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1. 发明申请

US20070089626A1 Functional ink apparatus and method 审中-公开
标题翻译：功能性油墨装置及方法
公开(公告)号：US20070089626A1
公开(公告)日：2007-04-26
申请号：US11259580
申请日：2005-10-26
申请人： Amjad Rasul , Paul Brazis , Daniel Gamota , Andrew Skipor , Jie Zhang
发明人： Amjad Rasul , Paul Brazis , Daniel Gamota , Andrew Skipor , Jie Zhang
IPC分类号： B41F31/00
CPC分类号： H05K1/162 , H05K2201/0209 , H05K2201/0257 , H05K2203/013
摘要： A functional ink (200) suitable for use as a dielectric layer (303) in a printed semiconductor device (300) comprises a dielectric carrier (201) and a plurality of dielectric particles (202) sized less than about 1,000 nanometers that are disposed within the dielectric carrier. In a preferred approach the dielectric carrier comprises a dielectric resin and the dielectric particles comprise a ferroelectric material (such as, but not limited to, BaTiO3. So provided, this functional ink can be applied to a substrate (301) of choice through a printing technique of choice to thereby provide a resultant printed semiconductor device, such as a field effect transistor, having a relatively thin dielectric layer comprised of this functional ink.
摘要翻译：适合用作印刷半导体器件（300）中的电介质层（303）的功能油墨（200）包括电介质载体（201）和尺寸小于约1000纳米的多个电介质颗粒（202）电介质载体。在优选的方法中，电介质载体包括电介质树脂，并且电介质颗粒包含铁电材料（例如但不限于BaTiO 3 N 3）。因此，该功能性油墨可以应用于基底（301），通过选择的打印技术来选择，从而提供具有由该功能性墨水组成的相对薄的介电层的所得印刷半导体器件，例如场效应晶体管。

2. 发明申请

US20050189537A1 Encapsulated organic semiconductor device and method 有权
标题翻译：封装有机半导体器件及方法
公开(公告)号：US20050189537A1
公开(公告)日：2005-09-01
申请号：US11108025
申请日：2005-04-15
申请人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
发明人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
IPC分类号： H01L51/05 , H01L51/52 , H01L29/08 , H01L21/8234 , H01L35/24 , H01L51/00
CPC分类号： H01L51/107 , H01L51/0516 , H01L51/524 , H01L51/5243 , H01L51/5253 , H01L51/5259 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically lead to inoperability of a corresponding device. If desired, the barrier layer can be comprised of partially permeable material that allows some substances therethrough to thereby effect disabling of the encapsulated organic semiconductor device after a substantially predetermined period of time. Getterers (141) may also be used to protect, at least for a period of time, such organic semiconductor material.
摘要翻译：包括有机半导体材料（14）的半导体器件具有至少部分设置在其周围的一个或多个阻挡层（16），以保护有机半导体材料（14）免受通常导致相应器件的不可操作性的环境驱动的变化。如果需要，阻挡层可以由允许一些物质通过其的部分渗透性材料构成，从而在基本上预定的时间段之后使封装的有机半导体器件失效。乞丐（141）也可用于至少在一段时间内保护这种有机半导体材料。

3. 发明授权

US06649852B2 Micro-electro mechanical system 有权
标题翻译：微机电系统
公开(公告)号：US06649852B2
公开(公告)日：2003-11-18
申请号：US09929750
申请日：2001-08-14
申请人： Marc Chason , Andrew Skipor , Aroon Tungare , Daniel Gamota , Sanjar Ghaem
发明人： Marc Chason , Andrew Skipor , Aroon Tungare , Daniel Gamota , Sanjar Ghaem
IPC分类号： H01H3900
CPC分类号： H05K3/4092 , H01H59/0009 , H01H2001/0073
摘要： The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.
摘要翻译：根据本发明的有机MEMS包括聚合物基材，其包括包含第一区域和第二区域的基材表面。将聚合物涂层施加到第一区域以提供与基底表面间隔开的涂层表面。端子设置在第二区域上。金属痕迹附着在涂层表面上，使得金属迹线在第二区域上形成柔性延伸。延伸部具有静止位置，其中延伸部与端子间隔开，以及弯曲位置，其中延伸部朝向端子设置。致动器用于提供电场以将延伸部从静止位置偏转到弯曲位置。通过改变延伸部和端子之间的间距，可以改变由MEMS提供的电气条件。

4. 发明授权

US06562663B2 Microelectronic assembly with die support and method 有权
公开(公告)号：US06562663B2
公开(公告)日：2003-05-13
申请号：US09819393
申请日：2001-03-28
申请人： Steven M. Scheifers , Andrew Skipor , Daniel Gamota
发明人： Steven M. Scheifers , Andrew Skipor , Daniel Gamota
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L21/56 , H01L21/561 , H01L23/3157 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/14 , H01L2924/00 , H01L2224/0401
摘要： A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die having a die face and a plurality of bond pads of the die face. The die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate.

5. 发明授权

US07393716B2 Encapsulated organic semiconductor device and method 有权
标题翻译：封装有机半导体器件及方法
公开(公告)号：US07393716B2
公开(公告)日：2008-07-01
申请号：US11108025
申请日：2005-04-15
申请人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
发明人： Steven Scheifers , Daniel Gamota , Andrew Skipor , Krishna Kalyanasundaram
IPC分类号： H01L51/00 , H01L21/00 , H01L29/08 , H01L35/24
CPC分类号： H01L51/107 , H01L51/0516 , H01L51/524 , H01L51/5243 , H01L51/5253 , H01L51/5259 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor device comprising organic semiconductor material (14) has one or more barrier layers (16) disposed at least partially thereabout to protect the organic semiconductor material (14) from environment-driven changes that typically lead to inoperability of a corresponding device. If desired, the barrier layer can be comprised of partially permeable material that allows some substances therethrough to thereby effect disabling of the encapsulated organic semiconductor device after a substantially predetermined period of time. Getterers (141) may also be used to protect, at least for a period of time, such organic semiconductor material.
摘要翻译：包括有机半导体材料（14）的半导体器件具有至少部分设置在其周围的一个或多个阻挡层（16），以保护有机半导体材料（14）免受通常导致相应器件的不可操作性的环境驱动的变化。如果需要，阻挡层可以由允许一些物质通过其的部分渗透性材料构成，从而在基本上预定的时间段之后使封装的有机半导体器件失效。乞丐（141）也可用于至少在一段时间内保护这种有机半导体材料。

6. 发明申请

US20060196579A1 High energy soldering composition and method of soldering 审中-公开
标题翻译：高能焊料组合物及焊接方法
公开(公告)号：US20060196579A1
公开(公告)日：2006-09-07
申请号：US11073919
申请日：2005-03-07
申请人： Andrew Skipor , Krishna Jonnalagadda , Steven Scheifers
发明人： Andrew Skipor , Krishna Jonnalagadda , Steven Scheifers
IPC分类号： B23K35/34
CPC分类号： H05K3/3484 , B23K35/0244 , B23K35/025 , H05K2201/0257 , H05K2201/0266
摘要： A low temperature, high energy soldering composition for joining metals together contains a fluxing agent and high energy metal particles that possess sufficiently high internal energy, suspended in the fluxing agent, such that the melting point of the high energy metal particles is depressed by at least three degrees Celsius below the normal bulk melting temperature of metal. A solder joint is effected by placing the high energy metal particles in contact with one or more of the metal surfaces and heating the high energy metal particles in the presence of a fluxing agent to melt the high energy metal particles and fuse them to the metal surface.
摘要翻译：用于将金属接合的低温，高能量焊接组合物含有助熔剂和具有足够高的内部能量的高能金属颗粒，悬浮在助熔剂中，使得高能金属颗粒的熔点至少被压下三摄氏度以下的正常体积熔融金属温度。通过将高能金属颗粒与一个或多个金属表面接触并且在助熔剂存在下加热高能金属颗粒来熔化高能金属颗粒并将其熔合到金属表面来实现焊接接头。

7. 发明授权

US5895976A Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same 失效
标题翻译：包括集成电路芯片上的聚合物增强的微电子组件及其形成方法
公开(公告)号：US5895976A
公开(公告)日：1999-04-20
申请号：US657216
申请日：1996-06-03
申请人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
发明人： Michelle J. Morrell , Steven C. Machuga , Grace M. O'Malley , George A. Carson , Andrew Skipor , Wen Xu Zhou , Karl W. Wyatt
IPC分类号： H01L21/56 , H01L23/31 , H01L23/48
CPC分类号： H01L23/3157 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01322 , H01L2924/09701
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).
摘要翻译：微电子组件（10）包括通过焊料凸块互连（32）安装到衬底（14）上的集成电路管芯（12）。模具（12）和衬底（14）被填充有聚合物密封剂（16）的间隙（30）间隔开。模具（12）包括模具周边（24）和面向背离衬底（14）的面（27）。聚合物加强件（18）设置在模具表面（27）上以保护模具（12）并且减少热引起的应力对模具（12）和焊料凸块互连（32）的影响。聚合物加强件（18）与模具周边（24）间隔开，以保持密封剂（16）的期望的外圆角几何形状。

8. 发明授权

US5229070A Low temperature-wetting tin-base solder paste 失效
标题翻译：低温润湿锡基锡膏
公开(公告)号：US5229070A
公开(公告)日：1993-07-20
申请号：US908109
申请日：1992-07-02
申请人： Cynthia M. Melton , Andrew Skipor , William M. Beckenbaugh
发明人： Cynthia M. Melton , Andrew Skipor , William M. Beckenbaugh
IPC分类号： B23K35/02 , B23K35/26 , H05K3/34
CPC分类号： B23K35/025 , B23K35/262 , H05K3/3484 , H05K2201/0272 , H05K3/3463
摘要： A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The second powder is formed of a tin alloy containing indium or bismuth and having a melting temperature less than the first powder. During soldering, the second powder melts during the early stages of the heating cycle to initiate wetting of the faying surfaces and promote dissolution of the first powder, thereby reducing the time and temperature required to form the solder connection.
摘要翻译：用于形成锡基焊料连接的低温润湿焊膏包括组成上不同的第一和第二焊料粉末的混合物。第一焊料主要由锡形成，优选至少为90重量％。第二粉末由含有铟或铋的锡合金形成，并且具有小于第一粉末的熔化温度。在焊接期间，第二粉末在加热循环的早期阶段熔化，引发熔融表面的润湿，促进第一粉末的溶解，从而减少形成焊料连接所需的时间和温度。

9. 发明申请

US20090059554A1 APPARATUS FOR SELECTIVELY BACKLIGHTING A MATERIAL 有权
标题翻译：选择材料选择的装置
公开(公告)号：US20090059554A1
公开(公告)日：2009-03-05
申请号：US11846360
申请日：2007-08-28
申请人： Andrew Skipor , Rick Latella , Steven Scheifers
发明人： Andrew Skipor , Rick Latella , Steven Scheifers
IPC分类号： F21V9/16 , F21V9/08 , G01D11/28
CPC分类号： G06F1/3218 , G02F1/1336 , G02F1/133617 , G02F2001/133614 , H01H13/83 , H01H2219/018 , H01H2219/052
摘要： A backlighting device (300, 400, 500, 600) emitting light having a first wavelength includes a first radiation emission device (302), e.g., an electroluminescent lamp, for emitting radiation having a second wavelength. A layer (306) of a plurality of photon emitting particles (308), e.g., free standing quantum dots or phosphorus particles, emits light having the first wavelength in response to the first radiation emission device (302), the first wavelength being larger than the second wavelength. A transparent material (116, 120, 122) overlies the layer of a plurality of photon emitting particles (308), wherein the light having a first wavelength passes through the transparent material (116, 120, 122). Optionally, a filter (402) may be placed over the layer (306) to block the radiation having a second wavelength, and a scattering layer (604) may be placed over the layer (306) to scatter wavelength other than the first wavelength.
摘要翻译：发射具有第一波长的光的背光装置（300,400,500,600）包括用于发射具有第二波长的辐射的第一辐射发射装置（302），例如电致发光灯。多个光子发射粒子（308）的层（306）（例如，独立量子点或磷粒子）响应于第一辐射发射装置（302）发射具有第一波长的光，第一波长大于第二波长。透明材料（116,120,122）覆盖多个光子发射颗粒（308）的层，其中具有第一波长的光通过透明材料（116,120,122）。可选地，过滤器（402）可以放置在层（306）上以阻挡具有第二波长的辐射，并且可以在层（306）上方布置散射层（604）以散射除第一波长之外的波长。

10. 发明申请

US20090054752A1 METHOD AND APPARATUS FOR PHOTOPLETHYSMOGRAPHIC SENSING 审中-公开
标题翻译：光电子感测方法与装置
公开(公告)号：US20090054752A1
公开(公告)日：2009-02-26
申请号：US11843187
申请日：2007-08-22
申请人： Krishna Jonnalagadda , Di-An Hong , Xun Luo , Francesca Schuler , Andrew Skipor
发明人： Krishna Jonnalagadda , Di-An Hong , Xun Luo , Francesca Schuler , Andrew Skipor
IPC分类号： A61B5/02
CPC分类号： A61B5/721 , A61B5/02433 , A61B5/11 , A61B5/14552 , A61B2562/0219 , A61B2562/164
摘要： A photoplethysmographic sensing system for determining a user's pulse rate includes a light emitting device (100, 201, 310, 500) including a first plurality of light emitting particles (108, 208, 317) having a first diameter and emitting light having a first wavelength. A detector (118, 218, 500) is positioned to receive light emitted from the plurality of light emitting particles (108, 208, 317) and a processing device (500) determines the pulse rate. The light emitting device (100, 201, 310, 500) and the detector (118, 218, 500) are disposed on a flexible polymeric material (102, 202, 334). The light emitting device (100, 201, 310, 500) may include a second plurality of light emitting particles (108, 208, 317) having a second diameter and emitting light having a second wavelength, wherein the processing device (500) determines the user's blood oxygen level. The light emitting particles (108, 208, 317) may comprise one of quantum dots, electroluminescent particles, or organic particles.
摘要翻译：一种用于确定用户脉搏率的光电容积摄影感测系统包括：发光器件（100,201,310,500），包括具有第一直径的第一多个发光粒子（108,208,317），并且发射具有第一波长。定位检测器（118,218,500）以接收从多个发光颗粒（108,208,317）发射的光，并且处理装置（500）确定脉率。发光器件（100,201,310,500）和检测器（118,218,500）设置在柔性聚合物材料（102,202,334）上。发光器件（100,201,310,500）可以包括具有第二直径并发射具有第二波长的光的第二多个发光颗粒（108,208,317），其中处理装置（500）确定用户的血氧水平。发光粒子（108,208,317）可以包括量子点，电致发光粒子或有机粒子之一。

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