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1. 发明授权

US07554323B2 Direct facility water test head cooling architecture 有权
标题翻译：直接设备水测试头冷却架构
公开(公告)号：US07554323B2
公开(公告)日：2009-06-30
申请号：US11715650
申请日：2007-03-08
申请人： Andreas C. Pfahnl , Luis A. Muller , Ray Mirkhani
发明人： Andreas C. Pfahnl , Luis A. Muller , Ray Mirkhani
IPC分类号： G01R1/02
CPC分类号： G01R31/2891
摘要： An apparatus is provided to cool high-performance instruments within a semiconductor test head using direct facility water. The direct facility water cooling apparatus consists of an air chamber, a first base to receive and removably mount the instrument within the air chamber, a test head inlet in fluid communication with the first base and a facility water supply, a test head discharge in fluid communication with the first base and a facility drain, and a fan in fluid communication with the air chamber inlet to induce the flow of air from the air chamber inlet to the air chamber outlet.
摘要翻译：提供了一种使用直接设备水冷却半导体测试头内的高性能仪器的设备。直接设备水冷却装置包括一个空气室，一个第一基座，用于将该仪器接纳并可拆卸地安装在空气室内;一个测试头入口，与第一个基座流体连通;一个设备供水; 与第一基座和设施排水管的连通，以及与空气室入口流体连通以引导空气从空气室入口流到空气室出口的风扇。

2. 发明授权

US07280356B2 Air cooling architecture for orthogonal board architectures 有权
标题翻译：正交板结构的空气冷却架构
公开(公告)号：US07280356B2
公开(公告)日：2007-10-09
申请号：US11011838
申请日：2004-12-14
申请人： Andreas C. Pfahnl , Christopher Heard
发明人： Andreas C. Pfahnl , Christopher Heard
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： An electronic system is disclosed that uses air for cooling first and second orthogonally oriented arrays of parallel circuit boards. Air is drawn into the front of the system, passes alongside the circuit boards in the first array, takes a 90-degree turn, continues over the circuit boards in the second array, and takes another 90-degree turn to exhaust through the rear of the system. The circuit boards in the first array are cooled through a separate airflow path, which preferably also runs front-to-rear.
摘要翻译：公开了一种使用空气冷却并联电路板的第一和第二正交取向阵列的电子系统。空气被吸入系统的前部，沿着第一阵列中的电路板通过，转动90度，继续在第二阵列中的电路板上，另外90度转动通过后面的系统。第一阵列中的电路板通过独立的气流路径被冷却，该气流路径优选地也前后运行。

3. 发明授权

US06448575B1 Temperature control structure 失效
标题翻译：温度控制结构
公开(公告)号：US06448575B1
公开(公告)日：2002-09-10
申请号：US09497010
申请日：2000-02-02
申请人： Alexander H. Slocum , Andreas C. Pfahnl , Ernest P. Walker , Ronald A. Sartschev
发明人： Alexander H. Slocum , Andreas C. Pfahnl , Ernest P. Walker , Ronald A. Sartschev
IPC分类号： H01L2358
CPC分类号： H01L23/58 , H01L23/34 , H01L23/345 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure for controlling the temperature of a component is described. The structure includes a resistive layer having one or more channels provided therein and having a resistance characteristic such that a signal applied thereto causes the resistive layer to generate heat. A cooling fluid is fed through the one or more channels to cool both the structure and a component disposed on the structure. By providing the cooling channels in the resistive layer, the heating and cooling sources are intermingled. The structure can optionally include precising and vacuum clamping structures, to locate and hold the component that is to be temperature controlled.
摘要翻译：描述了用于控制部件的温度的半导体结构。该结构包括具有设置在其中的一个或多个通道的电阻层，并具有电阻特性，使得施加到其上的信号使电阻层产生热量。冷却流体通过一个或多个通道进给，以冷却结构和设置在结构上的部件。通过在电阻层中提供冷却通道，将加热和冷却源混合。该结构可以可选地包括精确和真空夹紧结构，以定位和保持待温度控制的部件。

4. 发明授权

US07978476B2 Electronic system with non-parallel arrays of circuit card assemblies 失效
标题翻译：具有电路卡组件非平行阵列的电子系统
公开(公告)号：US07978476B2
公开(公告)日：2011-07-12
申请号：US10954865
申请日：2004-09-30
申请人： Christopher Heard , Andreas C. Pfahnl
发明人： Christopher Heard , Andreas C. Pfahnl
IPC分类号： H05K5/00
CPC分类号： H05K7/1408 , H05K7/1409
摘要： An electronic assembly for housing circuit cards of different types, which communicate with one another at high speed. Circuit cards of a first type plug into a backplane side-by-side. Circuit cards of a second type are arranged perpendicularly to the circuit cards of the first type. The arrangement allows cards of the first type to communicate with cards of the second type over short distances, thus improving system throughput. It also allows cards of different types to be cooled differently, thus promoting efficient cooling.
摘要翻译：一种用于容纳不同类型的电路卡的电子组件，其以高速彼此通信。第一类电路卡并排插入背板。第二类型的电路卡垂直于第一类电路卡布置。该布置允许第一类型的卡在短距离上与第二类型的卡通信，从而提高系统吞吐量。它还允许不同类型的卡被不同地冷却，从而促进有效的冷却。

5. 发明授权

US07257000B2 Thermally enhanced pressure regulation of electronics cooling system 有权
标题翻译：电子冷却系统的热增压调节
公开(公告)号：US07257000B2
公开(公告)日：2007-08-14
申请号：US10886449
申请日：2004-07-07
申请人： Andreas C. Pfahnl , Peter Griffith
发明人： Andreas C. Pfahnl , Peter Griffith
IPC分类号： H05K7/20
CPC分类号： H05K7/20327
摘要： A two-phase cooling system operated at atmospheric pressure. A reservoir containing cooling fluid has a stack that is vented to the atmosphere. The stack is shaped to allow condensation of substantially all of the cooling fluid in vapor form entering the stack. Condensation may be enhanced by cooling the stack, such as with flowing air along the outer walls of the stack or placing a thermoelectric device in contact with the stack. The system provides high thermal capacity but is easy to use and service.
摘要翻译：在大气压下运行的两相冷却系统。包含冷却流体的储存器具有排放到大气中的叠层。堆叠被成形为允许冷凝基本上所有进入烟囱的蒸汽形式的冷却流体。可以通过冷却堆叠来增强冷凝，例如沿着堆叠的外壁流动的空气或者使热电装置与堆叠接触。该系统提供高热容量，但易于使用和使用。

6. 发明授权

US06717115B1 Semiconductor handler for rapid testing 有权
标题翻译：用于快速测试的半导体处理器
公开(公告)号：US06717115B1
公开(公告)日：2004-04-06
申请号：US09585453
申请日：2000-06-01
申请人： Andreas C. Pfahnl , John D. Moore
发明人： Andreas C. Pfahnl , John D. Moore
IPC分类号： H05B368
CPC分类号： H01L21/67109 , H01L21/67103
摘要： A strip, leadframe or panel type handling device for use in testing semiconductor components. The handling device has a thermal plate assembly with embedded electrical resistance heaters. The heaters are separately controlled in zones to provide uniform temperature across the plate for elevated temperature testing. Cooling channels are formed in the plate. Intermingling channels are provided to allow different types of cooling fluids to be used to cool at different rates or hold a cold temperature at different levels. The cooling channels can likewise be provided in zones to promote temperature uniformity. Vacuum channels are used to hold the semiconductor parts under test in close contact with the thermal plate.
摘要翻译：用于测试半导体元件的条带，引线框架或面板类型处理装置。处理装置具有带有嵌入式电阻加热器的热板组件。加热器在区域中分别控制，以在板上提供均匀的温度用于高温测试。板中形成冷却通道。提供混合通道以允许不同类型的冷却流体以不同的速率冷却或保持不同水平的冷温度。冷却通道同样可以设置在区域中以促进温度均匀性。真空通道用于保持与热板紧密接触的被测半导体部件。

7. 发明授权

US09717312B2 Device for removing earrings 有权
公开(公告)号：US09717312B2
公开(公告)日：2017-08-01
申请号：US14111000
申请日：2012-04-12
申请人： Andreas C. Pfahnl , Patrick R. Corneille , Jason R. Gerold , Katja U. Pfahnl
发明人： Andreas C. Pfahnl , Patrick R. Corneille , Jason R. Gerold , Katja U. Pfahnl
IPC分类号： A44C7/00 , B25B9/02 , A61B17/076
CPC分类号： A44C7/00 , A61B17/076 , B25B9/02 , Y10T29/4959
摘要： An earring removal device is provided to remove a stud type earring. The removal device includes tips that easily interface with the earring post and backer to facilitate removal. The tips are coupled to an arcuate structure with a spring characteristic. Simple squeezing of the arcuate structure actuates the tips to separate the backer from the post. The spring characteristic is biased to keep the tips spaced apart, or open, in the absence of a squeezing force.

8. 发明申请

US20140173902A1 DEVICE AND METHODS FOR REMOVING EARRINGS 有权
标题翻译：用于移除耳环的装置和方法
公开(公告)号：US20140173902A1
公开(公告)日：2014-06-26
申请号：US14111000
申请日：2012-04-12
申请人： Andreas C. Pfahnl , Patrick R. Corneille , Jason R. Gerold , Katja U. Pfahnl
发明人： Andreas C. Pfahnl , Patrick R. Corneille , Jason R. Gerold , Katja U. Pfahnl
IPC分类号： A44C7/00 , B25B9/02
CPC分类号： A44C7/00 , A61B17/076 , B25B9/02 , Y10T29/4959
摘要： Devices and related methods to remove stud-type earrings. The removal devices include tips that easily interface with the earring post and backer to facilitate removal. The tips are coupled to a structure with a spring characteristic. Simple squeezing of the structure actuates the tips to separate the backer from the post. The spring characteristic is biased to keep the tips spaced apart, or open, in the absence of a squeezing force.
摘要翻译：拆卸螺柱式耳环的设备及相关方法。去除装置包括能够容易地与耳环柱和支撑件接合以便于移除的尖端。尖端与具有弹簧特性的结构耦合。该结构的简单挤压致动提示将支柱与柱分开。弹簧特性被偏置以在没有挤压力的情况下将尖端间隔开或打开。

9. 发明授权

US07484552B2 Modular rackmount chiller 失效
标题翻译：模块化机架式冷水机组
公开(公告)号：US07484552B2
公开(公告)日：2009-02-03
申请号：US10741542
申请日：2003-12-19
申请人： Andreas C. Pfahnl
发明人： Andreas C. Pfahnl
IPC分类号： F28F7/00 , F28D15/00 , H05K7/20
CPC分类号： H05K7/20781 , F28D1/0535 , F28D2021/0029
摘要： A chiller assembly shaped for use in a standard electronics rack. The chiller has a low profile, and is capable of being made to occupy less than 5 rack units. The chiller is modular, with subassemblies positioned to allow easy removal for maintenance. The fan and power supply are made as replaceable subassemblies that can be inserted or removed from the front of the unit without any special tools. The pump is made with a magnetically coupled motor, allowing the motor to be easily removed for service or replacement. The motor is also accessible from the front panel of the assembly.
摘要翻译：一种用于标准电子机架的冷却器组件。冷水机具有低调，并且能够占据少于5个机架单元。冷却器是模块化的，子组件定位为便于维护。风扇和电源是作为可更换的组件，可以在没有任何专用工具的情况下从设备的前部插入或拆下。该泵由磁耦合电机制成，允许电机容易拆卸以进行维修或更换。电机也可从组件的前面板进入。

10. 发明授权

US07004235B1 Method of providing direct impingement temperature control of a device 有权
标题翻译：提供设备的直接冲击温度控制的方法
公开(公告)号：US07004235B1
公开(公告)日：2006-02-28
申请号：US10345846
申请日：2003-01-16
申请人： Alexander H. Slocum , Andreas C. Pfahnl
发明人： Alexander H. Slocum , Andreas C. Pfahnl
IPC分类号： F25B29/00 , H01S3/04
CPC分类号： G05D23/1858
摘要： A method for controlling the temperature of a device is described. The method includes providing a body having a heating/cooling region to which the device is exposed, heating the device with a heating channel provided in the body with one end exposed to the heating/cooling region and cooling the device with cooling channel provided in the body with one end exposed to the heating/cooling region. The heating and cooling channels are provided in the body such that energy propagating in the heating channel is intermingled with gas propagating in the cooling channel and the heating and cooling sources directly impinge upon the device in the heating region.
摘要翻译：描述了一种用于控制设备温度的方法。该方法包括提供具有该装置所暴露的加热/冷却区域的主体，用设置在主体中的一个加热通道加热该装置，其一端暴露于加热/冷却区域，并用设置在该加热/冷却区域中的冷却通道冷却该装置其一端暴露于加热/冷却区域。加热和冷却通道设置在体内，使得在加热通道中传播的能量与在冷却通道中传播的气体混合，并且加热和冷却源直接冲击加热区域中的装置。

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