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1. 发明授权

US07344981B2 Plated terminations 有权
标题翻译：电镀端接
公开(公告)号：US07344981B2
公开(公告)日：2008-03-18
申请号：US11066575
申请日：2005-02-25
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
IPC分类号： H01L21/44 , H01L21/76 , H01G7/00 , H01G4/228
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30 , H01L2924/01029 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.
摘要翻译：多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

2. 发明授权

US07177137B2 Plated terminations 有权
标题翻译：电镀端接
公开(公告)号：US07177137B2
公开(公告)日：2007-02-13
申请号：US10818951
申请日：2004-04-06
申请人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
发明人： Andrew P. Ritter , Robert Heistand, II , John L. Galvagni , Sriram Dattaguru , Jeffrey A. Horn , Richard A. Ladew
IPC分类号： H01G4/228
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30 , H01L2924/01029 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrode elements and a plurality of internal anchor tabs. Portions of the internal electrode elements and anchor tabs are exposed along the periphery of the electronic component in one or more aligned columns. Each exposed portion is within a predetermined distance from other exposed portions in a given column such that bridged terminations may be formed by depositing one or more plated termination materials over selected of the respectively aligned columns. Internal anchor tabs may be provided and exposed in prearranged relationships with other exposed conductive portions to help nucleate metallized plating material along the periphery of a device. External anchor tabs or lands may be provided to form terminations that extend to top and/or bottom surfaces of the device. Selected of the conductive elements may be formed by a finite volume percentage of ceramic material for enhanced durability, and external lands may be thicker than internal conductive elements and/or may also be embedded in top and/or bottom component surfaces. A variety of potential internal electrode configurations are possible including ones configured for orientation-insensitive component mounting and for high density peripheral termination interdigitated capacitors.
摘要翻译：多层电子部件包括与多个内部电极元件和多个内部固定突片交错的多个电介质层。内部电极元件和锚定片的部分沿着电子元件的外围在一个或多个对齐的列中露出。每个暴露部分在与给定列中的其它暴露部分预定距离内，使得桥接端接可以通过在选定的分别对准的柱上沉积一个或多个电镀终止材料而形成。可以提供内部锚定突片并以与其它暴露的导电部分的预定关系暴露，以帮助沿着装置的周边使金属化电镀材料成核。可以提供外部锚定片或平台以形成延伸到装置的顶部和/或底部表面的终端。选择的导电元件可以由有限体积百分比的陶瓷材料形成，以增强耐久性，并且外部焊盘可以比内部导电元件厚，和/或也可以嵌入在顶部和/或底部部件表面中。各种潜在的内部电极配置是可能的，包括被配置用于定向不敏感元件安装和用于高密度外围端接叉指电容器的构造。

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