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    • 1. 发明申请
    • Plastic Film and Touch Sensor
    • 塑料薄膜和触摸传感器
    • US20140218053A1
    • 2014-08-07
    • US14241695
    • 2012-07-11
    • Andreas UllmannWalter FixNorbert LausHaymo Katschorek
    • Andreas UllmannWalter FixNorbert LausHaymo Katschorek
    • G01B7/14
    • G01B7/14G06F3/044G06F2203/04103
    • Disclosed is a plastic film and a touch module produced therefrom. The module is constructed from two conductive layers with an insulation layer in between, as are used in capacitive touch pads and/or touch screens, for example. The problem of connecting the respective x or y sensors across two planes in a cost-effective manner employs foldable sensor planes in the plastic film suitable for mass production. The connections and conductor tracks are concentrated on one plane on a sensor side wherein the sensor planes are arranged on flexible materials. The registering of the two planes relative to each other is simplified via a secure mechanical connection of the two planes via a fold in the film.
    • 公开了一种塑料膜和由其制成的触摸模块。 该模块由两个导电层构成,其间具有绝缘层,例如用于电容式触摸板和/或触摸屏中的绝缘层。 以成本有效的方式将各个x或y传感器连接在两个平面上的问题在适于批量生产的塑料膜中采用可折叠的传感器平面。 连接和导体轨道集中在传感器侧的一个平面上,其中传感器平面布置在柔性材料上。 通过薄膜中的折叠通过两个平面的牢固的机械连接来简化相对于彼此的两个平面的对准。
    • 9. 发明申请
    • Electronic component
    • 电子元器件
    • US20090108253A1
    • 2009-04-30
    • US11989623
    • 2006-07-27
    • Andreas UllmannAlexander KnoblochMerlin WelkerWalter Fix
    • Andreas UllmannAlexander KnoblochMerlin WelkerWalter Fix
    • H01L51/10
    • H01L51/0002B82Y10/00H01L51/0036H01L51/0037H01L51/0047H01L51/0055H01L51/0097H01L51/0541H01L51/0545H01L2924/0002H01L2924/00
    • The invention relates to an electronic component comprising a flexible substrate, on the surface of which is arranged a layer stack composed of thin layers, containing at least one electrical functional layer composed of an electrically conductive or semiconducting material, wherein the component comprises at least a first material, a layered second material and a layered third material and wherein, as seen perpendicular to the surface of the substrate the first material is followed by the second material and the second material is followed by the third material, wherein a first adhesion force of the second material to the first material is lower than a second adhesion force of the third material to the first material and the second material has at least one opening, via which the third material is connected to the first material in order to increase the adhesion of the second material to the first material.
    • 本发明涉及一种电子部件,其包括柔性基板,其表面上布置有由薄层构成的层叠层,该堆叠层包含由导电或半导体材料构成的至少一个电功能层,其中所述部件包括至少一个 第一材料,层状第二材料和层状第三材料,并且其中,垂直于所述基材的表面观察所述第一材料后面是所述第二材料,所述第二材料之后是所述第三材料,其中第一粘合力 第一材料的第二材料低于第三材料与第一材料的第二粘附力,第二材料具有至少一个开口,第三材料通过该开口与第一材料连接,以增加第一材料的粘附力 第二种材料是第一种材料。