明人： Anthony P. Ingraham , Glenn L. Kehley , Sanjeev B. Sathe , John R. Slack
IPC分类号： H01L23/467 , H01L23/538 , H01L25/065 , H05K1/18 , H05K1/11 , H05K1/14
CPC分类号： H01L25/065 , H01L23/467 , H01L23/5385 , H01L25/0657 , H05K1/189 , H01L2225/06575 , H01L2225/06579 , H01L2225/06589 , H01L2924/0002
摘要： An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
摘要翻译：可以在节省板表面积的同时提供多芯片载体的有效的冷却机构。柔性电路化材料用于形成具有空气挡板能力的多芯片载体。弯曲物被折叠或弯曲成所需的形状并且用支撑结构保持就位。芯片的绑定位置位于通过运营商的地区。提供空气挡板功能的形状包括线圈，弹簧状线圈和蛇纹。

5. 发明授权

US07183642B2 Electronic package with thermally-enhanced lid 有权
标题翻译：带增强盖的电子封装
公开(公告)号：US07183642B2
公开(公告)日：2007-02-27
申请号：US10241994
申请日：2002-09-11
申请人： Anandaroop Bhattacharya , Varaprasad V. Calmidi , Sanjeev B. Sathe
发明人： Anandaroop Bhattacharya , Varaprasad V. Calmidi , Sanjeev B. Sathe
IPC分类号： H01L23/36 , H01L23/34 , H01L31/024
CPC分类号： H01L23/42 , H01L21/563 , H01L23/3128 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/0401
摘要： Removing heat generated by an operating IC chip from both the chip and the electronics package containing the chip is essential for proper system operation and to increase the life of the electronics package. Using an air permeable lid with the electronic package increases the heat transfer away from the IC chip and electronics package, thereby cooling the chip and the package.
摘要翻译：从芯片和包含芯片的电子封装中去除由工作IC芯片产生的热量对于正确的系统操作和延长电子封装的寿命至关重要。使用具有电子封装的透气盖增加远离IC芯片和电子封装的热传递，从而冷却芯片和封装。

6. 发明授权

US06219234B1 Method for using pulsating flow to improve thermal transport in systems 失效
标题翻译：使用脉动流改善系统热传输的方法
公开(公告)号：US06219234B1
公开(公告)日：2001-04-17
申请号：US09281703
申请日：1999-03-30
申请人： Bahgat G. Sammakia , Sanjeev B. Sathe
发明人： Bahgat G. Sammakia , Sanjeev B. Sathe
IPC分类号： H05K720
CPC分类号： H05K7/20154 , F26B21/028 , F26B21/12
摘要： A method for forming a pulsating air pattern at a surface of an electronic carrier assembly. The electronic carrier assembly includes a circuit card having an attached module or chip. An air circulation pattern, or flow pattern, is formed at the surface of an electronic carrier assembly by natural convection, or by a steady air flow generated by a fan, respectively. A suitably-positioned rotatable disk having one or more void regions, and in a state of rotation, interrupts the air circulation or flow pattern by causing a pulsation air pattern at the surface of the electronic carrier assembly. The effect of the pulsating air pattern is to increase the rate of heat transfer from the electronic carrier assembly by two mechanisms. First, the thickness of the boundary layer at the surface of the electronic carrier is reduced, thereby increasing the heat transfer coefficient at the boundary layer. Second, stagnant air trapped between nearby electronic components on the electronic carrier assembly is swept away. When no fan is present, the method generates a pulsating air pattern that enhances natural convection heat transfer. When a fan is present, the disk may be positioned between the fan and the electronic carrier assembly. Alternatively, the electronic carrier assembly may be positioned between the fan and the disk. Other configurations are possible, including those having two fans, two disks, and two or more electronic carrier assemblies.
摘要翻译：一种在电子载体组件的表面形成脉动空气图案的方法。电子载体组件包括具有附接的模块或芯片的电路卡。通过自然对流或通过风扇产生的稳定的气流，在电子载体组件的表面上分别形成空气循环图案或流动图案。具有一个或多个空隙区域并且处于旋转状态的适当定位的可旋转盘通过在电子载体组件的表面处引起脉动空气图案来中断空气循环或流动模式。脉动空气模式的作用是通过两种机制来提高从电子载体组件传热的速率。首先，电子载体表面的边界层的厚度减小，从而增加了边界层的传热系数。第二，电子载体组件附近的电子部件之间滞留的滞留空气被扫除。当不存在风扇时，该方法产生增强自然对流传热的脉动空气模式。当存在风扇时，盘可以位于风扇和电子承载器组件之间。或者，电子载体组件可以位于风扇和盘之间。其他配置是可能的，包括具有两个风扇，两个盘和两个或更多个电子载体组件的构造。

7. 发明授权

US06967389B2 Wafer with semiconductor chips mounted thereon 失效
标题翻译：具有安装在其上的半导体芯片的晶片
公开(公告)号：US06967389B2
公开(公告)日：2005-11-22
申请号：US10744368
申请日：2003-12-23
申请人： William Infantolino , Voya R. Markovich , Sanjeev B. Sathe , George H. Thiel
发明人： William Infantolino , Voya R. Markovich , Sanjeev B. Sathe , George H. Thiel
IPC分类号： H01L23/538 , H01L25/065 , H01L23/58
CPC分类号： H01L24/19 , H01L23/5389 , H01L24/24 , H01L25/0655 , H01L2224/04105 , H01L2224/20 , H01L2224/24137 , H01L2224/24227 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/00
摘要： A semiconductor chip module and forming method is provided. The module includes a support member having at least one well being open to receive a semiconductor chip. Each well depth is substantially equal to the thickness of a chip. The support member has a planar region surrounding each well. A chip is in each well. A dielectric sheet of material is laminated over each chip and extends onto the planar area surrounding the wells and has a face oriented away from the chip. Electrical circuitry including capture pads is formed on the face of the dielectric sheet and extends onto the sheet that overlies the planar region. Conducting vias are formed in the dielectric sheet connecting the electrical circuitry on the dielectric sheet with the contact pads on the chip. A multilayer, circuitized laminate having a fan-out pattern is laminated to the dielectric sheet.
摘要翻译：提供了一种半导体芯片模块和形成方法。模块包括具有至少一个开口以容纳半导体芯片的阱的支撑构件。每个阱深度基本上等于芯片的厚度。支撑构件具有围绕每个孔的平面区域。一个芯片在每个井。绝缘片材料层叠在每个芯片上并延伸到围绕阱的平面区域上并具有远离芯片的面。包括捕获垫的电路形成在电介质片的表面上并延伸到覆盖在平面区域上的片上。导电通孔形成在将电介质片上的电路与芯片上的接触焊盘连接的电介质片中。将具有扇出图案的多层电路叠层体叠层在电介质片上。

8. 发明授权

US06731012B1 Non-planar surface for semiconductor chips 有权
标题翻译：用于半导体芯片的非平面表面
公开(公告)号：US06731012B1
公开(公告)日：2004-05-04
申请号：US09471679
申请日：1999-12-23
申请人： William L. Brodsky , Sanjeev B. Sathe , George H. Thiel
发明人： William L. Brodsky , Sanjeev B. Sathe , George H. Thiel
IPC分类号： H01L2348
CPC分类号： H01L24/32 , H01L21/304 , H01L23/42 , H01L29/0657 , H01L2224/16225 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/10158 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H01L2924/3512 , H01L2924/00
摘要： A semiconductor chip package having a non-planar chip therein, to reduce the stress concentrations between the chip and cover plate. In particular, a chip and method of forming a chip having a non-planar or “domed” back surface, wherein the thickness of the non-planar chip is greatest substantially near the center of the chip. Further, a method of rounding the edges or corners of the chip to reduce crack propagation originating at the edges of the chip.
摘要翻译：一种其中具有非平面芯片的半导体芯片封装，以减小芯片和盖板之间的应力集中。具体地说，一种形成具有非平面或“半球形”背面的芯片的芯片和方法，其中非平面芯片的厚度基本上在芯片的中心附近最大。此外，一种使芯片的边缘或角部四舍五入以减少源自芯片边缘的裂纹扩展的方法。

9. 发明授权

US06992379B2 Electronic package having a thermal stretching layer 有权
公开(公告)号：US06992379B2
公开(公告)日：2006-01-31
申请号：US09947098
申请日：2001-09-05
申请人： David J. Alcoe , Li Li , Sanjeev B. Sathe
发明人： David J. Alcoe , Li Li , Sanjeev B. Sathe
IPC分类号： H01L23/053 , H05K1/03
CPC分类号： H01L23/562 , H01L23/3735 , H01L2224/16 , H01L2924/01025 , H01L2924/01079 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H01L2924/3511 , H05K1/0203 , H05K1/0271 , H05K1/112 , H05K3/4602 , H05K2201/09781 , H05K2201/10674 , H05K2201/2009
摘要： An electronic package and method of making same in which a circuitized substrate having a first stiffness includes a plurality of electrically conductive circuit members on a first portion of the circuitized substrate and is adapted for having solder connections thereon and for being electrically connected to a semiconductor chip. A stiffener layer having a second stiffness is positioned on a second portion of the circuitized substrate relative to the first portion, the second stiffness of the stiffener layer distributing a portion of the first stiffness of said circuitized substrate so as to substantially prevent failure of the solder connections between the electrically conductive circuit members and the semiconductor chip during operation of the electronic package.

10. 发明授权

US06665187B1 Thermally enhanced lid for multichip modules 失效
标题翻译：多芯片模块的热增强盖
公开(公告)号：US06665187B1
公开(公告)日：2003-12-16
申请号：US10198393
申请日：2002-07-16
申请人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
发明人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
IPC分类号： H05K720
CPC分类号： H01L23/10 , H01L23/36 , H01L23/42 , H01L23/427 , H01L24/73 , H01L25/0655 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
摘要翻译：一种具有一个或多个部件的电子封装件，包括：具有第一热膨胀系数的基板; 盖子，附着在基板上，盖子包括蒸汽室，盖子具有第二热膨胀系数，第一热膨胀系数与第二膨胀系数匹配; 与每个部件的背面接触的热转印介质和盖的下壁的外表面; 并且每个部件电连接到基板的顶表面。

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