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    • 2. 发明授权
    • Placement of conductive stripes in electronic circuits to satisfy metal density requirements
    • 在电子电路中放置导电条以满足金属密度要求
    • US06305000B1
    • 2001-10-16
    • US09334171
    • 1999-06-15
    • Nghia Van PhanMichael James Rohn
    • Nghia Van PhanMichael James Rohn
    • G06F1750
    • G06F17/5068H01L23/5286H01L2924/0002H01L2924/00
    • An electronic circuit and a method of designing the electronic circuit having conductive fill stripes which are electrically attached to the power distribution or to the signal routing of the circuit. Preferably, the conductive fill stripes are electrically attached to the power distribution and are interspersed between the power buses and signal wires on the various metal layers to satisfy the metal density requirements of integrated circuit and chip manufacturing. The conductive fill stripes are added during the design process after the placement of the power distribution and signal routing so that electrical continuity between the conductive fill stripes and the connecting bus, metal density requirements, other design rules and logic verification can be completed as the rest of the chip is designed.
    • 一种电子电路和一种设计具有导电填充条的电子电路的方法,所述导电填充条电连接到电力分配或电路的信号路由。 优选地,导电填充条电连接到功率分布并且散布在各种金属层上的电源总线和信号线之间,以满足集成电路和芯片制造的金属密度要求。 在布置配电和信号路由之后,在设计过程中添加导电填充条,使得导电填充条和连接总线之间的电连续性,金属密度要求,其他设计规则和逻辑验证可以作为其余部分完成 的芯片设计。