会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 5. 发明申请
    • MULTI-LAYER OVERLAY METROLOGY TARGET AND COMPLIMENTARY OVERLAY METROLOGY MEASUREMENT SYSTEMS
    • 多层叠加计量目标和综合覆盖度量度测量系统
    • US20120033215A1
    • 2012-02-09
    • US13186144
    • 2011-07-19
    • Daniel KandelVladimir LevinskiGuy Cohen
    • Daniel KandelVladimir LevinskiGuy Cohen
    • G01B11/06G01J4/00
    • G03F7/70633G03F7/70683
    • A multi-layer overlay target for use in imaging based metrology is disclosed. The overlay target includes a plurality of target structures including three or more target structures, each target structure including a set of two or more pattern elements, wherein the target structures are configured to share a common center of symmetry upon alignment of the target structures, each target structure being invariant to N degree rotation about the common center of symmetry, wherein N is equal to or greater than 180 degrees, wherein each of the two or more pattern elements has an individual center of symmetry, wherein each of the two or more pattern elements of each target structure is invariant to M degree rotation about the individual center of symmetry, wherein M is equal to or greater than 180 degrees.
    • 公开了一种用于基于成像的计量学的多层覆盖目标。 覆盖目标包括包括三个或更多个目标结构的多个目标结构,每个目标结构包括一组两个或多个模式元素,其中目标结构被配置为在目标结构对准时共享公共对称中心,每个目标结构 目标结构相对于公共对称中心不变为N度旋转,其中N等于或大于180度,其中两个或更多个图案元素中的每一个具有单独的对称中心,其中两个或更多个图案 每个目标结构的元素对于单个对称中心的M度旋转是不变的,其中M等于或大于180度。
    • 10. 发明授权
    • Top-down nanowire thinning processes
    • 自上而下的纳米线稀疏过程
    • US08546269B2
    • 2013-10-01
    • US12417936
    • 2009-04-03
    • Tymon BarwiczGuy CohenLidija SekaricJeffrey Sleight
    • Tymon BarwiczGuy CohenLidija SekaricJeffrey Sleight
    • H01L21/302H01L21/461H01L29/06
    • H01L21/02238B82Y10/00B82Y30/00H01L21/02255H01L21/30604H01L29/0665H01L29/0676H01L29/42392H01L29/775H01L29/78696
    • Techniques for fabricating nanowire-based devices are provided. In one aspect, a method for fabricating a semiconductor device is provided comprising the following steps. A wafer is provided having a silicon-on-insulator (SOI) layer over a buried oxide (BOX) layer. Nanowires and pads are etched into the SOI layer to form a ladder-like structure wherein the pads are attached at opposite ends of the nanowires. The BOX layer is undercut beneath the nanowires. The nanowires and pads are contacted with an oxidizing gas to oxidize the silicon in the nanowires and pads under conditions that produce a ratio of a silicon consumption rate by oxidation on the nanowires to a silicon consumption rate by oxidation on the pads of from about 0.75 to about 1.25. An aspect ratio of width to thickness among all of the nanowires may be unified prior to contacting the nanowires and pads with the oxidizing gas.
    • 提供了制造基于纳米线的器件的技术。 一方面,提供一种制造半导体器件的方法,包括以下步骤。 提供了在掩埋氧化物(BOX)层上方具有绝缘体上硅(SOI)层的晶片。 将纳米线和焊盘蚀刻到SOI层中以形成阶梯状结构,其中焊盘附着在纳米线的相对端。 BOX层在纳米线下面被切下。 纳米线和焊盘与氧化气体接触,以在通过氧化在纳米线上产生硅消耗速率与硅消耗速率之比的条件下,在纳米线和焊盘中氧化硅,焊盘上的氧化从约0.75降至 约1.25。 在使纳米线和焊盘与氧化气体接触之前,可以统一所有纳米线中的宽度与厚度的纵横比。