专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130110078A1 Vaccination Method Using Microneedle Arrays 审中-公开
标题翻译：使用微针阵列的疫苗接种方法
公开(公告)号：US20130110078A1
公开(公告)日：2013-05-02
申请号：US13643964
申请日：2011-04-28
申请人： Anne C. Moore , Frances Pearson , Adrian V.S. Hill , Abina M. Crean , Conor O'Mahony , Marie G. McGrath , John B. Carey
发明人： Anne C. Moore , Frances Pearson , Adrian V.S. Hill , Abina M. Crean , Conor O'Mahony , Marie G. McGrath , John B. Carey
IPC分类号： A61M37/00
CPC分类号： A61M37/0015 , A61K9/0021 , A61K39/00 , A61K39/015 , A61K2039/53 , A61K2039/54 , A61K2039/545 , Y02A50/412
摘要： The present invention provides vaccination methods using microneedle arrays which, when applied to the skin of a subject, create a defined total pore volume. Arrays may be chosen of varying total microneedle volumes (small, intermediate or large) for use in immunisation regimes to induce different T-cell and antibody responses in the subject. The present invention also provides kits for use in such vaccination method(s) comprising the appropriate microneedle array(s).
摘要翻译：本发明提供了使用微针阵列的疫苗接种方法，其在施用于受试者的皮肤时产生限定的总孔体积。阵列可以选择用于在受试者中诱导不同T细胞和抗体应答的免疫方案中使用的变化的总微针体积（小的，中间的或大的）。本发明还提供了用于这种疫苗接种方法的试剂盒，其包含适当的微针阵列。

2. 发明申请

US20130310665A1 METHOD 审中-公开
标题翻译：方法
公开(公告)号：US20130310665A1
公开(公告)日：2013-11-21
申请号：US13885372
申请日：2011-11-18
申请人： Abina M. Crean , Marie G. McGrath , Conor O'Mahony , Anto Vrdoljak , Anne C. Moore , John B. Carey
发明人： Abina M. Crean , Marie G. McGrath , Conor O'Mahony , Anto Vrdoljak , Anne C. Moore , John B. Carey
IPC分类号： A61K9/70 , A61B5/145
CPC分类号： A61K9/703 , A61B5/14503 , A61K9/0021 , A61M37/0015 , A61M2037/0053
摘要： The present invention relates to a method for fabricating a microneedle which comprises the steps of spraying a composition into a mould, drying the composition and removal of the dried composition from the mould, thereby forming a microneedle that, when applied to the skin of a subject, pierces the stratum corneum to access the underlying tissue of the subject. The present invention also relates to a method for coating a microneedle which comprises the steps of spraying a composition onto a microneedle and drying the composition at an ambient temperature, thereby forming a coated microneedle that, when applied to the skin of a subject, pierces the stratum corneum to deliver the sprayed material to the underlying tissue of the subject.
摘要翻译：本发明涉及一种制造微针的方法，其包括以下步骤：将组合物喷雾到模具中，干燥组合物并从模具中除去干燥的组合物，从而形成微针，当施用于受试者的皮肤时刺穿角质层以进入受试者的潜在组织。本发明还涉及一种用于涂覆微针的方法，其包括以下步骤：将组合物喷雾到微针上并在环境温度下干燥组合物，从而形成涂覆的微针，当被施用于受试者的皮肤时，刺穿角质层以将喷射的材料输送到受试者的潜在组织。

3. 发明申请

US20080145976A1 Packaging of Micro Devices 审中-公开
标题翻译：微器件封装
公开(公告)号：US20080145976A1
公开(公告)日：2008-06-19
申请号：US11795865
申请日：2006-01-24
申请人： Conor O'Mahony , Martin Hill
发明人： Conor O'Mahony , Martin Hill
IPC分类号： H01L21/58
CPC分类号： B81C1/00293 , B81C2203/0136 , B81C2203/0145
摘要： A silicon wafer is used as a substrate (1). A thin layer of metal is deposited and etched to form device metallisation (3), including electrodes and bondpads. A passivation layer (4) of silicon nitride is patterned to open access points to the metal. A lower sacrificial layer (5) is formed from polyimide and is patterned (at 5(a) and 5(b)) to open anchor regions for a device and for bridges that will define lateral etch channels for package evacuation. Structural materials that form a MEMS device (6) and bridges (13) are then deposited and patterned. The bridges (13) are patterned simultaneously with the device 6 on the lower sacrificial layer (5). An upper sacrificial layer (7) is then deposited over the device (6) and the lower sacrificial layer (5) and is patterned to open anchor regions (8) for an encapsulation layer (10). Both sacrificial layers are then simultaneously removed in an oxygen plasma ash through lateral etc channels (15). This step leaves a hollow and empty shell, inside which the MEMS device (6) is present. The device (6) is free to move after sacrificial layer removal and has clearance both above and below. The etch channels (15) are sealed by a sealant (40) applied over the encapsulant layer.
摘要翻译：硅晶片用作基板（1）。沉积并蚀刻薄层金属以形成器件金属化（3），包括电极和粘结垫。图案化氮化硅钝化层（4）以打开到金属的接入点。下部牺牲层（5）由聚酰亚胺形成，并被图案化（在5（a）和5（b））处，以打开用于器件的锚定区域，以及将限定用于封装排空的横向蚀刻通道的桥。然后，形成MEMS器件（6）和桥（13）的结构材料被沉积和图案化。桥（13）与下牺牲层（5）上的装置6同时图案化。然后将上牺牲层（7）沉积在器件（6）和下牺牲层（5）上，并被图案化以打开用于封装层（10）的锚定区域（8）。然后通过侧面等通道（15）在氧等离子体灰中同时去除两个牺牲层。该步骤留下空心的空壳，其中存在MEMS装置（6）。器件（6）在除去牺牲层后自由移动，并具有上下两个间隙。蚀刻通道（15）由施加在密封剂层上的密封剂（40）密封。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式