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1. 发明申请

US20100210073A1 Method for Encapsulating a Device in a Microcavity 审中-公开
标题翻译：在微腔中封装器件的方法
公开(公告)号：US20100210073A1
公开(公告)日：2010-08-19
申请号：US12772976
申请日：2010-05-03
申请人： Ann Witvrouw , Chris Van Hoof , Jan Fransaer , Jean-Pierre Celis , Raquel Consuelo Hellin Rico , Anthony Joseph Muscat
发明人： Ann Witvrouw , Chris Van Hoof , Jan Fransaer , Jean-Pierre Celis , Raquel Consuelo Hellin Rico , Anthony Joseph Muscat
IPC分类号： H01L21/56
CPC分类号： B81C1/00293 , B81C2203/0145
摘要： Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
摘要翻译：制造半导体器件涉及形成（200）牺牲层，其中微空腔将被定位，在牺牲层上形成（210）厚度大于1微米的金属层，从金属层形成（220）多孔层所述多孔层具有长度大于其宽度的十倍的孔，并且其宽度在10nm-500纳米的范围内。孔可以通过阳极氧化，电沉积或脱铝合金来形成。然后可以通过多孔层去除牺牲层（230），以形成微腔，并且可以密封孔（240）。使用多孔层封装MEMS器件可以通过避免使用光刻来成形入口孔来降低成本，因为牺牲层通过多孔膜去除。

2. 发明申请

US20080135998A1 Method For Encapsulating A Device In A Microcavity 有权
标题翻译：在微腔中封装器件的方法
公开(公告)号：US20080135998A1
公开(公告)日：2008-06-12
申请号：US11814724
申请日：2006-02-06
申请人： Ann Witvrouw , Chris Van Hoof , Jan Fransaer , Jean-Pierre Celis , Anthony Joseph Muscat , Raquel Consuelo Hellin Rico
发明人： Ann Witvrouw , Chris Van Hoof , Jan Fransaer , Jean-Pierre Celis , Anthony Joseph Muscat , Raquel Consuelo Hellin Rico
IPC分类号： H01L21/56 , H01L23/02
CPC分类号： B81C1/00293 , B81C2203/0145
摘要： Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
摘要翻译：制造半导体器件涉及形成（200）牺牲层，其中微空腔将被定位，在牺牲层上形成（210）厚度大于1微米的金属层，从金属层形成（220）多孔层所述多孔层具有长度大于其宽度的十倍的孔，并且其宽度在10nm-500纳米的范围内。孔可以通过阳极氧化，电沉积或脱铝合金来形成。然后可以通过多孔层去除牺牲层（230），以形成微腔，并且可以密封孔（240）。使用多孔层封装MEMS器件可以通过避免使用光刻来成形入口孔来降低成本，因为牺牲层通过多孔膜去除。

3. 发明授权

US07803665B2 Method for encapsulating a device in a microcavity 有权
标题翻译：将器件封装在微腔中的方法
公开(公告)号：US07803665B2
公开(公告)日：2010-09-28
申请号：US11814724
申请日：2006-02-06
申请人： Ann Witvrouw , Chris Van Hoof , Raquel Consuelo Hellin Rico , Anthony Joseph Muscat , Jan Fransaer , Jean-Pierre Celis
发明人： Ann Witvrouw , Chris Van Hoof , Raquel Consuelo Hellin Rico , Anthony Joseph Muscat , Jan Fransaer , Jean-Pierre Celis
IPC分类号： H01L23/28 , H01L21/31
CPC分类号： B81C1/00293 , B81C2203/0145
摘要： Manufacturing a semiconductor device involves forming (200) a sacrificial layer where a micro cavity is to be located, forming (210) a metal layer of thickness greater than 1 micron over the sacrificial layer, forming (220) a porous layer from the metal layer, the porous layer having pores of length greater than ten times their breadth, and having a breadth in the range 10 nm-500 nanometers. The pores can be created by anodising, electrodeposition or dealloying. Then the sacrificial layer can be removed (230) through the porous layer, to form the micro cavity, and pores can be sealed (240). Encapsulating MEMS devices with a porous layer can reduce costs by avoiding using photolithography for shaping the access holes since the sacrificial layer is removed through the porous membrane.
摘要翻译：制造半导体器件涉及形成（200）牺牲层，其中微空腔将被定位，在牺牲层上形成（210）厚度大于1微米的金属层，从金属层形成（220）多孔层所述多孔层具有长度大于其宽度的十倍的孔，并且其宽度在10nm-500纳米的范围内。孔可以通过阳极氧化，电沉积或脱铝合金来形成。然后可以通过多孔层去除牺牲层（230），以形成微腔，并且可以密封孔（240）。使用多孔层封装MEMS器件可以通过避免使用光刻来成形入口孔来降低成本，因为牺牲层通过多孔膜去除。

4. 发明申请

US20110168558A1 AQUEOUS ELECTROPHORETIC DEPOSITION 审中-公开
标题翻译：水性电泳沉积
公开(公告)号：US20110168558A1
公开(公告)日：2011-07-14
申请号：US13121096
申请日：2009-09-25
申请人： Jan Fransaer , Bram Neirinck , Omer Van Der Biest , Jozef Vleugels
发明人： Jan Fransaer , Bram Neirinck , Omer Van Der Biest , Jozef Vleugels
IPC分类号： C25D13/04 , C25D13/00
CPC分类号： C09D5/448 , A23P20/10 , C08L89/00 , C09D5/024 , C09D7/65 , C25D13/04 , C25D13/18
摘要： From an environmental, safety and economic perspective water should be the solvent of choice for electrophoretic deposition under industrial circumstances. However, because of the electrolytic decomposition of water, the majority of EPD is carried out in non-aqueous solvents.Approaches of the art for aqueous deposition involve the separation of the reaction and deposition front by means of a membrane, the use of palladium electrodes to absorb the formed hydrogen, addition of chemicals to suppress the electrolysis reaction, or lowering voltages below the threshold for water electrolysis. With the first two solutions, the production of coatings is impractical since the deposit is not formed on the electrode, or the electrode material is not suitable since the substrate is usually prescribed by the application. The use of specialty chemicals is expensive and difficult to control. Low voltages have been used to form high quality deposits from aqueous systems but they display very low deposition rates, which are not attractive from an economical perspective.Present invention provides a system and a means for which high voltages can be used in the electrophoretic deposition from aqueous suspensions without decomposition of water at satisfying deposition rates. It shows that the deposits obtained show a high green density with excellent surface quality.
摘要翻译：从环境，安全和经济角度看，在工业环境下，水是电泳沉积的首选溶剂。然而，由于水的电解分解，大部分EPD在非水溶剂中进行。水性沉积技术的方法涉及通过膜分离反应和沉积前沿，使用钯电极吸收形成的氢，添加化学物质以抑制电解反应或降低低于阈值的电压电解。使用前两种解决方案，由于在电极上没有形成沉积物，所以涂层的生产是不切实际的，或者电极材料不合适，因为基底通常由应用处理。使用特种化学品昂贵且难以控制。已经使用低电压从水系统形成高质量的沉积物，但它们显示非常低的沉积速率，这从经济角度来看是不吸引人的。本发明提供了一种系统和方法，其可以在水性悬浮液的电泳沉积中使用高电压，而不会以满足的沉积速率分解水分。表明所得沉积物具有高的绿色密度，表面质量优异。

5. 发明申请

US20110266504A1 DEPOSITION FROM IONIC LIQUIDS 审中-公开
标题翻译：离子液体的沉积
公开(公告)号：US20110266504A1
公开(公告)日：2011-11-03
申请号：US12673218
申请日：2008-07-25
申请人： Jan Fransaer
发明人： Jan Fransaer
IPC分类号： B05D5/12 , C25D5/00 , H01L21/20 , H01B1/02 , H01B1/06
CPC分类号： C25D3/665 , C23C18/31 , C23C18/40 , C25D5/34
摘要： A method to electrodeposit or electroless deposit material onto substrates from ionic liquids in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum and the resulting material. According to the invention, dense layers, free of unwanted components, can be produced in vacuum or in a protective atmosphere after exposing the ionic liquid to vacuum.
摘要翻译：一种在将离子液体暴露于真空和所得材料之后，在真空或保护气氛中从离子液体中电沉积或无电沉积材料到基底上的方法。根据本发明，在将离子液体暴露于真空之后，可以在真空或保护气氛中产生没有不需要的组分的致密层。

6. 发明申请

US20080159899A1 Process For Producing Sintered Porous Materials 失效
标题翻译：生产烧结多孔材料的方法
公开(公告)号：US20080159899A1
公开(公告)日：2008-07-03
申请号：US11993869
申请日：2006-06-27
申请人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
发明人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
IPC分类号： B22F3/11
CPC分类号： C03B19/06 , B22F3/11 , B22F2998/10 , C04B35/111 , C04B35/486 , C04B35/622 , C04B35/6264 , C04B38/0074 , C04B2235/322 , C04B2235/3225 , C04B2235/3229 , C04B2235/602 , C04B2235/6025 , C04B2235/6027 , C04B2235/6562 , C04B2235/6565 , C25D13/02 , Y02P40/57 , C04B35/565 , C04B38/0054 , C04B35/584 , C04B35/581 , C04B35/58 , C04B35/626 , B22F3/22 , B22F3/10
摘要： The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.
摘要翻译：本发明提供了一种制备多孔结构或材料的方法，包括固体颗粒乳液的胶体加工（例如滑移浇铸，压铸，带铸或电泳沉积）以形成可直接烧结而不脱粘合步骤的生坯。

7. 发明授权

US08025838B2 Process for producing sintered porous materials 失效
标题翻译：烧结多孔材料的制造方法
公开(公告)号：US08025838B2
公开(公告)日：2011-09-27
申请号：US11993869
申请日：2006-06-27
申请人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
发明人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
IPC分类号： B22F3/11 , C04B38/00
CPC分类号： C03B19/06 , B22F3/11 , B22F2998/10 , C04B35/111 , C04B35/486 , C04B35/622 , C04B35/6264 , C04B38/0074 , C04B2235/322 , C04B2235/3225 , C04B2235/3229 , C04B2235/602 , C04B2235/6025 , C04B2235/6027 , C04B2235/6562 , C04B2235/6565 , C25D13/02 , Y02P40/57 , C04B35/565 , C04B38/0054 , C04B35/584 , C04B35/581 , C04B35/58 , C04B35/626 , B22F3/22 , B22F3/10
摘要： The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.
摘要翻译：本发明提供了一种制备多孔结构或材料的方法，包括固体颗粒乳液的胶体加工（例如滑移浇铸，压铸，带铸或电泳沉积）以形成可直接烧结而不脱粘合步骤的生坯。

8. 发明申请

US20090252635A9 Process For Producing Sintered Porous Materials 失效
标题翻译：生产烧结多孔材料的方法
公开(公告)号：US20090252635A9
公开(公告)日：2009-10-08
申请号：US11993869
申请日：2006-06-27
申请人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
发明人： Bram Neirinck , Jozef Vleugels , Jan Fransaer , Omer Van Der Biest
IPC分类号： B22F3/11
CPC分类号： C03B19/06 , B22F3/11 , B22F2998/10 , C04B35/111 , C04B35/486 , C04B35/622 , C04B35/6264 , C04B38/0074 , C04B2235/322 , C04B2235/3225 , C04B2235/3229 , C04B2235/602 , C04B2235/6025 , C04B2235/6027 , C04B2235/6562 , C04B2235/6565 , C25D13/02 , Y02P40/57 , C04B35/565 , C04B38/0054 , C04B35/584 , C04B35/581 , C04B35/58 , C04B35/626 , B22F3/22 , B22F3/10
摘要： The invention provides a process of making porous structures or materials, including the colloidal processing (e.g. slip casting, pressure casting, tape casting or electrophoretic deposition) of solid particle emulsions to form a green body that can be directly sintered without a de-binding step.
摘要翻译：本发明提供了一种制备多孔结构或材料的方法，包括固体颗粒乳液的胶体加工（例如滑移浇铸，压铸，带铸或电泳沉积）以形成可直接烧结而不脱粘合步骤的生坯。

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